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Keywords: microstructure
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Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A014, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2677
... and percentage elongation of the underfills. After uniaxial tensile tests, Optical Microscope, SEM and EDS are applied to study the microstructure behaviors of the cross-section area of the underfills. The experimental results are compared before and after aging tests, including pristine, 30 days, 60 days...
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A020, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2695
... Abstract Microstructural evolution occurs in lead free Sn-Ag-Cu (SAC) solder joints exposed to isothermal aging. Such changes lead to degradations in the mechanical properties and creep behavior of the solder, and can result in dramatic reductions in the board level reliability of lead-free...
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A017, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2692
... circuit boards to create a sandwiched structural sample. The samples were then polished to expose the solder joints. A polarized light microscope was utilized to capture the images of the joints before and after the mechanical cycling and analyzed to observe any changes in the microstructure in the form...
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A006, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6560
.... Moreover, the microstructure and constitutive properties of conventional lead free solder joints in electronic assemblies such as SAC305 changes when exposed to isothermal aging. These changes consequently reduce the reliability of lead free electronic assemblies significantly due to aging. In this study...
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A011, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6571
... Abstract Aging effects are common in lead free solder joints within electronic assemblies that are exposed to isothermal environments for extended periods. Such exposures lead to evolution of the solder microstructure, which results in changes in the mechanical properties and creep behavior...
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1805-1810, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73148
... rupture time of the Sn-3.5Ag0.5Cu-Ni-Ge solder is about three times as long as that of the Sn-3.0Ag-0.5Cu solder. The microstructure of these solder alloys show that the addition of Ni was found to refine the effective grain size and provide a fine and uniform distribution of Ag 3 Sn in the solidified...
Proceedings Papers

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 799-808, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35150
.... +358 3 3115 3390 Fax. +358 3 3115 3394 Email eero.ristolainen@tut.fi Institute of Materials Science Tampere University of Technology P.O. Box 589 FIN-33101 Tampere, Finland Tel. +358 3 365 3566 Fax. +358 3 365 2330 Email toivo.lepisto@tut.fi KEYWORDS Lead-free, PBGA, reliability, microstructure...