Topics: Fatigue properties , Microelectronic devices , Solder joints , Shear (Mechanics) , Tin , Vehicles , Computers , Design , Engineering prototypes , Failure

Low Cycle Fatigue of Sn96 Solder With Reference to Eutectic Solder and a High Pb Solder

H. D. Solomon

J. Electron. Packag. June 1991, 113(2): 102–108. doi: https://doi.org/10.1115/1.2905374

Abstract

View articletitled, Low Cycle Fatigue of Sn96 Solder With Reference to Eutectic Solder and a High Pb Solder

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Topics: Low cycle fatigue , Solders , Tin , Melting point , Silver , Temperature , Ductility , Fatigue , Fatigue life , Soldering

Superplastic Creep of Eutectic Tin-Lead Solder Joints

Z. Mei, J. W. Morris, Jr., M. C. Shine

J. Electron. Packag. June 1991, 113(2): 109–114. doi: https://doi.org/10.1115/1.2905375

Abstract

View articletitled, Superplastic Creep of Eutectic Tin-Lead Solder Joints

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Topics: Creep , Solder joints , Superplasticity , Stress , Cooling , Dislocations , Grain boundaries , Nitrogen , Recrystallization , Steady state

Understanding the Cyclic Mechanical Behavior of Lead/Tin Solder

J. K. Tien, B. C. Hendrix, A. I. Attarwala

J. Electron. Packag. June 1991, 113(2): 115–120. doi: https://doi.org/10.1115/1.2905376

Abstract

View articletitled, Understanding the Cyclic Mechanical Behavior of Lead/Tin Solder

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Topics: Mechanical behavior , Solders , Creep , Stress , Temperature , Damage , Deformation , Storage , Testing

A Systems Approach to Solder Joint Fatigue in Spacecraft Electronic Packaging

R. G. Ross, Jr.

J. Electron. Packag. June 1991, 113(2): 121–128. doi: https://doi.org/10.1115/1.2905377

Abstract

View articletitled, A Systems Approach to Solder Joint Fatigue in Spacecraft Electronic Packaging

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Topics: Electronic packaging , Fatigue , Solder joints , Space vehicles , Cycles , Hardware , Failure , Flight , Solders , Design

Stiffness and Fatigue Study for Surface Mounted Module/Lead/Card Systems

P. A. Engel, D. V. Caletka, M. R. Palmer

J. Electron. Packag. June 1991, 113(2): 129–137. doi: https://doi.org/10.1115/1.2905378

Abstract

View articletitled, Stiffness and Fatigue Study for Surface Mounted Module/Lead/Card Systems

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Topics: Fatigue , Stiffness , Circuits , Stress , Bending (Stress) , Computation , Die cutting , Failure , Fatigue strength , Fatigue testing

Fatigue Analysis of a Ceramic Pin Grid Array Soldered to an Orthotropic Epoxy Substrate

J. Lau, R. Subrahmanyan, D. Rice, S. Erasmus, C. Li

J. Electron. Packag. June 1991, 113(2): 138–148. doi: https://doi.org/10.1115/1.2905379

Abstract

View articletitled, Fatigue Analysis of a Ceramic Pin Grid Array Soldered to an Orthotropic Epoxy Substrate

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Topics: Ceramics , Epoxy adhesives , Epoxy resins , Fatigue analysis , Copper , Solder joints , Thermal expansion , Fatigue , Reliability , Solders

Transient Thermal Stress Analysis of a Plated Through Hole Subjected to Wave Soldering

D. Barker, M. Pecht, A. Dasgupta, S. Naqvi

J. Electron. Packag. June 1991, 113(2): 149–155. doi: https://doi.org/10.1115/1.2905380

Abstract

View articletitled, Transient Thermal Stress Analysis of a Plated Through Hole Subjected to Wave Soldering

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Topics: Thermal stresses , Transients (Dynamics) , Wave soldering , Stress , Temperature , Anisotropy , Damage , Fatigue life , Fracture (Materials) , Heat transfer

Thermal Analysis of Surface Mounted Leadless Chip Carriers

W. T. Cooley, A. Razani

J. Electron. Packag. June 1991, 113(2): 156–163. doi: https://doi.org/10.1115/1.2905381

Abstract

View articletitled, Thermal Analysis of Surface Mounted Leadless Chip Carriers

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Topics: Thermal analysis , Design , Heat transfer , Thermal characterization , Computers , Finite element analysis , Geometry , Heat transfer coefficients , Junctions , Microelectronic devices

Interfacial Shear and Peel Stresses in Multilayered Thin Stacks Subjected to Uniform Thermal Loading

Yi-Hsin Pao, Ellen Eisele

J. Electron. Packag. June 1991, 113(2): 164–172. doi: https://doi.org/10.1115/1.2905382

Abstract

View articletitled, Interfacial Shear and Peel Stresses in Multilayered Thin Stacks Subjected to Uniform Thermal Loading

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Topics: Shear (Mechanics) , Stress , Solder joints , Deflection , Differential equations , Dimensions , Materials properties , Shear stress , Temperature , Temperature controls

Asymptotic Expansions for the Thermal Stresses in Bonded Semi-Infinite Bimaterial Strips

Mikyoung Lee, I. Jasiuk

J. Electron. Packag. June 1991, 113(2): 173–177. doi: https://doi.org/10.1115/1.2905383

Abstract

View articletitled, Asymptotic Expansions for the Thermal Stresses in Bonded Semi-Infinite Bimaterial Strips

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Topics: Strips , Thermal stresses , Stress , Elasticity , Temperature

Automated Finite-Element Mesh Generation for Surface Mount Technology Solder Joints

D. T. Read, G. K. Lucey, Jr.

J. Electron. Packag. June 1991, 113(2): 178–185. doi: https://doi.org/10.1115/1.2905384

Abstract

View articletitled, Automated Finite-Element Mesh Generation for Surface Mount Technology Solder Joints

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Topics: Finite element analysis , Mesh generation , Solder joints , Surface mount technology , X-rays , Computer software , Failure , Inspection , Machinery , Modeling

Technical Briefs

The Solder Joint Fatigue Life Acceleration Factor

H. D. Solomon

J. Electron. Packag. June 1991, 113(2): 186–190. doi: https://doi.org/10.1115/1.2905385

View articletitled, The Solder Joint Fatigue Life Acceleration Factor

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Topics: Fatigue life , Solder joints

A Creep/Relaxation Model Which Exhibits Chaotic Instability—Comparison With Solder Data

S. J. Russell

J. Electron. Packag. June 1991, 113(2): 190–193. doi: https://doi.org/10.1115/1.2905386

Abstract

View articletitled, A Creep/Relaxation Model Which Exhibits Chaotic Instability—Comparison With Solder Data

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Topics: Aeroelasticity , Solders , Stress , Chaos , Grain size , Steady state , Creep , Dynamics (Mechanics) , Fatigue , Relaxation (Physics)

Fatigue Analysis of a Planarpak™ Surface Mount Component

I. Sharif, D. B. Barker, A. Dasgupta, M. G. Pecht

J. Electron. Packag. June 1991, 113(2): 194–199. doi: https://doi.org/10.1115/1.2905387

Abstract

View articletitled, Fatigue Analysis of a Planarpak™ Surface Mount Component

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Topics: Bonding , Fatigue analysis , Fatigue life , Finite element model , Printed circuit boards , Solders , Stress , Surface mount components , Surface mount devices , Thermal stresses

Book Reviews

Surface Mount Technology Materials, Processes, and Equipment

Carmen Capillo, Author, A. J. Rafanelli, Reviewer

J. Electron. Packag. June 1991, 113(2): 200. doi: https://doi.org/10.1115/1.2905388

View articletitled, <em>Surface Mount Technology Materials, Processes, and Equipment</em>

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Topics: Surface mount technology

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Foreword

Special Issue on Mechanics of Surface Mount Assemblies

Research Papers

Fatigue Properties of Microelectronics Solder Joints

Low Cycle Fatigue of Sn96 Solder With Reference to Eutectic Solder and a High Pb Solder

Superplastic Creep of Eutectic Tin-Lead Solder Joints

Understanding the Cyclic Mechanical Behavior of Lead/Tin Solder

A Systems Approach to Solder Joint Fatigue in Spacecraft Electronic Packaging

Stiffness and Fatigue Study for Surface Mounted Module/Lead/Card Systems

Fatigue Analysis of a Ceramic Pin Grid Array Soldered to an Orthotropic Epoxy Substrate

Transient Thermal Stress Analysis of a Plated Through Hole Subjected to Wave Soldering

Thermal Analysis of Surface Mounted Leadless Chip Carriers

Interfacial Shear and Peel Stresses in Multilayered Thin Stacks Subjected to Uniform Thermal Loading

Asymptotic Expansions for the Thermal Stresses in Bonded Semi-Infinite Bimaterial Strips

Automated Finite-Element Mesh Generation for Surface Mount Technology Solder Joints

Technical Briefs

The Solder Joint Fatigue Life Acceleration Factor

A Creep/Relaxation Model Which Exhibits Chaotic Instability—Comparison With Solder Data

Fatigue Analysis of a Planarpak™ Surface Mount Component

Book Reviews

Surface Mount Technology Materials, Processes, and Equipment

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