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Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 357-365, July 6–8, 2011
Paper No: IPACK2011-52262
... 15 02 2012 THE MICROELECTRONICS COOLING IMPACT AND COMPARISON OF 2D AND 3D UNSTEADY EFFECTS OF A PAIR OF OPPOSED CONFINED ANGLED IMPINGING AIR JETS Victor Adrian Chiriac Qualcomm Inc. Advanced Technology 5775 Morehouse Drive San Diego, CA 92121-1714 email@example.com Jorge Luis...
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 577-589, July 17–22, 2005
Paper No: IPACK2005-73407
... 03 04 2009 Jet impingement has been an attractive cooling option in a number of industries over the past few decades. Over the past fifteen years, jet impingement has been explored as a cooling option in microelectronics. Recently, interest has also been expressed by the automotive...
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 461-467, July 17–22, 2005
Paper No: IPACK2005-73310
... 03 04 2009 A numerical investigation was performed at two Reynolds numbers to analyze the flow-field and heat transfer characteristics for a pair of laminar jets impinging on opposite walls in a channel. The present study is a continuation of the authors’ earlier work  in which...