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Proceedings Papers

Investigation of the Effects of High Temperature Aging on Mechanical Behavior and Microstructural Changes in Lead Free Solders

Jing Wu, Mohammad S. Alam, Jeffrey C. Suhling, Pradeep Lall

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A011, October 7–9, 2019

Paper No: IPACK2019-6571

DOI: https://doi.org/10.1115/IPACK2019-6571

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Topics: Intermetallic compounds, Lead-free solders, Mechanical behavior, Temperature effects

Proceedings Papers

The Effects of Temperature, Strain Rate, and Aging on the Poisson’s Ratio of SAC Lead Free Solders

K. M. Rafidh Hassan, Mohammad S. Alam, Munshi Basit, Jeffrey C. Suhling, Pradeep Lall

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A006, August 27–30, 2018

Paper No: IPACK2018-8410

DOI: https://doi.org/10.1115/IPACK2018-8410

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Topics: Lead-free solders, Poisson ratio, Temperature effects, Solders, Temperature, Cooling, Finite element analysis, Finite element methods, Finite element model, Reliability

Proceedings Papers

Investigation of the Effects of High Temperature Aging on the Mechanical Behavior of Lead Free Solders

Mohammad S. Alam, K. M. Rafidh Hassan, Jeffrey C. Suhling, Pradeep Lall

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A020, August 27–30, 2018

Paper No: IPACK2018-8396

DOI: https://doi.org/10.1115/IPACK2018-8396

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Topics: Lead-free solders, Mechanical behavior, Temperature effects, High temperature, Solders, Temperature, Mechanical properties, Alloys, Stress, Tensile strength

Proceedings Papers

Electrothermal Analysis of the Field-Plated AlGaN/GaN HEMTs With SiO 2 Passivation

Dogacan Kara, F. Nazli Donmezer Akgun

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A011, August 29–September 1, 2017

Paper No: IPACK2017-74125

DOI: https://doi.org/10.1115/IPACK2017-74125

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Topics: Gallium nitride, Plates (structures), Collapse, Electrons, Heating, Reliability, Electric fields, Electron mobility, Engineering simulation, Joules

Proceedings Papers

An Investigation of Moisture-Induced Interfacial Delamination in Plastic IC Package During Solder Reflow

Jing Wang, Yuling Niu, Seungbae Park

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A011, August 29–September 1, 2017

Paper No: IPACK2017-74017

DOI: https://doi.org/10.1115/IPACK2017-74017

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Topics: Delamination, Reflow soldering, Fracture (Materials), Stress, Vapor pressure, Ball-Grid-Array packages, Displacement, Finite element analysis, Fracture mechanics, Lead-free solders

Proceedings Papers

Thermomechanical Reliability Challenges and Goals and Design for Reliability Methodologies for Electric Vehicle Systems

David Huitink

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A002, August 29–September 1, 2017

Paper No: IPACK2017-74245

DOI: https://doi.org/10.1115/IPACK2017-74245

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Topics: Design, Electric vehicles, Reliability, Thermomechanics, Stress, Vehicles, Electronics, Failure, Physics, Batteries

Proceedings Papers

Effect of Relative Humidity, Temperature and Gaseous and Particulate Contaminations on Information Technology Equipment Reliability

Prabjit Singh, Levente Klein, Dereje Agonafer, Jimil M. Shah, Kanan D. Pujara

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A015, July 6–9, 2015

Paper No: IPACK2015-48176

DOI: https://doi.org/10.1115/IPACK2015-48176

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Topics: Contamination, Particulate matter, Reliability, Temperature, Data centers, Electronic equipment, Temperature effects, Cutting, High temperature, Risk

Proceedings Papers

Effect of Temperature and Strain Rate on Low-Cycle Fatigue Life of Bi-Sn Eutectic Alloy

Takuma Sato, Yoshiharu Kariya, Kazuma Fukui

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A014, July 16–18, 2013

Paper No: IPACK2013-73193

DOI: https://doi.org/10.1115/IPACK2013-73193

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Topics: Eutectic alloys, Low cycle fatigue, Temperature, Tin, Fatigue life, Deformation, Ductility, Fatigue, Metals, Temperature effects

Proceedings Papers

Enhanced Thermal Map Prediction and Floor Plan Optimization in Electronic Devices Considering Sub-Continuum Thermal Effects

David Romero, Aydin Nabovati, Gamal Refai-Ahmed, Daniel P. Sellan, Saeed Ghalambor, Niket Shah, Dereje Agonafer, Cristina H. Amon

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 241-249, July 6–8, 2011

Paper No: IPACK2011-52161

DOI: https://doi.org/10.1115/IPACK2011-52161

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Topics: Optimization, Temperature effects, Thermal conductivity, Energy generation, Heat transfer, Reliability, Semiconductors (Materials), Simulation, Temperature gradient

Proceedings Papers

Temperature Effects on the Performance and Reliability of MEMS Gyroscope Sensors

Chandradip Patel, Allen Jones, Joshua Davis, Patrick McCluskey, David Lemus

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 507-512, July 19–23, 2009

Paper No: InterPACK2009-89370

DOI: https://doi.org/10.1115/InterPACK2009-89370

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Topics: Microelectromechanical systems, Reliability, Sensors, Temperature effects, Temperature, Displacement, Displacement measurement, Fire, High temperature, Resonance

Proceedings Papers

Electroless Nickel Plating Process Optimization for Aluminum Terminals

Philip Westby, Kevin Mattson, Fred Haring, Jacob Baer, Matt Steele, Syed Sajid Ahmad, Aaron Reinholz

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 371-378, July 19–23, 2009

Paper No: InterPACK2009-89131

DOI: https://doi.org/10.1115/InterPACK2009-89131

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Topics: Aluminum, Nickel plating, Optimization, Nickel, Adhesion, Solders, Temperature effects

Proceedings Papers

Characterization of the Piezoresistive Coefficients of (100) Silicon From −150 to +125C

Chun-Hyung Cho, Richard C. Jaeger, Jeffrey C. Suhling

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 451-464, July 8–12, 2007

Paper No: IPACK2007-33053

DOI: https://doi.org/10.1115/IPACK2007-33053

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Topics: Silicon, Stress, Temperature, Sensors, Anisotropy, Calibration, Chemical etching, Electrical resistivity, Electron mobility, Engineering simulation

Proceedings Papers

Modeling Thermoelectric Device Enhancement of Heat Sink Performance

Richard I. Roser, Robert M. Smythe, Malkiat Singh

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 235-240, July 8–12, 2007

Paper No: IPACK2007-33688

DOI: https://doi.org/10.1115/IPACK2007-33688

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Topics: Heat sinks, Modeling, Thermoelectric devices, Temperature, Heat, Cooling, Design, Thermal resistance, Air flow, Dimensions

Proceedings Papers

Impact of Thermodiffusion on Temperature Fields in Stationary Nanofluids

Patricia E. Gharagozloo, Ken E. Goodson, John K. Eaton

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 993-998, July 8–12, 2007

Paper No: IPACK2007-33293

DOI: https://doi.org/10.1115/IPACK2007-33293

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Topics: Nanofluids, Temperature, Thermal conductivity, Aluminum, Carbon nanotubes, Heat, Microscopy, Nanoparticles, Separation (Technology), Silicones

Proceedings Papers

SnAgCu (SAC) Durability Under Vibration Loading at Different Isothermal Temperature Conditions

G. Plaza, Y. Zhou, M. Osterman, A. Dasgupta

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 515-521, July 8–12, 2007

Paper No: IPACK2007-33095

DOI: https://doi.org/10.1115/IPACK2007-33095

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Topics: Durability, Temperature, Vibration, Solders, Damage, Finite element analysis, High cycle fatigue, Printed circuit boards, Electrical wires, Excitation

Proceedings Papers

A New Modified Crack Surface Displacement Extrapolation Method for Analysis of Package Delamination

Guojun Hu, Andrew A. O. Tay

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1207-1213, July 17–22, 2005

Paper No: IPACK2005-73238

DOI: https://doi.org/10.1115/IPACK2005-73238

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Topics: Delamination, Displacement, Fracture (Materials), Reflow soldering, Vapor pressure, Density, Diffusion (Physics), Lead-free solders, Solders, Stress

Proceedings Papers

The Use of Time-Dependent Temperature Response Curves for the Generation of (Dynamic) Compact Thermal Models

Clemens J. M. Lasance, Mohamed-Nabil Sabry

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 363-370, July 6–11, 2003

Paper No: IPACK2003-35167

DOI: https://doi.org/10.1115/IPACK2003-35167

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Topics: Ball-Grid-Array packaging, Design, Electronic circuits, Modeling, Reliability, Steady state, Temperature, Temperature effects, Thermal analysis, Transients (Dynamics)

Proceedings Papers

Dynamic Compact Thermal Models Used for Electronic Design: A Review of Recent Progress

Mohamed-Nabil Sabry

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 399-415, July 6–11, 2003

Paper No: IPACK2003-35185

DOI: https://doi.org/10.1115/IPACK2003-35185

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Topics: Design, Electronic systems, Nanoscale phenomena, Reliability, Temperature effects

NARROW

Investigation of the Effects of High Temperature Aging on Mechanical Behavior and Microstructural Changes in Lead Free Solders

The Effects of Temperature, Strain Rate, and Aging on the Poisson’s Ratio of SAC Lead Free Solders

Investigation of the Effects of High Temperature Aging on the Mechanical Behavior of Lead Free Solders

Electrothermal Analysis of the Field-Plated AlGaN/GaN HEMTs With SiO 2 Passivation

An Investigation of Moisture-Induced Interfacial Delamination in Plastic IC Package During Solder Reflow

Thermomechanical Reliability Challenges and Goals and Design for Reliability Methodologies for Electric Vehicle Systems

Effect of Relative Humidity, Temperature and Gaseous and Particulate Contaminations on Information Technology Equipment Reliability

Effect of Temperature and Strain Rate on Low-Cycle Fatigue Life of Bi-Sn Eutectic Alloy

Enhanced Thermal Map Prediction and Floor Plan Optimization in Electronic Devices Considering Sub-Continuum Thermal Effects

Temperature Effects on the Performance and Reliability of MEMS Gyroscope Sensors

Electroless Nickel Plating Process Optimization for Aluminum Terminals

Characterization of the Piezoresistive Coefficients of (100) Silicon From −150 to +125C

Modeling Thermoelectric Device Enhancement of Heat Sink Performance

Impact of Thermodiffusion on Temperature Fields in Stationary Nanofluids

SnAgCu (SAC) Durability Under Vibration Loading at Different Isothermal Temperature Conditions

A New Modified Crack Surface Displacement Extrapolation Method for Analysis of Package Delamination

The Use of Time-Dependent Temperature Response Curves for the Generation of (Dynamic) Compact Thermal Models

Dynamic Compact Thermal Models Used for Electronic Design: A Review of Recent Progress

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