A flip chip component is a silicon chip mounted to a substrate with the active area facing the substrate. This paper presents the results of an investigation into the relationship between a number of important material properties and geometric parameters on the thermal-mechanical fatigue reliability of a standard flip chip design and a flip chip design with the use of microvias. Computer modeling has been used to analyze the mechanical conditions of flip chips under cyclic thermal loading where the Coffin-Manson empirical relationship has been used to predict the life time of the solder interconnects. The material properties and geometry parameters that have been investigated are the Young’s modulus, the coefficient of thermal expansion (CTE) of the underfill, the out-of-plane CTE of the substrate, the thickness of the substrate, and the standoff height. When these parameters vary, the predicted life-times are calculated and some of the features of the results are explained. By comparing the predicted lifetimes of the two designs and the strain conditions under thermal loading, the local CTE mismatch has been found to be one of most important factors in defining the reliability of flip chips with microvias. [S1043-7398(00)01203-2]
Reliability Analysis of Flip Chip Designs Via Computer Simulation
Contributed by the Electrical and Electronic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received by the EEPD August 3, 1999; revised manuscript received January 17, 2000. Associate Technical Editor: B. Courtois.
Lu, H., Bailey , C., and Cross, M. (January 17, 2000). "Reliability Analysis of Flip Chip Designs Via Computer Simulation ." ASME. J. Electron. Packag. September 2000; 122(3): 214–219. https://doi.org/10.1115/1.1286122
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