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Research-Article November 27, 2024
Wideband Equivalent Circuit Modeling and Parameter Extraction Method for Through Via in Ceramic Package Substrate
J. Electron. Packag.
doi: https://doi.org/10.1115/1.4067269
Research-Article November 27, 2024
Electrochemical Linked to Mechanical Simulation for an Assessment of State-Of-Health of Thin-flexible Li-ion Batteries on Dynamic Flexing and Calendar Aging
J. Electron. Packag.
doi: https://doi.org/10.1115/1.4067266
Research-Article November 20, 2024
Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability
J. Electron. Packag.
doi: https://doi.org/10.1115/1.4067189
Research-Article November 13, 2024
Understanding the Impact of Data Center Liquid Cooling on Energy and Performance of Machine Learning and Artificial Intelligence Workloads
J. Electron. Packag.
doi: https://doi.org/10.1115/1.4067136
Research-Article November 13, 2024
Anand Model Constants of Sn-Ag-Cu Solders: What Do They Actually Mean?
J. Electron. Packag.
doi: https://doi.org/10.1115/1.4067137
Research-Article July 20, 2024
Transient Liquid Phase Bond Acceleration Using Copper Nanowires
J. Electron. Packag.
doi: https://doi.org/10.1115/1.4066042
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Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability
J. Electron. Packag
Anand Model Constants of Sn-Ag-Cu Solders: What Do They Actually Mean?
J. Electron. Packag
