The creep and crack propagation behavior of SnAg3.5, SnAg4Cu0.5, and SnPb37 (as reference) was investigated on flip chip solder joints The test specimen consisted of two silicon chips (3.3×3.3 mm), bonded to each other by four flip chip joints (one on each corner). The steady-state creep rate was determined by reversible constant load shear tests. The stress exponents were for Sn96.5Ag3.5, for Sn95.5Ag4Cu0.5, and for Sn63Pb37. The apparent activation energies were for Sn96.5Ag3.5, for Sn95.5Ag4Cu0.5, and for Sn63Pb37. Microstructural analyses indicated that small precipitates of and intermetallics are responsible for the high values for n and Q that were found for the Sn96.5Ag3.5 and Sn95.5Ag4Cu0.5. The crack growth rate was determined by isothermal fatigue experiments on Sn63Pb37 and Sn95.5Ag4Cu0.5 flip chip solder joints. The flip chip solder joints were loaded with strain amplitudes ranging from Δε=0.3–4% and test frequencies at a temperature of
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December 2003
Technical Papers
Characterization of Lead-Free Solders in Flip Chip Joints
S. Wiese,
S. Wiese
Dresden University of Technology, Semiconductor & Microsystems Technology Laboratory, TU Dresden, IHM, D-01062 Dresden, Germany
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E. Meusel
E. Meusel
Dresden University of Technology, Semiconductor & Microsystems Technology Laboratory, TU Dresden, IHM, D-01062 Dresden, Germany
Search for other works by this author on:
S. Wiese
Dresden University of Technology, Semiconductor & Microsystems Technology Laboratory, TU Dresden, IHM, D-01062 Dresden, Germany
E. Meusel
Dresden University of Technology, Semiconductor & Microsystems Technology Laboratory, TU Dresden, IHM, D-01062 Dresden, Germany
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received November 2002. Associate Editor: L. Ernst.
J. Electron. Packag. Dec 2003, 125(4): 531-538 (8 pages)
Published Online: December 15, 2003
Article history
Received:
November 1, 2002
Online:
December 15, 2003
Citation
Wiese , S., and Meusel , E. (December 15, 2003). "Characterization of Lead-Free Solders in Flip Chip Joints ." ASME. J. Electron. Packag. December 2003; 125(4): 531–538. https://doi.org/10.1115/1.1604155
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