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Keywords: thermal packagingClose
Sevket U. Yuruker, Raphael K. Mandel, Patrick McCluskey, Michael M. Ohadi, Shiladri Chakraborty, Yongwan Park, He Yun, Alireza Khaligh, Lauren Boteler, Miguel Hinojosa
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A026, October 7–9, 2019
Paper No: IPACK2019-6559
... but thermally conductive 3D printed coolers. The overall circuit diagram, assembly configuration and flow routing within the system are demonstrated. The advantages of the proposed design over commercially available modules are discussed in detail. power electronics thermal management thermal packaging...