This study develops a novel glass cover chip (GCC) technique for the packaging of CMOS image sensors (CIS), in which the glass cover plate is attached directly to the chip using a nonconductive adhesive film. Taking the adhesive force between the glass plate and the chip as a performance indicator, a series of Taguchi trials are performed to establish the optimal GCC processing conditions. The experimental results confirm the feasibility of the proposed packaging technique and indicate a volume reduction of 59.47% compared with the traditional CIS package. Furthermore, the simulation results reveal that the heat dissipation efficiency of the proposed CIS package exceeds that of the traditional package by 245%.
Fabrication of Miniature CMOS Image Sensor Using Novel Glass Cover Chip Packaging Technique
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Wang, C., Ye, Y., and Lin, J. (November 12, 2009). "Fabrication of Miniature CMOS Image Sensor Using Novel Glass Cover Chip Packaging Technique." ASME. J. Electron. Packag. December 2009; 131(4): 041009. https://doi.org/10.1115/1.4000363
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