The purpose of the present study is to understand the interfacial deformation between pad and wire and the effect of the pad thickness, the pad hardness, and the tool shape on the interfacial deformation. The relationship between the bondability and the interfacial deformation (surface exposure to produce the clean surface) is summarized, because the bondability is largely affected by the interfacial deformation. A simple model of wire bonding is proposed for the numerical analysis. The model is based on the finite element method for rate sensitive materials and applicable to very large deformation processes. The numerical simulation made it possible to visualize the interfacial contacting process which occurs for several milli-seconds. It was suggested that the periphery bond is produced easily as the pad thickness decreases and the pad hardness increases. On the other hand, it was found that the thick pad and the groove tool can help the center bond formation. These results is explained by the distributions of the interfacial extension and the equivalent stress on the bonding interface. Also, the damage to the substrate (Si chip) is discussed, based on the numerical results.
Skip Nav Destination
Article navigation
March 2002
Technical Papers
Numerical Study of Wire Bonding—Analysis of Interfacial Deformation Between Wire and Pad
Yasuo Takahashi,
Yasuo Takahashi
Joining and Welding Research Institute, Osaka University, 11-1, Mihogaoka, Ibaraki, Osaka, 567-0047, Japan
Search for other works by this author on:
Michinobu Inoue
Michinobu Inoue
Graduate School of Osaka University, Osaka, Japan
Search for other works by this author on:
Yasuo Takahashi
Joining and Welding Research Institute, Osaka University, 11-1, Mihogaoka, Ibaraki, Osaka, 567-0047, Japan
Michinobu Inoue
Graduate School of Osaka University, Osaka, Japan
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received at ASME Headquarters March 13, 2001. Associate Editor: Y. C. Lee.
J. Electron. Packag. Mar 2002, 124(1): 27-36 (10 pages)
Published Online: March 13, 2001
Article history
Received:
March 13, 2001
Citation
Takahashi, Y., and Inoue, M. (March 13, 2001). "Numerical Study of Wire Bonding—Analysis of Interfacial Deformation Between Wire and Pad ." ASME. J. Electron. Packag. March 2002; 124(1): 27–36. https://doi.org/10.1115/1.1413765
Download citation file:
Get Email Alerts
Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability
J. Electron. Packag
Anand Model Constants of Sn-Ag-Cu Solders: What Do They Actually Mean?
J. Electron. Packag
Related Articles
Study of Interfacial Phenomena Affecting Thermosonic Wire Bonding in Microelectronics
J. Tribol (July,2003)
Measurement of Thermal Deformation of Interconnect Layers Using SIEM
J. Electron. Packag (September,2002)
Wiresweep Reduction via Direct Cavity Injection During Encapsulation
of Stacked Chip-Scale Packages
J. Electron. Packag (March,2008)
On-Line Quality Detection of Ultrasonic Wire Bonding via Refining Analysis of Electrical Signal From Ultrasonic Generator
J. Electron. Packag (December,2010)
Related Proceedings Papers
Related Chapters
Concluding Remarks and Future Work
Ultrasonic Welding of Lithium-Ion Batteries
Dismantling
Decommissioning Handbook
The Relation between Cold-Work-Induced Microstructural Evolution and the Postannealing Grain Structures in Zircaloy-4
Zirconium in the Nuclear Industry: 20th International Symposium