3D-IC is getting increasingly attractive, as it improves speed and frequency, and reduces power consumption, noise and latency. However, three dimension (3D) integration technologies bring a new serious challenge to chip thermal management with the power density increased exponentially. Interlayer microchannel liquid cooling is thought as a promising and scalable solution for cooling high heat flux 3D-IC. In this paper, firstly channel number, channel width and height parameters of rectangular channel are optimized by the method of multi-objective parameter optimization under given overall size of 5mm in length and 5mm in width. The results show the total thermal resistances can reach very small under individual constraint condition of volume flow rates, but the pressure drop is too larger to accept. The minimum thermal resistance structure can be got by multi-objective optimization at various constraint conditions. It is found that the channel height and width increase with increasing of flow rates at pumping power less than 0.1W and pressure drop less than 20kPa. Secondly, the zigzag channels are designed on the basis of the optimized rectangular channel structure. The expansion and contraction ratio as an important parameter is optimized by numerical simulation. The thermal enhancement factor and Nusselt number measure the comprehensive performances of heat transfer. The results show heat transfer characteristic is enhanced with the decreasing of expansion and contraction ratio. Besides, the maximum junction temperature and maximum temperature difference are also reduced. 3D-IC with wave channel of β=3/7 is more promising for interlayer cooling.

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