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Keywords: aging
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Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A016, October 26–28, 2021
Paper No: IPACK2021-74044
... causes the Isothermal aging at high temperature extreme (no cycle). After mechanical properties reduction of solder joints due to thermal each thermal cycling exposure, mechanical properties evolution aging phenomena which eventually leads to the change in of both solder bars and solder balls were...
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A017, October 27–29, 2020
Paper No: IPACK2020-2692
... cycles. In this study, the authors have tried to determine whether the mechanical shear cycling of aged and non-aged samples of SAC305 lead free solder joints undergo a recrystallization phase before its ultimate failure. Arrays (3x3) of SAC305 solder joints of roughly 750 m in diameter were reflowed...
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A011, October 7–9, 2019
Paper No: IPACK2019-6571
...Abstract Abstract Aging effects are common in lead free solder joints within electronic assemblies that are exposed to isothermal environments for extended periods. Such exposures lead to evolution of the solder microstructure, which results in changes in the mechanical properties and creep...
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A006, October 7–9, 2019
Paper No: IPACK2019-6560
...EVOLUTION OF THE MICROSTRUCTURE OF LEAD FREE SOLDERS SUBJECTED TO BOTH AGING AND CYCLIC LOADING Md Mahmudur R. Chowdhury, Mohd Aminul Hoque, Jeffrey C. Suhling, Sa d Hamasha, Pradeep Lall Center for Advanced Vehicle and Extreme Environment Electronics (CAVE3) Auburn University Auburn, AL 36849...
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A008, October 7–9, 2019
Paper No: IPACK2019-6562
...EFFECTS OF TEST TEMPERATURE AND PRIOR AGING ON THE CYCLIC STRESS- STRAIN BEHAVIOR OF LEAD FREE SOLDERS Mohammad Ashraful Haq, Mohd Aminul Hoque, Jeffrey C. Suhling, Pradeep Lall Center for Advanced Vehicle and Extreme Environment Electronics (CAVE3) Auburn University Auburn, AL 36849 Phone: +1-334...
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A009, October 7–9, 2019
Paper No: IPACK2019-6563
...-334-844-3332 FAX: +1-334-844-3124 E-Mail: jsuhling@auburn.edu ABSTRACT Lead free electronic assemblies are often subjected to thermal cycling during qualification testing or during actual use. The dwell periods at the high temperature extreme during thermal cycling cause thermal aging phenomena...
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A008, July 16–18, 2013
Paper No: IPACK2013-73230
... The microstructure, mechanical response, and failure behavior of lead free solder joints in electronic assemblies are constantly evolving when exposed to isothermal aging and/or thermal cycling environments. Traditional finite element based predictions for solder joint reliability during thermal...
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A009, July 16–18, 2013
Paper No: IPACK2013-73232
... Traditional finite element based predictions for solder joint reliability during thermal cycling accelerated life testing are based on solder constitutive equations (e.g. Anand viscoplastic model) and failure models (e.g. energy dissipation per cycle model) that do not evolve with material aging...
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A011, July 16–18, 2013
Paper No: IPACK2013-73240
... in electronic assemblies are constantly evolving when exposed to isothermal aging and/or thermal cycling environments. While the effects of aging on solder constitutive behavior (stress-strain and creep) have been examined in some detail, there have been no prior studies on the effects of aging on solder...
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A015, July 16–18, 2013
Paper No: IPACK2013-73234
... The mechanical properties of a lead free solder are strongly influenced by its microstructure, which is controlled by its thermal history including solidification rate and thermal aging after solidification. Due to aging phenomena, the microstructure, mechanical response, and failure behavior...
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A016, July 16–18, 2013
Paper No: IPACK2013-73241
... The microstructure, mechanical response, and failure behavior of lead free solder joints in electronic assemblies are constantly evolving when exposed to isothermal aging and/or thermal cycling environments. In our prior work on aging effects, we have demonstrated that large degradations occur...
Proceedings Papers

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 733-748, July 6–8, 2011
Paper No: IPACK2011-52184
... 1 Copyright © 2011 by ASME Proceedings of the ASME 2011 Pacific Rim Technical Conference & Exposition on Packaging and Integration of Electronic and Photonic Systems InterPACK2011 July 6-8, 2011, Portland, Oregon, USA InterPACK2011-52184 THE EFFECTS OF DOPANTS ON THE AGING BEHAVIOR OF LEAD FREE...
Proceedings Papers

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 507-518, July 6–8, 2011
Paper No: IPACK2011-52186
... 1 Copyright © 2011 by ASME Proceedings of the ASME 2011 Pacific Rim Technical Conference & Exposition on Packaging and Integration of Electronic and Photonic Systems InterPACK2011 July 6-8, 2011, Portland, Oregon, USA InterPACK2011-52186 CHARACTERIZATION OF HYSTERESIS LOOP EVOLUTION IN AGED LEAD...
Proceedings Papers

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 389-396, July 19–23, 2009
Paper No: InterPACK2009-89205
... for the measurements. The interfacial IMC layer thickness was adjusted by controlling the dwell time during reflow, while the solder microstructure was controlled via the post-reflow cooling rate and subsequent thermal aging. The critical strain energy release rate (G c ) was measured as a function...
Proceedings Papers

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 417-433, July 19–23, 2009
Paper No: InterPACK2009-89371
... 07 01 2011 Microelectronic encapsulants exhibit evolving properties that change significantly with environmental exposures such as isothermal aging and thermal cycling. Such aging effects are exacerbated at higher temperatures typical of thermal cycling qualification tests for harsh...
Topics: Creep, Stress
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 857-865, July 17–22, 2005
Paper No: IPACK2005-73045
... to the traditional ball-shear metrology as an interconnect strength monitor. The open issues preventing its adoption are related to identifying the best test conditions (e.g. aging time, pull speed, jaw pressure, etc...), all of which are addressed here. After identifying the best test conditions, we present...