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Keywords: high efficiencyClose
Sevket U. Yuruker, Raphael K. Mandel, Patrick McCluskey, Michael M. Ohadi, Shiladri Chakraborty, Yongwan Park, He Yun, Alireza Khaligh, Lauren Boteler, Miguel Hinojosa
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A026, October 7–9, 2019
Paper No: IPACK2019-6559
... management thermal packaging packaging density high efficiency high frequency ADVANCED PACKAGING AND THERMAL MANAGEMENT OF HIGH-POWER DC-DC CONVERTERS Sevket U. Yuruker1, Raphael K. Mandel1, Patrick McCluskey1, Michael M. Ohadi1, Shiladri Chakraborty2, Yongwan Park2, He Yun1, Alireza Khaligh2, Lauren...
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 2133-2138, July 17–22, 2005
Paper No: IPACK2005-73173
... 03 04 2009 Fabrication development of high efficiency quantum well (QW) thermoelectric continues with the P-type B 4 C/B 9 C and N-type Si/SiGe films. Si/SiC is being developed to replace Si/SiGe for higher temperature operation. Both isothermal and gradient life testing are underway...