1-2 of 2
Keywords: microstructural evolution
Close
Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A016, October 27–29, 2020
Paper No: IPACK2020-2691
... TIME-LAPSE IMAGERY AND QUANTITATIVE ANALYSIS OF MICROSTRUCTURAL EVOLUTION OF SAC305 BGA JOINTS DURING EXTREME HIGH TEMPERATURE AGING KM Rafidh Hassan, Mohammad S. Alam, Jing Wu, Jeffrey C. Suhling, Pradeep Lall Center for Advanced Vehicle and Extreme Environment Electronics (CAVE3) Auburn...
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A011, October 7–9, 2019
Paper No: IPACK2019-6571
... behavior of the solder joints. In our recent investigations, we have been utilizing Scanning Electron Microscopy (SEM) to better understand aging induced degradations. The microstructural evolutions were observed in SAC305 and SAC_Q (SAC+Bi) alloys exposed to isothermal conditions at T = 125 °C for several...