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Keywords: high frequency
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Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A026, October 7–9, 2019
Paper No: IPACK2019-6559
... reduction and considerably lighter weight at greater power levels than commercially available converter modules. We introduce an improved placement of high power/high frequency MOSFET switches on the board that enables double-sided cooling, where the dissipated heat is removed from both sides...