The air flow rate available for cooling of notebook computers is very limited. Thus, notebook computer manufacturers desire a “passive” cooling method. Heat pipes are typically used to transport the heat from the CPU to a forced convection, air-cooled condenser. This paper describes a passive, keyboard sized aluminum Integrated Plate Heat Pipe (IP-HP) that has been developed for notebook computers. Analysis was performed to estimate the several thermal resistances in the heat pipe, including the effect of the vapor pressure drop. The modified design using a heat spreader at the evaporator significantly reduces the heat pipe resistance. Further work was done to evaluate the thermal contact resistance at the IP-HP/CPU interface. Test results show that the IP-HP can reject 18 W while maintaining the CPU 65°C above ambient temperature.
Skip Nav Destination
Article navigation
September 2001
Technical Papers
Thermal Performance of Integrated Plate Heat Pipe With a Heat Spreader
Koichiro Take,
Koichiro Take
Research and Development Department, Showa Aluminum Corporation, Oyama, Tochigi, Japan
Search for other works by this author on:
Ralph L. Webb
Ralph L. Webb
Department of Mechanical Engineering, The Pennsylvania State University, University Park, PA 16802
Search for other works by this author on:
Koichiro Take
Research and Development Department, Showa Aluminum Corporation, Oyama, Tochigi, Japan
Ralph L. Webb
Department of Mechanical Engineering, The Pennsylvania State University, University Park, PA 16802
Contributed by the Electrical and Electronic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received by the EEPD April 2000. Associate Editor: R. Schmidt.
J. Electron. Packag. Sep 2001, 123(3): 189-195 (7 pages)
Published Online: April 1, 2000
Article history
Received:
April 1, 2000
Citation
Take, K., and Webb, R. L. (April 1, 2000). "Thermal Performance of Integrated Plate Heat Pipe With a Heat Spreader ." ASME. J. Electron. Packag. September 2001; 123(3): 189–195. https://doi.org/10.1115/1.1348010
Download citation file:
Get Email Alerts
Enhancing Mechanical Reliability of Silver-Sintered Joints With Copper Nanowires in High-Power Electronic Devices
J. Electron. Packag (December 2024)
Special Issue on InterPACK2023
J. Electron. Packag (December 2024)
Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation
J. Electron. Packag (December 2024)
Related Articles
A Simplified Conduction Based Modeling Scheme for Design Sensitivity Study of Thermal Solution Utilizing Heat Pipe and Vapor Chamber Technology
J. Electron. Packag (September,2003)
Effect of Working Fluid, Orientation, and Cooling Mode on Thermal Performance of Miniature Flat Heat Pipe
J. Thermal Sci. Eng. Appl (September,2023)
Multiple Fan-Heat Sink Cooling System With Enhanced Evaporator Base: Design, Modeling, and Experiment
J. Electron. Packag (September,2009)
Vapor Chamber Acting as a Heat Spreader for Power Module Cooling
J. Thermal Sci. Eng. Appl (June,2009)
Related Proceedings Papers
Related Chapters
Introduction
Essentials of Electronic Packaging: A Multidisciplinary Approach
Group Decision Analysis for the Product Selection Problem of Notebook Computers Using Fuzzy AHP
International Conference on Computer and Computer Intelligence (ICCCI 2011)
The Special Characteristics of Closed-Cycle Gas Turbines
Closed-Cycle Gas Turbines: Operating Experience and Future Potential