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Keywords: microstructure
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Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A014, October 27–29, 2020
Paper No: IPACK2020-2677
... and percentage elongation of the underfills. After uniaxial tensile tests, Optical Microscope, SEM and EDS are applied to study the microstructure behaviors of the cross-section area of the underfills. The experimental results are compared before and after aging tests, including pristine, 30 days, 60 days...
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A020, October 27–29, 2020
Paper No: IPACK2020-2695
...: +1-334-844-3332 FAX: +1-334-844-3124 E-Mail: jsuhling@auburn.edu ABSTRACT Microstructural evolution occurs in lead free Sn-Ag-Cu (SAC) solder joints exposed to isothermal aging. Such changes lead to degradations in the mechanical properties and creep behavior of the solder, and can result in dramatic...
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A017, October 27–29, 2020
Paper No: IPACK2020-2692
... in the microstructure in the form of recrystallization of the tin grains. KEYWORDS Lead-Free Solder, SAC alloy, Mechanical Cycling, Aging, Optical Microscopy, Recrystallization, Microstructure INTRODUCTION The increased use of electronics around us have demanded an increase in reliability of electronic packages...
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A011, October 7–9, 2019
Paper No: IPACK2019-6571
...Abstract Abstract Aging effects are common in lead free solder joints within electronic assemblies that are exposed to isothermal environments for extended periods. Such exposures lead to evolution of the solder microstructure, which results in changes in the mechanical properties and creep...
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A006, October 7–9, 2019
Paper No: IPACK2019-6560
...EVOLUTION OF THE MICROSTRUCTURE OF LEAD FREE SOLDERS SUBJECTED TO BOTH AGING AND CYCLIC LOADING Md Mahmudur R. Chowdhury, Mohd Aminul Hoque, Jeffrey C. Suhling, Sa d Hamasha, Pradeep Lall Center for Advanced Vehicle and Extreme Environment Electronics (CAVE3) Auburn University Auburn, AL 36849...
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1805-1810, July 17–22, 2005
Paper No: IPACK2005-73148
... rupture time of the Sn-3.5Ag0.5Cu-Ni-Ge solder is about three times as long as that of the Sn-3.0Ag-0.5Cu solder. The microstructure of these solder alloys show that the addition of Ni was found to refine the effective grain size and provide a fine and uniform distribution of Ag 3 Sn in the solidified...
Proceedings Papers

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 799-808, July 6–11, 2003
Paper No: IPACK2003-35150
..., and tin-lead solder paste and tin-lead-silver PBGA components. Lead-free and tin-lead solders were composed of eutectic tin-silver-copper and tin-lead, respectively. In addition, the study also presents the effect of multiple reflow times. The study focuses on the microstructures of different assemblies...