Optimization of pin-fin heat sinks for impingement cooling of electronic components was studied. The study was based on a semi-empirical zonal model for determining thermal resistance as well as pressure drop. To test the validity of the model’s predictions, experiments and flow visualization were performed. The experimental results validated the model. The model enables cost-effective designs to be calculated in order to optimize pin-fin heat sinks. These calculations took into consideration 16 design parameters including pin diameter, minimum spacing between pins, and fin height. For the particular blower considered in our study, the optimum pin diameter was found being 0.35 mm. And the characteristics and limitations of air-cooling for such applications were investigated under various conditions. [S1043-7398(00)01704-7]
Optimization of Pin-Fin Heat Sinks for Impingement Cooling of Electronic Packages
Contributed by the Electrical and Electronic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received by the EEPD August 3, 1998; revised manuscript received February 15, 2000. Associate Technical Editor: Y. C. Lee.
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Kondo , Y., Matsushima , H., and Komatsu, T. (February 15, 2000). "Optimization of Pin-Fin Heat Sinks for Impingement Cooling of Electronic Packages ." ASME. J. Electron. Packag. September 2000; 122(3): 240–246. https://doi.org/10.1115/1.1289761
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