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Keywords: dielectric
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Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A008, October 26–28, 2021
Paper No: IPACK2021-74086
... effect of the underlying electronics. Using z-axis interconnections with dielectric materials, which may allow or prevent the connection between two layers, is one method of reaching several layers of circuits. In this paper, a working multilayer circuitry test vehicle is designed and additively printed...
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A003, October 27–29, 2020
Paper No: IPACK2020-2664
... variability with Aerosol- jet print process needed for high volume scale-up. Conductive interconnects have been printed using the ultrasonic atomizer and the interlayer dielectrics have been printed using the pneumatic atomizer. The effect of thermal sintering on the performance of the printed circuits has...
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A004, October 27–29, 2020
Paper No: IPACK2020-2680
... additively printed substrate designs and effect of multiple vias has been compared to assess process consistency. Keywords: Aerosol Jet, multilayer, micro-via, dielectric, sintering, printed electronics. NOMENCLATURE AJP Aerosol Jet Printing UA Ultrasonic Atomization PA Pneumatic Atomization cP Centipoise...
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A005, October 7–9, 2019
Paper No: IPACK2019-6574
... are developed. Importance of pre-cleaning the substrate is discussed, in addition to the printing process efficiency gauged as a function of process capability index and process capability ratio. aerosol jet multi-layer micro via dielectric process capability ratio and index regression model...
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A007, October 7–9, 2019
Paper No: IPACK2019-6463
... in the information technology (IT) load. two-phase cooling dielectric rack level cooling fluid distribution HFE 7000 heat exchanger load control AN EXPERIMENTAL INVESTIGATION ON THE FLUID DISTRIBUTION IN A TWO-PHASE COOLED RACK UNDER STEADY AND TRANSIENT IT LOAD Sadegh Khalili 1, Srikanth Rangarajan...