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Proceedings Papers

Evolution of Mechanical Properties and Microstructure in SAC Bulk Solder and Solder Joints During Thermal Cycling Exposures

S. M. Kamrul Hasan, Abdullah Fahim, Mohammad Al Ahsan, Jeffrey C. Suhling, Sa'd Hamasha, Pradeep Lall
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A016, October 26–28, 2021
Paper No: IPACK2021-74044
DOI: https://doi.org/10.1115/IPACK2021-74044
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Topics: Lead-free solders, Mechanical properties, Solder joints, Solders, Tensile strength, Thermal shock, Yield strength, Stress, Cycles, High temperature
Proceedings Papers

Effects of Thermal Cycling on the Mechanical and Microstructural Evolution of SAC305 Lead-Free Solder

S. M. Kamrul Hasan, Abdullah Fahim, Jeffrey C. Suhling, Sa’d Hamasha, Pradeep Lall
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A009, October 7–9, 2019
Paper No: IPACK2019-6563
DOI: https://doi.org/10.1115/IPACK2019-6563
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Topics: Cycles, Lead-free solders, Stress-strain curves, Tensile strength, Thermal shock
Proceedings Papers

Automated Method Using Finite Element Analysis to Identify Plated Through Holes and Microvia Stacks at Failure Risk in Complex PCB Designs

Kourosh M. Kalayeh, Natalie Hernandez, Nathan Blattau, Craig Hillman
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A001, October 7–9, 2019
Paper No: IPACK2019-6347
DOI: https://doi.org/10.1115/IPACK2019-6347
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Topics: Failure, Finite element analysis, Risk, Reliability, Engineering simulation, Finite element methods, Finite element model, Simulation, Algorithms, Circuits
Proceedings Papers

Low Temperature Fabrication of Three-Dimensional Ceramic Substrate by Using Inorganic Alkali Activated Aluminosilicate Cement Paste for UV-LED Packaging

Hao Cheng, Zi Zhou Yang, Yang Peng, Yun Mou, Ming Xiang Chen
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A003, August 27–30, 2018
Paper No: IPACK2018-8226
DOI: https://doi.org/10.1115/IPACK2018-8226
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Topics: Cements (Adhesives), Ceramics, Low temperature, Manufacturing, Packaging, Ultraviolet radiation, Shear strength, Hardening (Curing), Heat, Light-emitting diodes
Proceedings Papers

Lead-Free Alternatives for Interconnects in High-Temperature Electronics

Sandeep Mallampati, Liang Yin, David Shaddock, Harry Schoeller, Junghyun Cho
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A004, August 29–September 1, 2017
Paper No: IPACK2017-74169
DOI: https://doi.org/10.1115/IPACK2017-74169
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Topics: Electronics, High temperature, Alloys, Fracture (Materials), Deformation, Shear strength, Solders, Tension, Thermal conductivity, Brittleness
Proceedings Papers

In-Situ Monitoring via Synchrotron Radiation Laminography of Thermal Fatigue Cracks at Die-Attached Joints Under Cyclic Energization Loading

Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Masato Hoshino, Kentaro Uesugi, Junya Ooi, Takao Mori
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A015, August 29–September 1, 2017
Paper No: IPACK2017-74177
DOI: https://doi.org/10.1115/IPACK2017-74177
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Topics: Fatigue cracks, Synchrotron radiation, X-rays, Solders, Fracture (Materials), Nondestructive evaluation, Ceramics, Crack propagation, Cycles, Delamination
Proceedings Papers

Hybrid Mini/Micro-Channel Heat Sink Using Liquid Metal and Water as Coolants

Sheng-Fu Mei, Zhong-Shan Deng, Jing Liu
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A010, July 6–9, 2015
Paper No: IPACK2015-48318
DOI: https://doi.org/10.1115/IPACK2015-48318
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Topics: Coolants, Heat sinks, Liquid metals, Microchannels, Water, Cooling, Electronics, Flow (Dynamics), Specific heat, Computer cooling
Proceedings Papers

Thermal Shock and Drop Test Behaviour of Area Array Packages in Forward and Backward Compatible Assemblies

Bankeem V. Chheda, Sathishkumar Sakthivelan, S. Manian Ramkumar, Reza Ghaffarian
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 309-316, July 19–23, 2009
Paper No: InterPACK2009-89321
DOI: https://doi.org/10.1115/InterPACK2009-89321
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Topics: Thermal shock, Solders, Alloys, Failure, Chain, Manufacturing, Solder joints, Ball-Grid-Array packaging, Finishes, Lead-free solders
Proceedings Papers

Application of Phase Growth Approach to Prediction of Thermal Fatigue Crack Initiation Lifetime in Sn-3.0Ag-0.5Cu Solder Joints

Yoshiyuki Okamoto, Takeshi Takayanagi, Toshihiko Sayama, Yasuhiro Ejiri, Hiroyuki Nakano, Takao Mori
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 809-814, July 19–23, 2009
Paper No: InterPACK2009-89262
DOI: https://doi.org/10.1115/InterPACK2009-89262
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Topics: Fatigue cracks, Solder joints, Tin, Cycles, Fatigue damage, Fracture (Materials), Printed circuit boards, Resistors, Scanning electron microscopes, Solders
Proceedings Papers

Computational Fluid Dynamics Investigation on FCBGA Die Bulk Penetrating Cracks After Thermal Shock Test

Kuo-Ying Tsai, Shih-Chang Ku
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 143-149, July 8–12, 2007
Paper No: IPACK2007-33585
DOI: https://doi.org/10.1115/IPACK2007-33585
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Topics: Computational fluid dynamics, Fracture (Materials), Thermal shock
Proceedings Papers

Reliability of Indium Solder for Cold Temperature Packaging

Rui Wu, F. Patrick McCluskey
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 553-556, July 8–12, 2007
Paper No: IPACK2007-33456
DOI: https://doi.org/10.1115/IPACK2007-33456
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Topics: Packaging, Reliability, Solders, Temperature, Stress, Ceramics, Control systems, Damage, Failure, Fatigue
Proceedings Papers

Drop Reliability of Corner Bonded CSP in Portable Products

Guoyun Tian, Yueli Liu, Pradeep Lall, R. Wayne Johnson, Sanan Abderrahman, Mike Palmer, Nokib Islam, Jeffrey Suhling, Larry Crane
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 897-905, July 6–11, 2003
Paper No: IPACK2003-35318
DOI: https://doi.org/10.1115/IPACK2003-35318
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Topics: Corners (Structural elements), Reliability, Bonding, Flow (Dynamics), Manufacturing, Cycles, Electronic products, Finite element analysis, Modeling, Shock (Mechanics)