As integration levels increase in next generation electronics, high power density devices become more susceptible to hotspot formation, which often imposes a thermal limitation on performance. Flow boiling of R134a in two microgap heat sink configurations was investigated as a solution for hotspot thermal management: a bare microgap and inline micro-pin fin populated microgap, both with 10 μm gap height, were tested in terms of their ability to dissipate heat fluxes approaching 5 kW/cm2 at the heat source. Additional parameters investigated include mass fluxes up to 3000 kg/m2 s at inlet pressures up to 1.5 MPa and exit qualities approaching unity. The microgap testbeds investigated consist of a silicon layer which is heated from the bottom using resistive heaters and capped with glass to enable visual observation of two-phase flow regimes. Wall temperature, device thermal resistance, and pressure drop results are presented and mapped to the dominant flow regimes that were observed in the microgap.
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March 2017
Research-Article
Hotspot Thermal Management With Flow Boiling of Refrigerant in Ultrasmall Microgaps
Mohamed H. Nasr,
Mohamed H. Nasr
George W. Woodruff School
of Mechanical Engineering,
Georgia Institute of Technology,
Atlanta, GA 30332
of Mechanical Engineering,
Georgia Institute of Technology,
Atlanta, GA 30332
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Craig E. Green,
Craig E. Green
George W. Woodruff School
of Mechanical Engineering,
Georgia Institute of Technology,
Atlanta, GA 30332
of Mechanical Engineering,
Georgia Institute of Technology,
Atlanta, GA 30332
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Peter A. Kottke,
Peter A. Kottke
George W. Woodruff School
of Mechanical Engineering,
Georgia Institute of Technology,
Atlanta, GA 30332
of Mechanical Engineering,
Georgia Institute of Technology,
Atlanta, GA 30332
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Xuchen Zhang,
Xuchen Zhang
School of Electrical and Computer Engineering,
Georgia Institute of Technology,
Atlanta, GA 30332
Georgia Institute of Technology,
Atlanta, GA 30332
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Thomas E. Sarvey,
Thomas E. Sarvey
School of Electrical and Computer Engineering,
Georgia Institute of Technology,
Atlanta, GA 30332
Georgia Institute of Technology,
Atlanta, GA 30332
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Yogendra K. Joshi,
Yogendra K. Joshi
George W. Woodruff School
of Mechanical Engineering,
Georgia Institute of Technology,
Atlanta, GA 30332
of Mechanical Engineering,
Georgia Institute of Technology,
Atlanta, GA 30332
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Muhannad S. Bakir,
Muhannad S. Bakir
School of Electrical and Computer Engineering,
Georgia Institute of Technology,
Atlanta, GA 30332
Georgia Institute of Technology,
Atlanta, GA 30332
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Andrei G. Fedorov
Andrei G. Fedorov
George W. Woodruff School
of Mechanical Engineering,
Georgia Institute of Technology,
Atlanta, GA 30332
e-mail: AGF@gatech.edu
of Mechanical Engineering,
Georgia Institute of Technology,
Atlanta, GA 30332
e-mail: AGF@gatech.edu
Search for other works by this author on:
Mohamed H. Nasr
George W. Woodruff School
of Mechanical Engineering,
Georgia Institute of Technology,
Atlanta, GA 30332
of Mechanical Engineering,
Georgia Institute of Technology,
Atlanta, GA 30332
Craig E. Green
George W. Woodruff School
of Mechanical Engineering,
Georgia Institute of Technology,
Atlanta, GA 30332
of Mechanical Engineering,
Georgia Institute of Technology,
Atlanta, GA 30332
Peter A. Kottke
George W. Woodruff School
of Mechanical Engineering,
Georgia Institute of Technology,
Atlanta, GA 30332
of Mechanical Engineering,
Georgia Institute of Technology,
Atlanta, GA 30332
Xuchen Zhang
School of Electrical and Computer Engineering,
Georgia Institute of Technology,
Atlanta, GA 30332
Georgia Institute of Technology,
Atlanta, GA 30332
Thomas E. Sarvey
School of Electrical and Computer Engineering,
Georgia Institute of Technology,
Atlanta, GA 30332
Georgia Institute of Technology,
Atlanta, GA 30332
Yogendra K. Joshi
George W. Woodruff School
of Mechanical Engineering,
Georgia Institute of Technology,
Atlanta, GA 30332
of Mechanical Engineering,
Georgia Institute of Technology,
Atlanta, GA 30332
Muhannad S. Bakir
School of Electrical and Computer Engineering,
Georgia Institute of Technology,
Atlanta, GA 30332
Georgia Institute of Technology,
Atlanta, GA 30332
Andrei G. Fedorov
George W. Woodruff School
of Mechanical Engineering,
Georgia Institute of Technology,
Atlanta, GA 30332
e-mail: AGF@gatech.edu
of Mechanical Engineering,
Georgia Institute of Technology,
Atlanta, GA 30332
e-mail: AGF@gatech.edu
1Corresponding author.
Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received August 12, 2016; final manuscript received November 30, 2016; published online January 5, 2017. Assoc. Editor: M. Baris Dogruoz.
J. Electron. Packag. Mar 2017, 139(1): 011006 (8 pages)
Published Online: January 5, 2017
Article history
Received:
August 12, 2016
Revised:
November 30, 2016
Citation
Nasr, M. H., Green, C. E., Kottke, P. A., Zhang, X., Sarvey, T. E., Joshi, Y. K., Bakir, M. S., and Fedorov, A. G. (January 5, 2017). "Hotspot Thermal Management With Flow Boiling of Refrigerant in Ultrasmall Microgaps." ASME. J. Electron. Packag. March 2017; 139(1): 011006. https://doi.org/10.1115/1.4035387
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