Skip Nav Destination
Just Accepted Manuscript
Technical Briefs January 23, 2023
A Comparison of Biaxial Bending Strength of Thin Silicon Dies in the BoR and PoEF Tests
J. Electron. Packag.
doi: https://doi.org/10.1115/1.4056717
Research-Article January 9, 2023
Investigation of Electromechanical Reliability and Radio Frequency Performance of a Highly Stretchable Liquid Metal Conductor for Wearable Electronics
Behnam Garakani, Udara S. Somarathna, Ashraf Umar, Gurvinder Singh Khinda, Mohamed Youssef Abdelatty
...
J. Electron. Packag.
doi: https://doi.org/10.1115/1.4056640
Email alerts
RSS Feeds
Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled Approaches
J. Electron. Packag (September 2023)
Mandrel Bend Test of Screen-Printed Silver Conductors
J. Electron. Packag (September 2023)
Special Section on InterPACK2021
J. Electron. Packag (March 2023)
