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Proceedings Papers

System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities in the Next Generation of Electric and Hybrid Electric Vehicles

Bakhtiyar Mohammad Nafis, Ange-Christian Iradukunda, Imam Al Razi, David R. Huitink, Yarui Peng
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A003, October 7–9, 2019
Paper No: IPACK2019-6429
DOI: https://doi.org/10.1115/IPACK2019-6429
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Topics: Electronics, Hybrid electric vehicles, Reliability, Thermal management, Phase change materials, Cooling, Temperature, Electronic packaging, Heat, Automobiles
Proceedings Papers

A Computational Approach to Study the Impact of PCB Thickness on QFN Assembly Under Drop Testing With Package Power Supply

Unique Rahangdale, Pavan Rajmane, Abel Misrak, Dereje Agonafer
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A019, August 29–September 1, 2017
Paper No: IPACK2017-74278
DOI: https://doi.org/10.1115/IPACK2017-74278
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Topics: Manufacturing, Testing, Reliability, Stress, Lumber, Temperature, Failure, Finite element analysis, Young's modulus, Computation
Proceedings Papers

Characterization of an Isolated Hybrid Cooled Server With Failure Scenarios Using Warm Water Cooling

Uschas Chowdhury, Manasa Sahini, Ashwin Siddarth, Dereje Agonafer, Steve Branton
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A002, August 29–September 1, 2017
Paper No: IPACK2017-74028
DOI: https://doi.org/10.1115/IPACK2017-74028
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Topics: Cooling, Failure, Water, Energy consumption, Fans, Pumps, Data centers, Density, Heat, Redundancy (Engineering)
Proceedings Papers

Hybrid Mini/Micro-Channel Heat Sink Using Liquid Metal and Water as Coolants

Sheng-Fu Mei, Zhong-Shan Deng, Jing Liu
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A010, July 6–9, 2015
Paper No: IPACK2015-48318
DOI: https://doi.org/10.1115/IPACK2015-48318
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Topics: Coolants, Heat sinks, Liquid metals, Microchannels, Water, Cooling, Electronics, Flow (Dynamics), Specific heat, Computer cooling
Proceedings Papers

Theoretical (Ideal) Module Cooling and Module Cooling Effectiveness

Michael J. Ellsworth, Jr., Levi A. Campbell
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A003, July 6–9, 2015
Paper No: IPACK2015-48324
DOI: https://doi.org/10.1115/IPACK2015-48324
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Topics: Cooling, Thermal resistance, Heat sinks, Density, Flow (Dynamics), Fluids, Heat exchangers, Pressure, Specific heat, Water
Proceedings Papers

Experimental Measurement of Server Thermal Effectiveness for Compact Transient Data Center Models

James W. VanGilder, Zachary M. Pardey, Xuanhang (Simon) Zhang, Christopher Healey
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A012, July 16–18, 2013
Paper No: IPACK2013-73155
DOI: https://doi.org/10.1115/IPACK2013-73155
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Topics: Data centers, Transients (Dynamics), Heat, Computational fluid dynamics, Cooling, Fluctuations (Physics), Heat sinks, Specific heat, Temperature
Proceedings Papers

Multi-Physics of Nanoscale Thin Films and Interfaces

M. A. Haque
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 375-379, July 6–8, 2011
Paper No: IPACK2011-52038
DOI: https://doi.org/10.1115/IPACK2011-52038
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Topics: Nanoscale phenomena, Physics, Thin films, Electrical conductivity, Thermal conductivity, Deformation, Design, Dimensions, Electron microscopes, Electrons
Proceedings Papers

Numerical Calculation for Phonon Properties of a Nano-Porous Si

Koji Miyazaki, Daisuke Nagai, Yohei Kido, Hiroshi Tsukamoto
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 557-561, July 19–23, 2009
Paper No: InterPACK2009-89118
DOI: https://doi.org/10.1115/InterPACK2009-89118
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Topics: Phonons, Fourier transforms, Thermal conductivity, Boundary-value problems, Crystals, Density, Heat conduction, Mean free path, Molecular dynamics simulation, Nanostructures
Proceedings Papers

Thermal Policies and Active Workload Migration Within Data Centers

Cullen Bash, Chris Hyser, Christopher Hoover
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 673-679, July 19–23, 2009
Paper No: InterPACK2009-89038
DOI: https://doi.org/10.1115/InterPACK2009-89038
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Topics: Data centers, Energy consumption, Heat capacity, Specific heat, Cooling, Emissions, Energy generation, Machinery
Proceedings Papers

Subcooled Flow Boiling in Mini and Micro Channel: Contribution Toward High Heat Flux Cooling Technology for Electronics

Tomoyuki Nomura, Michael V. Shustov, Koichi Suzuki, Chungpyo Hong, Yury A. Kuzma-Kichta
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 335-340, July 19–23, 2009
Paper No: InterPACK2009-89100
DOI: https://doi.org/10.1115/InterPACK2009-89100
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Topics: Boiling, Cooling, Electronics, Flow (Dynamics), Heat flux, Microchannels, Subcooling, Heating, Critical heat flux, Emissions
Proceedings Papers

Application of a Thermal Network Method to Thermal Analysis of Electronic Devices Using Phase Change Materials

Sadakazu Takakuwa, Masaru Ishizuka, Shinji Nakagawa, Kanji Takagi
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 471-477, July 19–23, 2009
Paper No: InterPACK2009-89218
DOI: https://doi.org/10.1115/InterPACK2009-89218
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Topics: Phase change materials, Thermal analysis, Fins, Temperature, Transients (Dynamics), Absorption, Cooling, Design, Electronic equipment, Energy dissipation
Proceedings Papers

Thermal Reliability and Environmental Testing of Advanced Metal Diamond Composites

Ravi Bollina, Janet Landgraf, Hannes Wagner, Robert Wilhelm, Sven Knippscheer, Gerhard Mitic, Svetlana Levchuck
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 389-397, July 8–12, 2007
Paper No: IPACK2007-33028
DOI: https://doi.org/10.1115/IPACK2007-33028
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Topics: Composite materials, Diamonds, Metals, Reliability, Testing, Pressure, Thermal diffusivity, Thermal properties, Aluminum, Aluminum alloys
Proceedings Papers

The Performance of Small Heat Sinks for LSI Packages in Combined Natural and Forced Convection Air Flows

Masaru Ishizuka, Shinji Nakagawa, Toru Honma
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 11-18, July 17–22, 2005
Paper No: IPACK2005-73011
DOI: https://doi.org/10.1115/IPACK2005-73011
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Topics: Air flow, Heat sinks, Mixed convection, Temperature, Convection, Design, Specific heat, Wind tunnels, Cooling, Forced convection
Proceedings Papers

Testing the Thermal Resistance and Power Capacity of Production Heat Pipes

Sukhvinder Kang, Randy Cook, Dave Gailus
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 635-640, July 17–22, 2005
Paper No: IPACK2005-73445
DOI: https://doi.org/10.1115/IPACK2005-73445
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Topics: Heat pipes, Testing, Thermal resistance, Heat, Heat sinks, Manufacturing, Design, Pipes, Specific heat, Air flow
Proceedings Papers

Transient Performance of a Finned PCM Heat Sink

V. Shatikian, G. Ziskind, R. Letan
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 137-142, July 17–22, 2005
Paper No: IPACK2005-73113
DOI: https://doi.org/10.1115/IPACK2005-73113
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Topics: Heat sinks, Transients (Dynamics), Temperature, Melting, Fins, Phase change materials, Aluminum, Computer simulation, Density, Heat
Proceedings Papers

Design of a Low-Cost Infrared Sensor Array Through Thermal System Modeling

Brian R. Smith, Cristina Amon
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 513-519, July 6–11, 2003
Paper No: IPACK2003-35277
DOI: https://doi.org/10.1115/IPACK2003-35277
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Topics: Design, Modeling, Sensors, Thermal systems, Thermal properties, Manufacturing, Signals, Silicon, Computer simulation, Electronics
Proceedings Papers

Numerical Calculation of Heat Transfer Coefficient of Liquid Flow With NPCM in Microchannels

Y. L. Hao, Y.-X. Tao
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 449-459, July 6–11, 2003
Paper No: IPACK2003-35224
DOI: https://doi.org/10.1115/IPACK2003-35224
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Topics: Flow (Dynamics), Heat transfer coefficients, Microchannels, Heat transfer, Laminar flow, Particulate matter, Computational fluid dynamics, Computer simulation, Computers, Ducts