An exact analysis is presented for the stresses and deflections of circular plates (glass windows) elastically restrained along its edge in a photonic device’s housing subjected to the pressure and temperature loadings. Dimensionless curves and charts are also provided for engineering practice convenience. These charts show the interactions of the deflection, stress, temperature, pressure, linear spring constant, rotational spring constant, geometry of the glass windows, and the Young’s modulus, Poisson’s ratio, thermal coefficient of expansion, geometry, stress-optical coefficient, and birefringence of glass materials. The results presented herein should be useful for designing glass windows for shipping, storing, handling, functioning, and reliability.
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December 2003
Technical Papers
Thermal Stress and Deflection Analysis of a Glass Window (Circular Plate) Elastically Restrained Along its Edge in a Photonic Device
John H. Lau, Fellow ASME,
John H. Lau, Fellow ASME
Agilent Technologies, Inc., 5301 Stevens Creek Blvd., Santa Clara, CA 95052
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Steve Erasmus,
Steve Erasmus
Agilent Technologies, Inc., 5301 Stevens Creek Blvd., Santa Clara, CA 95052
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Yida Zou
Yida Zou
Cisco Systems, 170 West Tasman Drive, San Jose, CA 95134
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John H. Lau, Fellow ASME
Agilent Technologies, Inc., 5301 Stevens Creek Blvd., Santa Clara, CA 95052
Steve Erasmus
Agilent Technologies, Inc., 5301 Stevens Creek Blvd., Santa Clara, CA 95052
Yida Zou
Cisco Systems, 170 West Tasman Drive, San Jose, CA 95134
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received Feb. 2003. Associate Editor: E. Suhir.
J. Electron. Packag. Dec 2003, 125(4): 602-608 (7 pages)
Published Online: December 15, 2003
Article history
Received:
February 1, 2003
Online:
December 15, 2003
Citation
Lau , J. H., Erasmus, S., and Zou, Y. (December 15, 2003). "Thermal Stress and Deflection Analysis of a Glass Window (Circular Plate) Elastically Restrained Along its Edge in a Photonic Device ." ASME. J. Electron. Packag. December 2003; 125(4): 602–608. https://doi.org/10.1115/1.1604807
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