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Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 469-475, July 17–22, 2005
Paper No: IPACK2005-73313
... processors, are investigated for high performance computers. Temperature distributions of the CPU processors, effects of heat spreading materials (HIS) and impacts of thermal interface materials (TIM) on the cooling and packaging designs are also analysed and illustrated. This paper was also originally...