An exact analysis is presented for the creep deformation of a thin-walled circular solder cylinder under the actions of bending and twisting moments. Dimensionless interaction curves and charts which relate the variables, interconnect geometry, solder material properties, bending moment, twisting moment, curvature rate, and twist rate are also provided for engineering practice convenience.
Issue Section:
Technical Briefs
This content is only available via PDF.
Copyright © 1994
by The American Society of Mechanical Engineers
You do not currently have access to this content.
