The absolute thermoelectric power of tin-lead eutectic solder is −5μV/°C. The voltage generated by a temperature gradient in solder may affect the performance of microelectronics.

Issue Section:
Technical Briefs
Keywords:
Solder, Tin Lead, Thermoelectric, Seebeck, Thermopower, tin alloys, lead alloys, soldering, integrated circuit packaging, Seebeck effect
Topics:
Solders
1.
Roberts
,
R. B.
,
1985
, “
Absolute Thermopower of Pb, Cu, and Pt
,”
CODATA Bull.
,
59
, pp.
47
–
49
.
Copyright © 2003
 by ASME
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