The reduction of interfacial thermal stresses is estimated for a bimaterial strip tapered at the edges. Simple equations for this stress reduction are proposed.
Issue Section:
Technical Brief
1.
Chen
W. T.
Nelson
C. W.
1979
, “Thermal Stress in Bonded Joints
,” IBM J. Res. Develop.
, 23
(2
), pp. 179
–188
.2.
Goland, B. M., and Reissner, E., 1944, “The Stresses in Cemented Joints,” ASME J. Appl. Mech., Trans., pp. 17–27.
3.
Grimado
P. B.
1978
, “Interlaminar Thermoelastic Stresses in Layered Bars
,” Journal of Thermal Stresses
, 1
, pp. 75
–86
.4.
Lee, L., and Mirman, B. A., 1990, “Bending Stiffness of a Multilayer Structure,” Proc. of Int. Electronics Packaging Conference, IEPS, Marborough, MA.
5.
Mirman, B. A., and Knecht, S., 1990, “Creep Strains in an Elongated Bond Layer,” IEEE Trans. on Comp. Hybrids Manuf Tech., Vol. 13, No. 4.
6.
Rzhanitsyn, A. R., 1939, “Rabota svyazey v sostavnyh sterzhnyah (Interfacial Stress/Strain State in Composites),” Sbornik trudov ISI imeni Kuybysheva, No. 2, pp. 150–194.
7.
Suhir, E., 1986, “Calculated Thermally Induced Stresses in Adhesively Bonded and Soldered Assemblies,” Int. Symp. Microelectr., pp. 383–392.
8.
Wild, R. N., October 1975, “Some Fatigue Properties of Solders and Solder Joints,” INTERNEPCON, Brighton, England.
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