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Proceedings Papers

Heat Transfer Enhancement in the Heat Sinks for Electronic Cooling Applications

Evan Small, Sadegh M. Sadeghipour, Mehdi Asheghi
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 345-351, July 17–22, 2005
Paper No: IPACK2005-73241
DOI: https://doi.org/10.1115/IPACK2005-73241
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Topics: Computer cooling, Heat sinks, Heat transfer, Fins, Design, Engineering simulation, Pressure drop, Simulation, Mechanical engineering, Students
Proceedings Papers

Squeeze Flow Study of a Colloidal Paste

Drew A. Davidson, Gary L. Lehmann
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 557-567, July 17–22, 2005
Paper No: IPACK2005-73394
DOI: https://doi.org/10.1115/IPACK2005-73394
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Topics: Disks, Flow (Dynamics), Fluids
Proceedings Papers

Ceramic Flat Plate Evaporator for Loop Heat Pipe Cooling of Electronics

Walter Zimbeck, Jared Chaney, Patricio Espinoza, Edward Kroliczek, David C. Bugby, James Yun
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 177-182, July 17–22, 2005
Paper No: IPACK2005-73124
DOI: https://doi.org/10.1115/IPACK2005-73124
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Topics: Ceramics, Cooling, Electronics, Flat plates, Heat pipes
Proceedings Papers

Theta_JC Metrology Development: Fixture Design Modeling

Michael Butch M. Dizon, Suzana Prstic, Sung-Won Moon
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 569-576, July 17–22, 2005
Paper No: IPACK2005-73405
DOI: https://doi.org/10.1115/IPACK2005-73405
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Topics: Design, Metrology, Modeling, Errors, Computational fluid dynamics, Heat losses, Insulation, Junctions, Temperature, Cavities
Proceedings Papers

System Level Considerations in the Incorporation of a Component Thermal Model for an Automotive Application

Victor Chiriac, Tom Lee, Arvind Krishna, Venkata Krishnan, Rodney Lawrence
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 119-127, July 17–22, 2005
Paper No: IPACK2005-73101
DOI: https://doi.org/10.1115/IPACK2005-73101
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Topics: Automotive industry, Boundary-value problems, Computer cooling, Design, Electrical conductivity, Modeling, Simulation, Steady state, Temperature, Thermal analysis
Proceedings Papers

Thermal Performance and Key Challenges for Future CPU Cooling Technologies

Ioan Sauciuc, Ravi Prasher, Je-Young Chang, Hakan Erturk, Gregory Chrysler, Chia-Pin Chiu, Ravi Mahajan
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 353-364, July 17–22, 2005
Paper No: IPACK2005-73242
DOI: https://doi.org/10.1115/IPACK2005-73242
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Topics: Blocks (Building materials), Boundary-value problems, Computer cooling, Cooling, Density, Design, Electrical conductivity, Heat pipes, Heat transfer, Industrial research
Proceedings Papers

Convective Heat Transfer From Confined Heated Surfaces With Slot Jet Impingement

L. K. Liu, C. J. Fang, M. C. Wu, C. H. Peng, Y. H. Hung
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 161-168, July 17–22, 2005
Paper No: IPACK2005-73120
DOI: https://doi.org/10.1115/IPACK2005-73120
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Topics: Convection, Transients (Dynamics), Steady state, Heat transfer, Buoyancy, Composite materials, Heat flux, Mixed convection
Proceedings Papers

The Performance of Small Heat Sinks for LSI Packages in Combined Natural and Forced Convection Air Flows

Masaru Ishizuka, Shinji Nakagawa, Toru Honma
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 11-18, July 17–22, 2005
Paper No: IPACK2005-73011
DOI: https://doi.org/10.1115/IPACK2005-73011
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Topics: Air flow, Heat sinks, Mixed convection, Temperature, Convection, Design, Specific heat, Wind tunnels, Cooling, Forced convection
Proceedings Papers

Advanced Technology for Server Cooling

Ralph L. Webb, Hasan Nasir
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 365-372, July 17–22, 2005
Paper No: IPACK2005-73262
DOI: https://doi.org/10.1115/IPACK2005-73262
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Topics: Cooling, Heat exchangers, Microchannels
Proceedings Papers

Comparison of Different Single-Phase Liquid Jet Impingement Cooling Configurations in the Context of Thermal Management in Power Electronics

Sreekant V. J. Narumanchi, Desikan Bharathan, Vahab Hassani
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 577-589, July 17–22, 2005
Paper No: IPACK2005-73407
DOI: https://doi.org/10.1115/IPACK2005-73407
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Topics: Computational fluid dynamics, Electronics, Erosion, Impingement cooling, Jets, Pressure drop, Thermal management
Proceedings Papers

Use of Psychoacoustic Metrics for the Analysis of Next Generation Computer Graphic Card Noise

Colin Novak, Helen Ule, Robert Gaspar, Gamal Refai-Ahmed
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 373-378, July 17–22, 2005
Paper No: IPACK2005-73264
DOI: https://doi.org/10.1115/IPACK2005-73264
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Topics: Computers, Noise (Sound), Cooling, Graphics processing units, Sound quality, Energy dissipation, Acoustics, Fans, Heat, Heat flux
Proceedings Papers

Thermal Performance of Vapor Chambers Under Hot Spot Heating Conditions

Je-Young Chang, Unnikrishnan Vadakkan, Ravi Prasher, Suzana Prstic
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 197-203, July 17–22, 2005
Paper No: IPACK2005-73131
DOI: https://doi.org/10.1115/IPACK2005-73131
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Topics: Heating, Vapors, Copper, Boundary-value problems, Cooling, Heat, Heat conduction, Heat flux, Heat pipes, Heat transfer
Proceedings Papers

Towards a Thermal Moore’s Law

Shankar Krishnan, Suresh V. Garimella, Greg M. Chrysler, Ravi V. Mahajan
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 591-603, July 17–22, 2005
Paper No: IPACK2005-73409
DOI: https://doi.org/10.1115/IPACK2005-73409
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Topics: Computers, Cooling, Design, Electrons, Energy dissipation, Heat, Heat sinks, Heat transfer, Leakage, Power density
Proceedings Papers

Bond Line Thickness of Thermal Interface Materials With Carbon Nanotubes

Senthil A. G. Singaravelu, Xuejiao Hu, Kenneth E. Goodson
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 379-383, July 17–22, 2005
Paper No: IPACK2005-73265
DOI: https://doi.org/10.1115/IPACK2005-73265
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Topics: Carbon nanotubes, Thermal conductivity, Energy dissipation, Pressure, Rheology, Thermal resistance, Transients (Dynamics)
Proceedings Papers

Thermal Performance of Natural Graphite Heat Spreaders

Martin Smalc, Gary Shives, Gary Chen, Shrishail Guggari, Julian Norley, R. Andy Reynolds, III
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 79-89, July 17–22, 2005
Paper No: IPACK2005-73073
DOI: https://doi.org/10.1115/IPACK2005-73073
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Topics: Anisotropy, Flat heat pipes, Graphite, Laptop computers
Proceedings Papers

Forced Air Cooling With Synthetic Jet Ejectors

Raghav Mahalingam, Ari Glezer
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 59-64, July 17–22, 2005
Paper No: IPACK2005-73052
DOI: https://doi.org/10.1115/IPACK2005-73052
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Topics: Cooling, Ejectors, Jets, Air flow, Flow (Dynamics), Energy dissipation, Fluids, Heat, Heat transfer, Plumbing
Proceedings Papers

Exergy-Based Optimization Strategies for Multi-Component Data Center Thermal Management: Part II — Application and Validation

Amip J. Shah, Van P. Carey, Cullen E. Bash, Chandrakant D. Patel
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 215-224, July 17–22, 2005
Paper No: IPACK2005-73138
DOI: https://doi.org/10.1115/IPACK2005-73138
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Topics: Data centers, Exergy, Optimization, Thermal management
Proceedings Papers

A Novel Scheme in Thermal Modeling of Printed Circuit Boards

Wenjun Liu, Min-Young Lee, Younes Shabany, Mehdi Asheghi
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 385-391, July 17–22, 2005
Paper No: IPACK2005-73268
DOI: https://doi.org/10.1115/IPACK2005-73268
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Topics: Modeling, Printed circuit boards, Thermal resistance
Proceedings Papers

Thermal Optimal Design for Partially-Confined Compact Heat Sinks

M. P. Wang, H. T. Chen, J. T. Horng, T. Y. Wu, P. L. Chen, Y. H. Hung
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 143-150, July 17–22, 2005
Paper No: IPACK2005-73118
DOI: https://doi.org/10.1115/IPACK2005-73118
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Topics: Design, Heat sinks, Pressure drop, Thermal resistance, Flow (Dynamics), Composite materials, Experimental design, Forced convection, Heat flux, Optimization
Proceedings Papers

A Chip-Scale Cooling Scheme With Integrated Heat Sink and Thermal-Fluidic I/O Interconnects

Bing Dang, Paul J. Joseph, Xiaojin Wei, Muhannad S. Bakir, Paul A. Kohl, Yogendra K. Joshi, James D. Meindl
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 605-610, July 17–22, 2005
Paper No: IPACK2005-73416
DOI: https://doi.org/10.1115/IPACK2005-73416
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Topics: Cooling, Heat sinks, Microfluidics, Silicon chips, Complementary metal oxide semiconductors, Density, Electroplating, Engineering prototypes, Flip-chip, Flip-chip assemblies