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Proceedings Papers

Lasered Roughness to Increase Wicking Rates in Pin-Fin Microstructure

Sougata Hazra, Tanya Liu, Mehdi Asheghi, Kenneth Goodson
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A006, October 27–29, 2020
Paper No: IPACK2020-2640
DOI: https://doi.org/10.1115/IPACK2020-2640
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Topics: Lasers, Surface roughness, Vapors
Proceedings Papers

Damage of Flexible Electronic Line Printed With Ag Nanoparticle Ink due to High-Current Density

Daiki Saito, Kazuhiko Sasagawa, Takeshi Moriwaki, Kazuhiro Fujisaki
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A001, October 7–9, 2019
Paper No: IPACK2019-6408
DOI: https://doi.org/10.1115/IPACK2019-6408
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Topics: Damage, Density, Flexible electronics, Inks, Nanoparticles, Metals, Anodes, Current density, Printing, Reliability
Proceedings Papers

Demonstration of a Compliant Micro-Spring Array As a Thermal Interface Material for Pluggable Optoelectronic Transceiver Modules

Jin Cui, Liang Pan, Justin A. Weibel
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A004, October 7–9, 2019
Paper No: IPACK2019-6389
DOI: https://doi.org/10.1115/IPACK2019-6389
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Topics: Compression, Contact resistance, Cycles, Fibers, Heat sinks, Microscale devices, Polymers, Pressure, Springs, Surface roughness
Proceedings Papers

Creep Response of Assemblies Bonded With Pressure Sensitive Adhesive (PSA)

Hao Huang, Qian Jiang, Abhijit Dasgupta, Ehsan Mirbagheri, Krishna Darbha
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A008, August 27–30, 2018
Paper No: IPACK2018-8345
DOI: https://doi.org/10.1115/IPACK2018-8345
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Topics: Adhesives, Creep, Pressure, Stress, Bonding, Hydrostatics, Temperature, Cavitation, Cavities, Design
Proceedings Papers

Molecular Dynamics Simulation of AlN Deposition: Effect of N:Al Flux Ratio

Libin Zhang, Guo Zhu, Kuan Sun, Zhiyin Gan, Xiaobing Luo
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A011, August 27–30, 2018
Paper No: IPACK2018-8315
DOI: https://doi.org/10.1115/IPACK2018-8315
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Topics: Atoms, Crystals, Molecular dynamics simulation, Surface roughness, Temperature
Proceedings Papers

Fundamental Study of Polymer to Metal Bonding in Integrated Circuit Packaging

Dinesh P. R. Thanu, Roozbeh Danaei, Alexander Bermudez, Sergio A. Chan, Suzana Prstic
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A002, August 27–30, 2018
Paper No: IPACK2018-8254
DOI: https://doi.org/10.1115/IPACK2018-8254
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Topics: Integrated circuit packaging, Metal bonding, Polymers, Bonding, Manufacturing, Metals, Adhesion, Warping, Adhesives, Chemistry
Proceedings Papers

The Effect of Surface Texture on Thermal Sensation and Comfort

Han Zhang, Alan Hedge
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A026, August 29–September 1, 2017
Paper No: IPACK2017-74179
DOI: https://doi.org/10.1115/IPACK2017-74179
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Topics: Computers, Heat, Surface roughness, Surface texture, Surfaces (Materials), Temperature
Proceedings Papers

Copper Inverse Opal Surfaces for Enhanced Boiling Heat Transfer

Hyoungsoon Lee, Tanmoy Maitra, James Palko, Chi Zhang, Michael Barako, Yoonjin Won, Mehdi Asheghi, Kenneth E. Goodson
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A006, August 29–September 1, 2017
Paper No: IPACK2017-74090
DOI: https://doi.org/10.1115/IPACK2017-74090
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Topics: Boiling, Copper, Heat transfer, Bubbles, Critical heat flux, Cooling, Heat transfer coefficients, Microscale devices, Nucleation (Physics), Optical images
Proceedings Papers

Experimental Study of Aqueous Binary Mixture Droplet Vaporization on Nanostructured Surfaces

Russell J. LaBrie, II, Jorge Padilla, Jr., Van P. Carey
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A003, July 6–9, 2015
Paper No: IPACK2015-48153
DOI: https://doi.org/10.1115/IPACK2015-48153
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Topics: Drops, Heat transfer, Water, Nanocrystals, Heat transfer coefficients, Copper, Evaporation, Film thickness, Gravity (Force), Hydrophilicity
Proceedings Papers

On Simple Prediction Method for Thermal Contact Resistance Between Wavy Surfaces With Thermal Interface Material Under Low Mean Nominal Contact Pressure (Fundamental Study Based on 1-D Model)

Toshio Tomimura, Yasushi Koito, Taewan Do, Masaru Ishizuka, Tomoyuki Hatakeyama
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A073, July 6–9, 2015
Paper No: IPACK2015-48302
DOI: https://doi.org/10.1115/IPACK2015-48302
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Topics: Contact resistance, Pressure, Heat, Surface roughness, Temperature, Bearings, Control systems, Electronic equipment, Errors, Satellites
Proceedings Papers

A Composite Cu/HOPG Heat Spreader for Immersion Cooling of High Power Chips

Arthur Suszko, Mohamed S. El-Genk
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A088, July 6–9, 2015
Paper No: IPACK2015-48678
DOI: https://doi.org/10.1115/IPACK2015-48678
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Topics: Composite materials, Cooling, Flat heat pipes, Critical heat flux, Copper, Dielectric liquids, Graphite, Nucleate pool boiling, Numerical analysis, Surface roughness
Proceedings Papers

Enhancing Heat Transfer in a Cold Plate, Inserts vs. Nanofluids: Application to IT Servers

Amrid Mammeri, Farid Bakir, Smaine Kouidri, Lionel Coutancier, Jean-Christophe Bonnin
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A009, July 16–18, 2013
Paper No: IPACK2013-73132
DOI: https://doi.org/10.1115/IPACK2013-73132
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Topics: Heat transfer, Nanofluids, Fins, Heat transfer coefficients, Surface roughness
Proceedings Papers

New Method for Evaluating Heat Transfer Material

Yasuhiro Saito, Hiroyuki Emoto, Yuuki Tuji, Takanori Komuro
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A008, July 16–18, 2013
Paper No: IPACK2013-73051
DOI: https://doi.org/10.1115/IPACK2013-73051
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Topics: Heat transfer, Pressure, Aluminum plate, Heat sinks, Thermal conductivity, Shapes, Flow (Dynamics), Insulation, Machinery, Reliability
Proceedings Papers

Multiphysics Simulation of RF-MEMS With Quantified Uncertainties

Lin Sun, Hojin Kim, Alejandro Strachan, Sanjay R. Mathur, Jayathi Y. Murthy
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A007, July 16–18, 2013
Paper No: IPACK2013-73175
DOI: https://doi.org/10.1115/IPACK2013-73175
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Topics: Microelectromechanical systems, Simulation, Uncertainty, Deformation, Chaos, Complex systems, Damping, Displacement, Electrostatics, Fluids
Proceedings Papers

High Strain Rate Fracture Behavior of Sn-Ag-Cu Solder Joints on Cu Substrates

Z. Huang, P. Kumar, I. Dutta, J. H. L. Pang, R. Sidhu, M. Renavikar, R. Mahajan
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 763-771, July 6–8, 2011
Paper No: IPACK2011-52220
DOI: https://doi.org/10.1115/IPACK2011-52220
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Topics: Fracture (Materials), Fracture (Process), Solder joints, Tin, Fracture toughness, Solders, Yield strength, Failure, Intermetallic compounds, Microcracks
Proceedings Papers

The Effect of the Surface Roughness of Al Layer of DBA Substrate on Fatigue Life of Solder Joint in Power-Devices

Shiqiang Zhao, Qiang Yu, Hiroki Akaeda
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 195-199, July 6–8, 2011
Paper No: IPACK2011-52109
DOI: https://doi.org/10.1115/IPACK2011-52109
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Topics: Fatigue life, Solder joints, Surface roughness, Cycles, Aluminum, Reliability, Thermal stresses
Proceedings Papers

Single-Step Fabrication and Characterization of Ultrahydrophobic Surfaces With Hierarchical Roughness

Susmita Dash, Niru Kumari, Mercy Dicuangco, Suresh V. Garimella
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 685-692, July 6–8, 2011
Paper No: IPACK2011-52046
DOI: https://doi.org/10.1115/IPACK2011-52046
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Topics: Manufacturing, Surface roughness, Drops, Microscale devices, Dynamics (Mechanics), Etching, Robustness, Wetting
Proceedings Papers

A Study of Acoustic Emission Produced by Strength Test on Bio-Ceramics: The Dependency of Roughness on Mechanical and AE Characteristics

Mitsuyuki Nakayama, Hideto Suzuki
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 365-370, July 19–23, 2009
Paper No: InterPACK2009-89119
DOI: https://doi.org/10.1115/InterPACK2009-89119
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Topics: Acoustic emissions, Ceramics, Surface roughness, Bone, Mechanical properties, Elasticity, Fracture mechanics, Speed of sound, Stress, Young's modulus
Proceedings Papers

Evaluation and Improvement of Micro-Drilled-Hole Wall Quality in Printed Wiring Boards Made of Glass Fiber-Reinforced Plastics

Keiji Ogawa, Heisaburo Nakagawa, Masatoshi Matsudaira
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 201-210, July 19–23, 2009
Paper No: InterPACK2009-89034
DOI: https://doi.org/10.1115/InterPACK2009-89034
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Topics: Fiber reinforced plastics, Glass, Printed circuit boards, Drilling, Drills (Tools), Surface roughness, Temperature, Circuits, Delamination, Glass fibers
Proceedings Papers

Thermal-Structural Performance of Orthotropic Pin Fin Applications

Abul Fazal M. Arif, Syed M. Zubair
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 125-134, July 19–23, 2009
Paper No: InterPACK2009-89125
DOI: https://doi.org/10.1115/InterPACK2009-89125
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Topics: Composite materials, Cooling, Corrosion, Density, Design, Finite element methods, Heat sinks, Heat transfer, Materials properties, Metals