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Proceedings Papers

Thermomechanical Stress and Warpage Augmentation Using Auxetic Features in Electronic Design

Mahsa Montazeri, John Harris, David R. Huitink, Adithya Venkatanarayanan, Simon S. Ang
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A011, October 7–9, 2019
Paper No: IPACK2019-6424
DOI: https://doi.org/10.1115/IPACK2019-6424
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Topics: Design, Stress, Thermomechanics, Warping, Deformation, Finite element analysis, Manufacturing, Electronic packages, Reliability, Temperature
Proceedings Papers

Thermal Stress Simulation for 3D SiP With TSV Structure Under Unsteady Thermal Loads

Takahiro Kinoshita, Takashi Kawakami, Tomoya Sugiura, Keiji Matsumoto, Sayuri Kohara, Yasumitsu Orii
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A020, July 6–9, 2015
Paper No: IPACK2015-48142
DOI: https://doi.org/10.1115/IPACK2015-48142
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Topics: Simulation, Stress, Thermal stresses, Finite element methods, Heat, Temperature, Cooling, Damage, Packaging, Reliability
Proceedings Papers

Effects of Low CTE Materials on Thermal Deformation of Organic Substrates in Flip Chip Package Application

Hiroyuki Mori, Sayuri Kohara, Keishi Okamoto, Hirokazu Noma, Kazushige Toriyama
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A016, July 6–9, 2015
Paper No: IPACK2015-48741
DOI: https://doi.org/10.1115/IPACK2015-48741
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Topics: Flip-chip packages, Thermal deformation, Warping, Finite element analysis, Manufacturing, Package on package, Shapes, Deformation, Finite element model, Flip-chip
Proceedings Papers

Inelastic Thermal Stress Simulation for Si Chip and Insulator Around TSV in 3D SiP

Takahiro Kinoshita, Takashi Kawakami, Takeshi Wakamatsu, Shunpei Shima, Keiji Matsumoto, Sayuri Kohara, Fumiaki Yamada, Yasumitsu Orii
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A009, July 16–18, 2013
Paper No: IPACK2013-73151
DOI: https://doi.org/10.1115/IPACK2013-73151
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Topics: Silicon chips, Simulation, Thermal stresses, Stress, Bending strength, Copper, Finite element methods, Yield stress, Brittleness, Elevations (Drawings)
Proceedings Papers

Analysis of 3D-Strain Singular Field Near the Corner of Si Chip Using Digital Image Correlation Method

Hideo Koguchi, Yasuyuki Tsukada, Takahiko Kurahashi
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A006, July 16–18, 2013
Paper No: IPACK2013-73112
DOI: https://doi.org/10.1115/IPACK2013-73112
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Topics: Corners (Structural elements), Silicon chips, Displacement, Galerkin method, Stress, Bonding, Density, Electronics, Failure, Lasers
Proceedings Papers

Development of Highly Reliable BGA and Flip-Chip Structures by Using Cu-Cored Solder Ball

Hisashi Tanie, Nobuhiko Chiwata, Motoki Wakano, Masaru Fujiyoshi, Shinichi Fujiwara
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 725-732, July 6–8, 2011
Paper No: IPACK2011-52115
DOI: https://doi.org/10.1115/IPACK2011-52115
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Topics: Ball-Grid-Array packaging, Flip-chip, Solders, Solder joints, Impact strength, Fatigue life, Finite element analysis, Reliability, Crack propagation, Deformation
Proceedings Papers

Silicon Hot Spot Remediation With a Germanium Self Cooling Layer

Horacio Nochetto, Peng Wang, Avram Bar-Cohen
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 319-326, July 6–8, 2011
Paper No: IPACK2011-52229
DOI: https://doi.org/10.1115/IPACK2011-52229
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Topics: Cooling, Germanium, Silicon, Silicon chips, Temperature, Engineering simulation, Shrinkage (Materials), Simulation, Thermal conductivity, Thermal management
Proceedings Papers

Thermal Stress of Through Silicon Vias and Si Chips in 3D SiP

Takahiro Kinoshita, Takashi Kawakami, Tatsuhiro Hori, Keiji Matsumoto, Sayuri Kohara, Yasumitsu Orii, Fumiaki Yamada, Morihiro Kada
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 325-328, July 6–8, 2011
Paper No: IPACK2011-52241
DOI: https://doi.org/10.1115/IPACK2011-52241
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Topics: Silicon, Silicon chips, Thermal stresses, Stress, Copper, Crystals, Damage, Reliability, Yield stress, Cycles
Proceedings Papers

Minimization of the Local Residual Stress in 3D Flip Chip Structures by Optimizing the Mechanical Properties of Electroplated Materials and the Alignment Structure of TSVs and Fine Bumps

Kohta Nakahira, Hironori Tago, Fumiaki Endo, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 19-25, July 6–8, 2011
Paper No: IPACK2011-52063
DOI: https://doi.org/10.1115/IPACK2011-52063
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Topics: Flip-chip, Flip-chip devices, Mechanical properties, Stress, Copper, Silicon chips, Gages, Packaging, Sensors, Strain gages
Proceedings Papers

Precision Evaluation for Thermal Fatigue Life of Power Module Using Coupled Electrical-Thermal-Structural Analysis

Tomohiro Takahashi, Qiang Yu, Masahiro Kobayashi
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 157-163, July 6–8, 2011
Paper No: IPACK2011-52068
DOI: https://doi.org/10.1115/IPACK2011-52068
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Topics: Fatigue life, Solder joints, Wire, Bonding, Fatigue, Finite element methods, Fracture (Materials), Temperature distribution, Crack propagation, Damage
Proceedings Papers

Stress-Induced Effects in Electronic Characteristics of n-Type MOSFETs in Resin-Molded Packages

Masaaki Koganemaru, Toru Ikeda, Noriyuki Miyazaki, Hajime Tomokage
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 277-284, July 8–12, 2007
Paper No: IPACK2007-33533
DOI: https://doi.org/10.1115/IPACK2007-33533
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Topics: Resins, Stress, Electron mobility, Molding, Diffusion (Physics), Experimental analysis, Silicon chips, Simulation
Proceedings Papers

Development of a Nondestructive Inspection Method for Detecting Open Failures of Micro Bump Interconnections in Three Dimensionally Stacked LSI Chips

Yuki Sato, Hideo Miura
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 473-479, July 8–12, 2007
Paper No: IPACK2007-33257
DOI: https://doi.org/10.1115/IPACK2007-33257
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Topics: Failure, Nondestructive evaluation, Deformation, Delamination, Finite element analysis, Surface deformation, Diluents, Epoxy resins, Lasers, Microscopes
Proceedings Papers

Thermal Performance of Vapor Chambers Under Hot Spot Heating Conditions

Je-Young Chang, Unnikrishnan Vadakkan, Ravi Prasher, Suzana Prstic
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 197-203, July 17–22, 2005
Paper No: IPACK2005-73131
DOI: https://doi.org/10.1115/IPACK2005-73131
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Topics: Heating, Vapors, Copper, Boundary-value problems, Cooling, Heat, Heat conduction, Heat flux, Heat pipes, Heat transfer
Proceedings Papers

A Chip-Scale Cooling Scheme With Integrated Heat Sink and Thermal-Fluidic I/O Interconnects

Bing Dang, Paul J. Joseph, Xiaojin Wei, Muhannad S. Bakir, Paul A. Kohl, Yogendra K. Joshi, James D. Meindl
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 605-610, July 17–22, 2005
Paper No: IPACK2005-73416
DOI: https://doi.org/10.1115/IPACK2005-73416
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Topics: Cooling, Heat sinks, Microfluidics, Silicon chips, Complementary metal oxide semiconductors, Density, Electroplating, Engineering prototypes, Flip-chip, Flip-chip assemblies
Proceedings Papers

Convective Performance of Package Based Single Phase Microchannel Heat Exchanger

Je-Young Chang, Ravi Prasher, David Chau, Alan Myers, John Dirner, Suzana Prstic, Dongming He
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 183-188, July 17–22, 2005
Paper No: IPACK2005-73126
DOI: https://doi.org/10.1115/IPACK2005-73126
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Topics: Heat exchangers, Microchannels, Heating, Temperature sensors, Cooling, Fluids, Heat flux, Heat transfer, Integrated circuits, Junctions
Proceedings Papers

Acoustic Microscopy for Micro Electrical Interconnections

Hironori Tohmyoh, Tsuyoshi Akaogi, Masumi Saka
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1689-1693, July 17–22, 2005
Paper No: IPACK2005-73061
DOI: https://doi.org/10.1115/IPACK2005-73061
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Topics: Acoustics, Microscopy, Design, Printed circuit boards, Silicon chips
Proceedings Papers

Thermal Based Optimization of Functional Block Distributions in a Non-Uniformly Powered Die

Abhijit Kaisare, Dereje Agonafer, A. Haji-Sheikh, Greg Chrysler, Ravi Mahajan
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 675-682, July 17–22, 2005
Paper No: IPACK2005-73486
DOI: https://doi.org/10.1115/IPACK2005-73486
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Topics: Optimization, Design, Heat flux, Clocks, Energy dissipation, Finite element analysis, Finite element methods, Finite element model, Junctions, Separation (Technology)
Proceedings Papers

Measurement of Local Residual Stress of a Flip Chip Structure Using a Stress Sensing Chip

Nobuki Ueta, Hideo Miura
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1135-1140, July 17–22, 2005
Paper No: IPACK2005-73112
DOI: https://doi.org/10.1115/IPACK2005-73112
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Topics: Flip-chip, Flip-chip devices, Stress, Sensors, Silicon chips, Strain gages, Finite element analysis, Gages, Polysilicon, Semiconductor wafers
Proceedings Papers

Non-Destructive Inspection Method for Detecting Open Failures in Flip Chip Structures

Yuhki Sato, Hideo Miura
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1587-1592, July 17–22, 2005
Paper No: IPACK2005-73109
DOI: https://doi.org/10.1115/IPACK2005-73109
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Topics: Failure, Flip-chip, Flip-chip devices, Nondestructive evaluation, Deformation, Silicon chips, Adhesion, Bonding, Delamination, Diluents
Proceedings Papers

Chip in Polymer: 3D Integration of Active Circuitry in Polymeric Substrate

Erik Jung, Dirk Wojakowski, Alexander Neumann, Andreas Ostmann, Rolf Aschenbrenner, Herbert Reichl
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 47-51, July 6–11, 2003
Paper No: IPACK2003-35025
DOI: https://doi.org/10.1115/IPACK2003-35025
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Topics: Bricks, Electronic products, Laminates, Manufacturing, Microelectromechanical systems, Polymers, Silicon, Silicon chips, System-in-package, Thermal management