Various methodologies of wire sweep analysis have been introduced to get better prediction and matching the experimental measurements by many researchers. As more and more high pin-count packages (such as BGA, QFP) are used today, efficiency has become an important requirement besides accuracy for software used to predict wire sweep in IC packaging. This study introduces a newly developed wire sweep analysis solution (InPack), not only to meet the need of accuracy, but also enhance the efficiency for actual applications. It combines global flow analysis (C-MOLD) and structure analysis (ANSYS) to become a solution for general wire sweep analysis.
An Efficient Solution for Wire Sweep Analysis in IC Packaging
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received by the EPPD Division, April 12, 2002. Associate Editor: B. Michel.
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Su , J., Hwang, S., Su , F., and Chen, S. (March 14, 2003). "An Efficient Solution for Wire Sweep Analysis in IC Packaging ." ASME. J. Electron. Packag. March 2003; 125(1): 139–143. https://doi.org/10.1115/1.1535447
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