Engineered porous structures are being used in many applications including aerospace, electronics, biomedical, and others. The objective of this paper is to study the effect of three-dimensional (3D)-printed porous microstructure on the dielectric characteristics for radio frequency (RF) antenna applications. In this study, a sandwich construction made of a porous acrylonitrile butadiene styrene (ABS) thermoplastic core between two solid face sheets has been investigated. The porosity of the core structure has been varied by changing the fill densities or percent solid volume fractions in the 3D printer. Three separate sets of samples with dimensions of 50 mm × 50 mm × 5 mm are created at three different machine preset fill densities each using LulzBot and Stratasys dimension 3D printers. The printed samples are examined using a 3D X-ray microscope to understand pore distribution within the core region and uniformity of solid volumes. The nondestructively acquired 3D microscopy images are then postprocessed to measure actual solid volume fractions within the samples. This measurement is important specifically for dimension-printed samples as the printer cannot be set for any specific fill density. The experimentally measured solid volume fractions are found to be different from the factory preset values for samples prepared using LulzBot printer. It is also observed that the resonant frequency for samples created using both the printers decreases with an increase in solid volume fraction, which is intuitively correct. The results clearly demonstrate the ability to control the dielectric properties of 3D-printed structures based on prescribed fill density.
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June 2017
Research-Article
Three-Dimensional Printed Dielectric Substrates for Radio Frequency Applications
Vana Snigdha Tummala,
Vana Snigdha Tummala
Department of Mechanical and Materials
Engineering,
Wright State University,
3640 Colonel Glenn Highway,
Dayton, OH 45435
Engineering,
Wright State University,
3640 Colonel Glenn Highway,
Dayton, OH 45435
Search for other works by this author on:
Ahsan Mian,
Ahsan Mian
Mem. ASME
Department of Mechanical and
Materials Engineering,
Wright State University,
3640 Colonel Glenn Highway,
Dayton, OH 45435
e-mail: ahsan.mian@wright.edu
Department of Mechanical and
Materials Engineering,
Wright State University,
3640 Colonel Glenn Highway,
Dayton, OH 45435
e-mail: ahsan.mian@wright.edu
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Nowrin H. Chamok,
Nowrin H. Chamok
Department of Electrical Engineering,
University of South Carolina,
Columbia, SC 29208
University of South Carolina,
Columbia, SC 29208
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Dhruva Poduval,
Dhruva Poduval
Department of Electrical Engineering,
University of South Carolina,
Columbia, SC 29208
University of South Carolina,
Columbia, SC 29208
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Mohammod Ali,
Mohammod Ali
Department of Electrical Engineering,
University of South Carolina,
Columbia, SC 29208
University of South Carolina,
Columbia, SC 29208
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Jallisa Clifford,
Jallisa Clifford
Department of Mechanical Engineering,
University of South Carolina,
Columbia, SC 29208
University of South Carolina,
Columbia, SC 29208
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Prasun Majumdar
Prasun Majumdar
Department of Mechanical Engineering,
University of South Carolina,
Columbia, SC 29208
University of South Carolina,
Columbia, SC 29208
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Vana Snigdha Tummala
Department of Mechanical and Materials
Engineering,
Wright State University,
3640 Colonel Glenn Highway,
Dayton, OH 45435
Engineering,
Wright State University,
3640 Colonel Glenn Highway,
Dayton, OH 45435
Ahsan Mian
Mem. ASME
Department of Mechanical and
Materials Engineering,
Wright State University,
3640 Colonel Glenn Highway,
Dayton, OH 45435
e-mail: ahsan.mian@wright.edu
Department of Mechanical and
Materials Engineering,
Wright State University,
3640 Colonel Glenn Highway,
Dayton, OH 45435
e-mail: ahsan.mian@wright.edu
Nowrin H. Chamok
Department of Electrical Engineering,
University of South Carolina,
Columbia, SC 29208
University of South Carolina,
Columbia, SC 29208
Dhruva Poduval
Department of Electrical Engineering,
University of South Carolina,
Columbia, SC 29208
University of South Carolina,
Columbia, SC 29208
Mohammod Ali
Department of Electrical Engineering,
University of South Carolina,
Columbia, SC 29208
University of South Carolina,
Columbia, SC 29208
Jallisa Clifford
Department of Mechanical Engineering,
University of South Carolina,
Columbia, SC 29208
University of South Carolina,
Columbia, SC 29208
Prasun Majumdar
Department of Mechanical Engineering,
University of South Carolina,
Columbia, SC 29208
University of South Carolina,
Columbia, SC 29208
1Corresponding author.
Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received December 13, 2016; final manuscript received March 20, 2017; published online June 12, 2017. Assoc. Editor: S. Ravi Annapragada.
J. Electron. Packag. Jun 2017, 139(2): 020904 (7 pages)
Published Online: June 12, 2017
Article history
Received:
December 13, 2016
Revised:
March 20, 2017
Citation
Snigdha Tummala, V., Mian, A., Chamok, N. H., Poduval, D., Ali, M., Clifford, J., and Majumdar, P. (June 12, 2017). "Three-Dimensional Printed Dielectric Substrates for Radio Frequency Applications." ASME. J. Electron. Packag. June 2017; 139(2): 020904. https://doi.org/10.1115/1.4036384
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