The bending bilayer technique is commonly employed to provide an empirical assessment of the often significant thermal stresses that develop in thin polymer films used in microelectronic packaging. Polymers are known to exhibit time-dependent (viscoelastic) behavior that is greatly accelerated at elevated temperatures. The solution for a bilayer beam with a linear viscoelastic, thermorheologically simple film bonded to a linear elastic substrate is developed. A wide variety of assumed viscoelastic material properties are considered along with properties for several specific electronic polymers in order to illustrate the general effects of polymer viscoelasticity upon the thermal stress in a polymer film. Practical methods for deducing the relative significance of polymer viscoelasticity from empirical bending bilayer results are emphasized. Comparisons with experimental data for two polymides and one epoxy molding compound are also provided.
Skip Nav Destination
Article navigation
September 1994
Research Papers
Influence of Polymer Viscoelasticity on a Bending Bilayer
B. D. Harper
B. D. Harper
Department of Engineering Mechanics, The Ohio State University, Colombus, OH 43210
Search for other works by this author on:
B. D. Harper
Department of Engineering Mechanics, The Ohio State University, Colombus, OH 43210
J. Electron. Packag. Sep 1994, 116(3): 191-197 (7 pages)
Published Online: September 1, 1994
Article history
Received:
April 26, 1993
Revised:
February 3, 1994
Online:
April 28, 2008
Citation
Harper, B. D. (September 1, 1994). "Influence of Polymer Viscoelasticity on a Bending Bilayer." ASME. J. Electron. Packag. September 1994; 116(3): 191–197. https://doi.org/10.1115/1.2905685
Download citation file:
Get Email Alerts
Cited By
Enhancing Mechanical Reliability of Silver-Sintered Joints With Copper Nanowires in High-Power Electronic Devices
J. Electron. Packag (December 2024)
Special Issue on InterPACK2023
J. Electron. Packag (December 2024)
Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation
J. Electron. Packag (December 2024)
Related Articles
Thermoelastic Behavior of Filled Molding Compounds: Composite Mechanics Approach
J. Electron. Packag (September,2001)
Packaging Induced Die Stresses—Effect of Chip Anisotropy and Time-Dependent Behavior of a Molding Compound
J. Electron. Packag (December,2003)
Stochastic Characterization and Models to Predict Performance Uncertainty in Photonic Packages
J. Electron. Packag (September,2007)
Studies in Direct Tooling Using Stereolithography
J. Manuf. Sci. Eng (May,2000)
Related Proceedings Papers
Related Chapters
Introductory Survey
Introduction to Plastics Engineering
Diamond Is a GAL's Best Friend
Hot Air Rises and Heat Sinks: Everything You Know about Cooling Electronics Is Wrong
Structure, Properties, and Applications of Plastics
Introduction to Plastics Engineering