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Issues
June 1991
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Foreword
Special Issue on Mechanics of Surface Mount Assemblies
J. Electron. Packag. June 1991, 113(2): 91.
doi: https://doi.org/10.1115/1.2905389
Topics:
Surface mount assemblies
Research Papers
Fatigue Properties of Microelectronics Solder Joints
J. Electron. Packag. June 1991, 113(2): 92–101.
doi: https://doi.org/10.1115/1.2905390
Topics:
Fatigue properties
,
Microelectronic devices
,
Solder joints
,
Shear (Mechanics)
,
Tin
,
Vehicles
,
Computers
,
Design
,
Engineering prototypes
,
Failure
Low Cycle Fatigue of Sn96 Solder With Reference to Eutectic Solder and a High Pb Solder
J. Electron. Packag. June 1991, 113(2): 102–108.
doi: https://doi.org/10.1115/1.2905374
Topics:
Low cycle fatigue
,
Solders
,
Tin
,
Melting point
,
Silver
,
Temperature
,
Ductility
,
Fatigue
,
Fatigue life
,
Soldering
Superplastic Creep of Eutectic Tin-Lead Solder Joints
J. Electron. Packag. June 1991, 113(2): 109–114.
doi: https://doi.org/10.1115/1.2905375
Topics:
Creep
,
Solder joints
,
Superplasticity
,
Stress
,
Cooling
,
Dislocations
,
Grain boundaries
,
Nitrogen
,
Recrystallization
,
Steady state
Understanding the Cyclic Mechanical Behavior of Lead/Tin Solder
J. Electron. Packag. June 1991, 113(2): 115–120.
doi: https://doi.org/10.1115/1.2905376
Topics:
Mechanical behavior
,
Solders
,
Creep
,
Stress
,
Temperature
,
Damage
,
Deformation
,
Storage
,
Testing
A Systems Approach to Solder Joint Fatigue in Spacecraft Electronic Packaging
J. Electron. Packag. June 1991, 113(2): 121–128.
doi: https://doi.org/10.1115/1.2905377
Topics:
Electronic packaging
,
Fatigue
,
Solder joints
,
Space vehicles
,
Cycles
,
Hardware
,
Failure
,
Flight
,
Solders
,
Design
Stiffness and Fatigue Study for Surface Mounted Module/Lead/Card Systems
J. Electron. Packag. June 1991, 113(2): 129–137.
doi: https://doi.org/10.1115/1.2905378
Topics:
Fatigue
,
Stiffness
,
Circuits
,
Stress
,
Bending (Stress)
,
Computation
,
Die cutting
,
Failure
,
Fatigue strength
,
Fatigue testing
Fatigue Analysis of a Ceramic Pin Grid Array Soldered to an Orthotropic Epoxy Substrate
J. Electron. Packag. June 1991, 113(2): 138–148.
doi: https://doi.org/10.1115/1.2905379
Topics:
Ceramics
,
Epoxy adhesives
,
Epoxy resins
,
Fatigue analysis
,
Copper
,
Solder joints
,
Thermal expansion
,
Fatigue
,
Reliability
,
Solders
Transient Thermal Stress Analysis of a Plated Through Hole Subjected to Wave Soldering
J. Electron. Packag. June 1991, 113(2): 149–155.
doi: https://doi.org/10.1115/1.2905380
Topics:
Thermal stresses
,
Transients (Dynamics)
,
Wave soldering
,
Stress
,
Temperature
,
Anisotropy
,
Damage
,
Fatigue life
,
Fracture (Materials)
,
Heat transfer
Thermal Analysis of Surface Mounted Leadless Chip Carriers
J. Electron. Packag. June 1991, 113(2): 156–163.
doi: https://doi.org/10.1115/1.2905381
Interfacial Shear and Peel Stresses in Multilayered Thin Stacks Subjected to Uniform Thermal Loading
J. Electron. Packag. June 1991, 113(2): 164–172.
doi: https://doi.org/10.1115/1.2905382
Asymptotic Expansions for the Thermal Stresses in Bonded Semi-Infinite Bimaterial Strips
J. Electron. Packag. June 1991, 113(2): 173–177.
doi: https://doi.org/10.1115/1.2905383
Topics:
Strips
,
Thermal stresses
,
Stress
,
Elasticity
,
Temperature
Automated Finite-Element Mesh Generation for Surface Mount Technology Solder Joints
J. Electron. Packag. June 1991, 113(2): 178–185.
doi: https://doi.org/10.1115/1.2905384
Topics:
Finite element analysis
,
Mesh generation
,
Solder joints
,
Surface mount technology
,
X-rays
,
Computer software
,
Failure
,
Inspection
,
Machinery
,
Modeling
Technical Briefs
The Solder Joint Fatigue Life Acceleration Factor
J. Electron. Packag. June 1991, 113(2): 186–190.
doi: https://doi.org/10.1115/1.2905385
Topics:
Fatigue life
,
Solder joints
A Creep/Relaxation Model Which Exhibits Chaotic Instability—Comparison With Solder Data
J. Electron. Packag. June 1991, 113(2): 190–193.
doi: https://doi.org/10.1115/1.2905386
Topics:
Aeroelasticity
,
Solders
,
Stress
,
Chaos
,
Grain size
,
Steady state
,
Creep
,
Dynamics (Mechanics)
,
Fatigue
,
Relaxation (Physics)
Fatigue Analysis of a Planarpak™ Surface Mount Component
J. Electron. Packag. June 1991, 113(2): 194–199.
doi: https://doi.org/10.1115/1.2905387
Book Reviews
Surface Mount Technology Materials, Processes, and Equipment
J. Electron. Packag. June 1991, 113(2): 200.
doi: https://doi.org/10.1115/1.2905388
Topics:
Surface mount technology
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