A numerical study of the effects of mechanical shock on Radio Frequency (RF) connectors is presented. The finite element method is used to analyze the mechanical shock responses of RF connectors. Three commonly used shock profiles, namely the rectangular, the triangular, and the half-sine profiles are considered. The effect of added mass as well as the direction of mechanical shock are also analyzed and discussed.
Issue Section:
Technical Papers
1.
Steinberg, D. S., 1973, Vibration Analysis of Electronic Equipment, Wiley, New York, NY.
2.
Suhir, E., and Lee, Y. C., 1990, “Thermal, Mechanical, and Environmental Durability Design Methodologies,” Electronic Materials Handbook, Vol. 1, Packaging, ASM International.
3.
Corg, V. K., and Smolik, F., 1989, Vibration Fatigue Life Evaluation of Electronic Equipment, ASME Winter Annual Meeting, San Francisco, CA.
4.
Allen
, A. M.
, and Bogy
, D. B.
, 1996
, “Effects of Shock on the Head-Disk Interface
,” IEEE Trans. Magn.
, 32
(5
), pp. 3717
–3719
.5.
Goyal
, S.
, Papadopoulos
, J. M.
, and Sullivan
, P. A.
, 1997
, “Shock Protection of Portable Electronic Products: Shock Response Spectrum, Damage Boundary Approach, and Beyond
,” Shock and Vibration
,4
(3
), pp. 169
–191
.6.
Chalmers, R. H., 1998, Shock and Vibration Handbook, McGraw-Hill, Chap. 26, New York, NY.
7.
Suhir
, E.
, 1992
, “Nonlinear Dynamic Response of a Printed Circuit Board to Shock loads Applied to Its Support Contour
,” ASME J. Electron. Packag.
, 114
, Dec.
, pp. 368
–377
.8.
Suhir
, E.
, 1996
, “Dynamic Response of a One-Degree-of-Freedom Linear System to a Shock Load During Drop Tests: Effect of Viscous Damping
,” IEEE Trans. Compon., Packag. Manuf. Technol., Part A
, 19
(3
), pp. 435
–440
.9.
Military Standard, 1982, Mil-Std-883D, Method 2002.3, Mechanical Shock, US Dept. of Defense.
10.
ABAQUS, 1998, Theory Manual Version 5.8, Hibbit, Karlsson & Sorensen, Inc., USA.
11.
ABAQUS, 1998, User’s Manual Version 5.8, Hibbit, Karlsson & Sorensen, Inc., USA.
12.
Newton, R. E., 1988, Shock and Vibration Handbook, McGraw-Hill, Chap. 31, New York, NY.
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