Predicting the fatigue life of solder interconnections is a challenge due to the complex nonlinear behavior of solder alloys, the importance of the load history, and the wide variation in package constructions employed by the microelectronics industry. While material behavior can be captured by means of valid constitutive models, the empirical failure models in common use are strongly dependent on package construction due to the fact that they are derived from tests of solder joints with heterogeneous stress and microstructural variation. Despite this limitation, the empirical models have been used to identify reliable choices among package design alternatives. In this technical brief, some of the key limitations that the user of empirical models must be aware of are addressed. Physical arguments are proposed in order to justify the appropriate assumptions that may be made in the life model. Using data from two different sources in the literature, the constants in the empirical models are shown to be dependent on the solder joint geometry. Alternative fits to experimental data that reduce the dependence of the fits on solder joint geometry are proposed.
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e-mail: ganeshs@purdue.edu
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December 2009
Technical Briefs
Improved Solder Joint Fatigue Models Through Reduced Geometry Dependence of Empirical Fits
D. Bhate,
D. Bhate
School of Mechanical Engineering,
Purdue University
, West Lafayette, IN 47907-2088
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G. Subbarayan,
G. Subbarayan
School of Mechanical Engineering,
e-mail: ganeshs@purdue.edu
Purdue University
, West Lafayette, IN 47907-2088
Search for other works by this author on:
D. Edwards
D. Edwards
Texas Instruments
, Dallas, TX 75243
Search for other works by this author on:
D. Bhate
School of Mechanical Engineering,
Purdue University
, West Lafayette, IN 47907-2088
G. Subbarayan
School of Mechanical Engineering,
Purdue University
, West Lafayette, IN 47907-2088e-mail: ganeshs@purdue.edu
J. Zhao
Texas Instruments
, Dallas, TX 75243
V. Gupta
Texas Instruments
, Dallas, TX 75243
D. Edwards
Texas Instruments
, Dallas, TX 75243J. Electron. Packag. Dec 2009, 131(4): 044502 (3 pages)
Published Online: November 12, 2009
Article history
Received:
October 2, 2008
Revised:
June 14, 2009
Online:
November 12, 2009
Published:
November 12, 2009
Citation
Bhate, D., Subbarayan, G., Zhao, J., Gupta, V., and Edwards, D. (November 12, 2009). "Improved Solder Joint Fatigue Models Through Reduced Geometry Dependence of Empirical Fits." ASME. J. Electron. Packag. December 2009; 131(4): 044502. https://doi.org/10.1115/1.4000208
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