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Keywords: micro viaClose
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A005, October 7–9, 2019
Paper No: IPACK2019-6574
... modeling approach is presented to predict the attributes such as micro-via diameter before starting the print process, enabling us to pre-adjust the dimensions in CAD for the desired output. Process parameters to obtain a fine print with good electrical properties and better dimensional accuracy...