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Journal Articles

Thermal Management of Electronic Equipment: Research Needs in the Mid-1990s and Beyond

Wataru Nakayama
Journal: Applied Mechanics Reviews
Article Type: Review Articles
Appl. Mech. Rev. October 1996, 49(10S): S167–S174.
DOI: https://doi.org/10.1115/1.3101968
Published Online: October 1, 1996
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Topics: Electronic equipment, Thermal management, Heat transfer, Hardware, Packaging, Stress, Complex systems, Design, Modeling, Thermomechanics
Journal Articles

Ceramics for Transportation Engines—Siren or Solution

Phillip S. Myers
Journal: Applied Mechanics Reviews
Article Type: Review Articles
Appl. Mech. Rev. March 1989, 42(3): 53–69.
DOI: https://doi.org/10.1115/1.3152421
Published Online: March 1, 1989
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Topics: Ceramics, Engines, Transportation systems, Corporate average fuel economy, Fuel efficiency, Cylinders, Friction, Fuels, Heat, Inertia (Mechanics)
Journal Articles

Thermal Management of Electronic Equipment: A Review of Technology and Research Topics

Wataru Nakayama
Journal: Applied Mechanics Reviews
Article Type: Review Articles
Appl. Mech. Rev. December 1986, 39(12): 1847–1868.
DOI: https://doi.org/10.1115/1.3149515
Published Online: December 1, 1986
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Topics: Electronic equipment, Thermal management, Cooling, Design, Heat transfer, Bonding, Databases, Flip-chip, Forced convection, Heat sinks