Erratum: “Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study” [ASME J. Electron. Packag., 2016, 138(2), p. 020804; DOI: 10.1115/1.4033069]

Siow, K. S.; Lin, Y. T.

doi:10.1115/1.4033633

K. S. Siow,

K. S. Siow

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Y. T. Lin

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J. Electron. Packag. Sep 2016, 138(3): 037001 (1 pages)

Paper No: EP-16-1057 https://doi.org/10.1115/1.4033633

Published Online: May 25, 2016

The corresponding author is K. S. Siow.

Erratum: “Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study” [ASME J. Electron. Packag., 2016, 138(2), p. 020804; DOI: 10.1115/1.4033069]

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Erratum: “Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study” [ASME J. Electron. Packag., 2016, 138(2), p. 020804; DOI: 10.1115/1.4033069]

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