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Keywords: microstructural evolution
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Proceedings Papers

Time-Lapse Imagery and Quantitative Analysis of Microstructural Evolution of SAC305 BGA Joints During Extreme High Temperature Aging

KM Rafidh Hassan, Mohammad S. Alam, Jing Wu, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A016, October 27–29, 2020
Paper No: IPACK2020-2691
DOI: https://doi.org/10.1115/IPACK2020-2691
... TIME-LAPSE IMAGERY AND QUANTITATIVE ANALYSIS OF MICROSTRUCTURAL EVOLUTION OF SAC305 BGA JOINTS DURING EXTREME HIGH TEMPERATURE AGING KM Rafidh Hassan, Mohammad S. Alam, Jing Wu, Jeffrey C. Suhling, Pradeep Lall Center for Advanced Vehicle and Extreme Environment Electronics (CAVE3) Auburn...
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Topics: Ball-Grid-Array packaging, High temperature, Lead-free solders, Particulate matter
Proceedings Papers

Investigation of the Effects of High Temperature Aging on Mechanical Behavior and Microstructural Changes in Lead Free Solders

Jing Wu, Mohammad S. Alam, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A011, October 7–9, 2019
Paper No: IPACK2019-6571
DOI: https://doi.org/10.1115/IPACK2019-6571
... behavior of the solder joints. In our recent investigations, we have been utilizing Scanning Electron Microscopy (SEM) to better understand aging induced degradations. The microstructural evolutions were observed in SAC305 and SAC_Q (SAC+Bi) alloys exposed to isothermal conditions at T = 125 °C for several...
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Topics: Intermetallic compounds, Lead-free solders, Mechanical behavior, Temperature effects