Search Results | InterPACK | ASME Digital Collection

1-20 of 64

Sort by

Sort Order Select

Proceedings Papers

Thermal Performance of Modular Microconvective Heat Sinks for Multi-Die Processor Assemblies

Chris May, Jordan Mizerak, David Earley, Bernard Malouin

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A017, October 26–28, 2021

Paper No: IPACK2021-74016

DOI: https://doi.org/10.1115/IPACK2021-74016

View Paper

Topics: Cooling, Data centers, Heat sinks, Power density, Heat, Semiconductors (Materials), Temperature, Density, Energy consumption, Flow (Dynamics)

Proceedings Papers

Thermal Transport Across Al-(Al x Ga 1-x ) 2 O 3 and Al-Ga 2 O 3 Interfaces

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A005, October 26–28, 2021

Paper No: IPACK2021-74116

DOI: https://doi.org/10.1115/IPACK2021-74116

View Paper

Topics: Alloys, Aluminum, Cathode rays, Chemical reactions, Cooling, Electrical conductance, Electron beams, Electronics, Energy dissipation, Gallium

Proceedings Papers

Fan-Out MCM Solutions Study for Heterogeneous Integration on Intelligent Computing Application

Chu-Pao (Otis) Hung, Yu-Po Wang, Steven Chen, Katch Wan

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A002, October 27–29, 2020

Paper No: IPACK2020-2528

DOI: https://doi.org/10.1115/IPACK2020-2528

View Paper

Topics: Computers, Design, Diluents, Glass, Internet, Manufacturing, Packaging, Semiconductor wafers, Semiconductors (Materials), Smart appliances

Proceedings Papers

Automated Method Using Finite Element Analysis to Identify Plated Through Holes and Microvia Stacks at Failure Risk in Complex PCB Designs

Kourosh M. Kalayeh, Natalie Hernandez, Nathan Blattau, Craig Hillman

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A001, October 7–9, 2019

Paper No: IPACK2019-6347

DOI: https://doi.org/10.1115/IPACK2019-6347

View Paper

Topics: Failure, Finite element analysis, Risk, Reliability, Engineering simulation, Finite element methods, Finite element model, Simulation, Algorithms, Circuits

Proceedings Papers

Design, Analysis and Comparison of Insulated Metal Substrates for High Power Wide-Bandgap Power Modules

Emre Gurpinar, Burak Ozpineci, Shajjad Chowdhury

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A013, October 7–9, 2019

Paper No: IPACK2019-6436

DOI: https://doi.org/10.1115/IPACK2019-6436

View Paper

Topics: Design, Energy gap, Metals, Transients (Dynamics), Ceramics, Copper, Finite element analysis, Materials properties, MOSFET transistors, Semiconductors (Materials)

Proceedings Papers

Analysis of Thermal Properties of Power Multifinger HEMT Devices

Aleš Chvála, Robert Szobolovszký, Jaroslav Kováč, Jr., Martin Florovič, Juraj Marek, Luboš Černaj, Patrik Príbytný, Daniel Donoval, Jaroslav Kováč, Sylvain Laurent Delage, Jean-Claude Jacquet

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, August 27–30, 2018

Paper No: IPACK2018-8256

DOI: https://doi.org/10.1115/IPACK2018-8256

View Paper

Topics: Cooling, Design, Electrons, Gallium nitride, Heat, Manufacturing, Mechanical admittance, Optimization, Packaging, Raman spectroscopy

Proceedings Papers

On Thermal Interface Materials With Polydisperse Fillers: Packing Algorithm and Effective Properties

Piyas Chowdhury, Kamal Sikka, Anuja De Silva, Indira Seshadri

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A007, August 27–30, 2018

Paper No: IPACK2018-8337

DOI: https://doi.org/10.1115/IPACK2018-8337

View Paper

Topics: Algorithms, Fillers (Materials), Packing (Shipments), Packings (Cushioning), Design, Elastic moduli, Heat, Thermal conductivity, Viscosity, Errors

Proceedings Papers

Numerical and Experimental Determination of Temperature Distribution in 3D Stacked Power Devices

Adam Morgan, Leila Choobineh, David Fresne, Douglas C. Hopkins

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A002, August 29–September 1, 2017

Paper No: IPACK2017-74222

DOI: https://doi.org/10.1115/IPACK2017-74222

View Paper

Topics: Temperature distribution, Electronic packaging, Packaging, Power density, Power semiconductor devices, Power conversion systems, Temperature, Computer simulation, Density, Gallium nitride

Proceedings Papers

Temperature-Based Request Distribution for Effective CRAC and Equipment Life-Cycle Extension

Yusuke Nakajo, Hiroaki Nishi

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A014, August 29–September 1, 2017

Paper No: IPACK2017-74341

DOI: https://doi.org/10.1115/IPACK2017-74341

View Paper

Topics: Cycles, Temperature, Data centers, Stress, Air conditioning, Failure, Heat, Maintenance, Semiconductors (Materials), Energy consumption

Proceedings Papers

Thermo-Optic Tuning Efficiency of Micro Ring Resonators on Low Thermal Resistance Silicon Photonics Substrates

Shenghui Lei, Alexandre Shen, Ryan Enright

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A009, August 29–September 1, 2017

Paper No: IPACK2017-74181

DOI: https://doi.org/10.1115/IPACK2017-74181

View Paper

Topics: Photonics, Silicon, Thermal resistance, Etching, Silicon-on-insulator, Cladding systems (Building), Thermal conductivity, Aluminum, Crystals, Diffusion (Physics)

Proceedings Papers

3D Wire Bondless Integration: The Future of Silicon Carbide (SiC) Packaging

Sayan Seal, Andrea K. Wallace, John E. Zumbro, H. Alan Mantooth

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A015, August 29–September 1, 2017

Paper No: IPACK2017-74213

DOI: https://doi.org/10.1115/IPACK2017-74213

View Paper

Topics: Packaging, Silicon, Wire, MOSFET transistors, Bonding, Electromagnetic interference, Electronics, Energy gap, Flip-chip, High temperature

Proceedings Papers

Chip Package Interaction Study to Analyze the Mechanical Integrity of a 3-D TSV Package

Pavan Rajmane, Fahad Mirza, Hassaan Khan, Dereje Agonafer

Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A009, July 6–9, 2015

Paper No: IPACK2015-48811

DOI: https://doi.org/10.1115/IPACK2015-48811

View Paper

Topics: Circuits, Damage, Electronics, Energy dissipation, Gates (Closures), Graphics processing units, Heating, Joules, Manufacturing, Modeling

Proceedings Papers

The Prediction of the Thermal Conductivity of Gallium Arsenide: A Molecular Dynamics Study

Fernan Saiz, Cristina H. Amon

Paper No: IPACK2015-48114

DOI: https://doi.org/10.1115/IPACK2015-48114

View Paper

Topics: Gallium arsenide, Molecular dynamics, Thermal conductivity, Temperature, Acoustics, Density, Design, Electromagnetic scattering, Equilibrium (Physics), Heat

Proceedings Papers

A Basic Study on Creep-Fatigue Damages Interaction for Sn-3.0Ag-0.5Cu as Lead Free Solder Material

Hirokazu Oriyama, Takashi Kawakami, Takahiro Kinoshita

Paper No: IPACK2015-48138

DOI: https://doi.org/10.1115/IPACK2015-48138

View Paper

Topics: Creep, Damage, Fatigue, Lead-free solders, Tin, Solder joints, Electronics, Design engineering, Fatigue damage, Stress

Proceedings Papers

Thermal Stress Simulation for 3D SiP With TSV Structure Under Unsteady Thermal Loads

Takahiro Kinoshita, Takashi Kawakami, Tomoya Sugiura, Keiji Matsumoto, Sayuri Kohara, Yasumitsu Orii

Paper No: IPACK2015-48142

DOI: https://doi.org/10.1115/IPACK2015-48142

View Paper

Topics: Simulation, Stress, Thermal stresses, Finite element methods, Heat, Temperature, Cooling, Damage, Packaging, Reliability

Proceedings Papers

Chlorine-Ion Related Corrosion in Cu-Al Wirebond Microelectronic Packages

Pradeep Lall, Yihua Luo, Luu Nguyen

Paper No: IPACK2015-48639

DOI: https://doi.org/10.1115/IPACK2015-48639

View Paper

Topics: Corrosion, Wire, Diffusion (Physics), Electrolytic corrosion, Ions, Copper, Electrical resistivity, Molding, Temperature, Deformation

Proceedings Papers

Effects of Low CTE Materials on Thermal Deformation of Organic Substrates in Flip Chip Package Application

Hiroyuki Mori, Sayuri Kohara, Keishi Okamoto, Hirokazu Noma, Kazushige Toriyama

Paper No: IPACK2015-48741

DOI: https://doi.org/10.1115/IPACK2015-48741

View Paper

Topics: Flip-chip packages, Thermal deformation, Warping, Finite element analysis, Manufacturing, Package on package, Shapes, Deformation, Finite element model, Flip-chip

Proceedings Papers

Improvement of the Long-Term Reliability of Interconnection by Controlling the Crystallinity of Grain Boundaries

Takahiro Nakanishi, Ken Suzuki, Hideo Miura

Paper No: IPACK2015-48200

DOI: https://doi.org/10.1115/IPACK2015-48200

View Paper

Topics: Grain boundaries, Reliability, Copper, Thin films, Electrical resistivity, Electron backscatter diffraction, Brittleness, Diffusion (Physics), Dislocations, Focused ion beams

Proceedings Papers

Effect of Three Dimensional Strain on the Electronic Properties of Graphene Nanoribbons

Meng Yang, Masato Ohnishi, Ken Suzuki, Hideo Miura

Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A002, July 6–9, 2015

Paper No: IPACK2015-48239

DOI: https://doi.org/10.1115/IPACK2015-48239

View Paper

Topics: Graphene, Strain sensors, Chemical vapor deposition, Copper foil, Deformation, Energy gap, Reactive-ion etching, Tensile deformation, Density functional theory, Electron configuration

Proceedings Papers

Investigation of Liquid Metal Ohmic Contacts for Graphene Photonic Devices

Richard C. Ordonez, Noah Acosta, Jordan Melcher, Nackieb Kamin, David Garmire

Paper No: IPACK2015-48567

DOI: https://doi.org/10.1115/IPACK2015-48567

View Paper

Topics: Graphene, Liquid metals, Ohmic contacts, Photonic equipment, Contact resistance, Carbon, Engineering standards, Overlays (Materials engineering), Oxidation, Pressure

NARROW

Thermal Performance of Modular Microconvective Heat Sinks for Multi-Die Processor Assemblies

Thermal Transport Across Al-(Al x Ga 1-x ) 2 O 3 and Al-Ga 2 O 3 Interfaces

Fan-Out MCM Solutions Study for Heterogeneous Integration on Intelligent Computing Application

Automated Method Using Finite Element Analysis to Identify Plated Through Holes and Microvia Stacks at Failure Risk in Complex PCB Designs

Design, Analysis and Comparison of Insulated Metal Substrates for High Power Wide-Bandgap Power Modules

Analysis of Thermal Properties of Power Multifinger HEMT Devices

On Thermal Interface Materials With Polydisperse Fillers: Packing Algorithm and Effective Properties

Numerical and Experimental Determination of Temperature Distribution in 3D Stacked Power Devices

Temperature-Based Request Distribution for Effective CRAC and Equipment Life-Cycle Extension

Thermo-Optic Tuning Efficiency of Micro Ring Resonators on Low Thermal Resistance Silicon Photonics Substrates

3D Wire Bondless Integration: The Future of Silicon Carbide (SiC) Packaging

Chip Package Interaction Study to Analyze the Mechanical Integrity of a 3-D TSV Package

The Prediction of the Thermal Conductivity of Gallium Arsenide: A Molecular Dynamics Study

A Basic Study on Creep-Fatigue Damages Interaction for Sn-3.0Ag-0.5Cu as Lead Free Solder Material

Thermal Stress Simulation for 3D SiP With TSV Structure Under Unsteady Thermal Loads

Chlorine-Ion Related Corrosion in Cu-Al Wirebond Microelectronic Packages

Effects of Low CTE Materials on Thermal Deformation of Organic Substrates in Flip Chip Package Application

Improvement of the Long-Term Reliability of Interconnection by Controlling the Crystallinity of Grain Boundaries

Effect of Three Dimensional Strain on the Electronic Properties of Graphene Nanoribbons

Investigation of Liquid Metal Ohmic Contacts for Graphene Photonic Devices

Journals

Conference Proceedings

eBooks

Resources

Opportunities

Journals

Conference Proceedings

eBooks

Resources

Opportunities

This Feature Is Available To Subscribers Only