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Proceedings Papers

Determination of High and Low Temperature High Strain Rate Mechanical Properties for SAC-R After Exposure to Isothermal Aging of 50°C Up To 8 Months

Pradeep Lall, Mrinmoy Saha, Jeff Suhling, Ken Blecker
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A022, October 26–28, 2021
Paper No: IPACK2021-74069
DOI: https://doi.org/10.1115/IPACK2021-74069
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Topics: Low temperature, Mechanical properties, Storage, Temperature, Alloys, Solders, Avionics, Climate, Design, Electronic packages
Proceedings Papers

Thermal and Electrical Co-Optimization of a Multi-Chip Double-Sided Cooled GaN Module

Hayden Carlton, Md Maksudul Hossain, Arman Ur Rashid, Yuxiang Chen, Alan Mantooth, Asif Imran, Fang Luo, John Harris, Alexis Krone, David Huitink
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A004, October 26–28, 2021
Paper No: IPACK2021-72726
DOI: https://doi.org/10.1115/IPACK2021-72726
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Topics: Bridges (Structures), Cooling, Gallium nitride, Gates (Closures), Optimization
Proceedings Papers

High Strain Rate Low Temperature Properties for SAC-R After Exposure to Isothermal Aging

Pradeep Lall, Mrinmoy Saha, Jeff Suhling, Ken Blecker
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A010, October 27–29, 2020
Paper No: IPACK2020-2659
DOI: https://doi.org/10.1115/IPACK2020-2659
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Topics: Alloys, Avionics, Climate, Design, Electronic packages, Electronic packaging, High temperature, Lead-free solders, Low temperature, Low temperature materials
Proceedings Papers

Liquid-Cooled Heat Sink Optimization for Thermal Imbalance Mitigation in Wide-Bandgap Power Modules

Raj Sahu, Emre Gurpinar, Burak Ozpineci
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A001, October 27–29, 2020
Paper No: IPACK2020-2516
DOI: https://doi.org/10.1115/IPACK2020-2516
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Topics: Energy gap, Heat sinks, Optimization, Cooling, Heat, Energy conversion, Power semiconductor devices, Reliability, Semiconductor devices, Steady state
Proceedings Papers

Evaluation of Single Phase Immersion Cooling System for High Performance Server Chassis Using Dielectric Coolants

Shuai Shao, Tianyi Gao, Huawei Yang, Jie Zhao, Jiajun Zhang
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A010, October 27–29, 2020
Paper No: IPACK2020-2670
DOI: https://doi.org/10.1115/IPACK2020-2670
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Topics: Coolants, Cooling, Cooling systems, Fluids, Graphics processing units, Power density, Data centers, Temperature, Decision making, Density
Proceedings Papers

Effects of Cooling Architecture and PCB Layout Co-Design on the Concurrent Thermal and Electrical Performance of an On-Board Electric Vehicle Charger

Omri Tayyara, Kshitij Gupta, Carlos Da Silva, Miad Nasr, Amir Assadi, Olivier Trescases, Cristina H. Amon
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A012, October 7–9, 2019
Paper No: IPACK2019-6434
DOI: https://doi.org/10.1115/IPACK2019-6434
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Topics: Cooling, Design, Electric vehicles, Vehicles, Circuits, Density, Dynamics (Mechanics), Energy dissipation, Engineering prototypes, Engineering simulation
Proceedings Papers

Additive Manufactured, Low EMI, Non-Metallic Convective Heat Spreader Design and Optimization

Reece Whitt, David Huitink, Skyler Hudson, Bakhtiyar Nafis, Zhao Yuan, Balaji Narayanasamy, Amol Deshpande, Fang Luo, Asif Imran, Zion Clarke, Sonya Smith
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A015, October 7–9, 2019
Paper No: IPACK2019-6442
DOI: https://doi.org/10.1115/IPACK2019-6442
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Topics: Additive manufacturing, Design, Flat heat pipes, Optimization, Heat, Convection, Heat sinks, Nonmetallic materials, Thermal management, Density
Proceedings Papers

Thermal Analysis of 3D ICs With TSVs Placement Optimization

Zongqing Ren, Ayed Alqahtani, Nader Bagherzadeh, Jaeho Lee
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A006, October 7–9, 2019
Paper No: IPACK2019-6417
DOI: https://doi.org/10.1115/IPACK2019-6417
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Topics: Algorithms, Anisotropy, Delays, Heat transfer, Integrated circuits, Optimization, Power density, Signals, Silicon, Simulated annealing
Proceedings Papers

Computational Analysis for Thermal Optimization of Server for Single Phase Immersion Cooling

Dhruvkumar Gandhi, Uschas Chowdhury, Tushar Chauhan, Pratik Bansode, Satyam Saini, Jimil M. Shah, Dereje Agonafer
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A013, October 7–9, 2019
Paper No: IPACK2019-6587
DOI: https://doi.org/10.1115/IPACK2019-6587
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Topics: Cooling, Fluids, Optimization
Proceedings Papers

Experimental Analysis for Optimization of Thermal Performance of a Server in Single Phase Immersion Cooling

Pravin A. Shinde, Pratik V. Bansode, Satyam Saini, Rajesh Kasukurthy, Tushar Chauhan, Jimil M. Shah, Dereje Agonafer
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A014, October 7–9, 2019
Paper No: IPACK2019-6590
DOI: https://doi.org/10.1115/IPACK2019-6590
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Topics: Cooling, Data centers, Experimental analysis, Optimization, Temperature
Proceedings Papers

CFD Analysis of Thermal Shadowing and Optimization of Heatsinks in 3 rd Generation Open Compute Server for Single-Phase Immersion Cooling

Jimil M. Shah, Ravya Dandamudi, Chinmay Bhatt, Pranavi Rachamreddy, Pratik Bansode, Dereje Agonafer
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A015, October 7–9, 2019
Paper No: IPACK2019-6600
DOI: https://doi.org/10.1115/IPACK2019-6600
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Topics: Computational fluid dynamics, Cooling, Heat sinks, Optimization
Proceedings Papers

Analysis of Thermal Properties of Power Multifinger HEMT Devices

Aleš Chvála, Robert Szobolovszký, Jaroslav Kováč, Jr., Martin Florovič, Juraj Marek, Luboš Černaj, Patrik Príbytný, Daniel Donoval, Jaroslav Kováč, Sylvain Laurent Delage, Jean-Claude Jacquet
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, August 27–30, 2018
Paper No: IPACK2018-8256
DOI: https://doi.org/10.1115/IPACK2018-8256
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Topics: Cooling, Design, Electrons, Gallium nitride, Heat, Manufacturing, Mechanical admittance, Optimization, Packaging, Raman spectroscopy
Proceedings Papers

Thermal-Hydraulic Performance and Optimization of Tube Ellipticity in a Plate Fin-and-Tube Heat Exchanger

Zhuo Yang, Tariq Amin Khan, Wei Li, Hua Zhu, Zhijian Sun, Zhengjiang Zhang, Jincai Du, Jianxin Zhou
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A022, August 27–30, 2018
Paper No: IPACK2018-8448
DOI: https://doi.org/10.1115/IPACK2018-8448
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Topics: Heat exchangers, Optimization, Artificial neural networks, Flow (Dynamics), Reynolds number, Friction, Pressure drop, Computational fluid dynamics, Computer simulation, Design
Proceedings Papers

Numerical Investigation of Shape Effect on Microdroplet Evaporation

Shuai Shuai, Zichen Du, Binjian Ma, Li Shan, Baris Dogruoz, Damena Agonafer
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A010, August 27–30, 2018
Paper No: IPACK2018-8311
DOI: https://doi.org/10.1115/IPACK2018-8311
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Topics: Evaporation, Shapes, Drops, Vapors, Cooling, Computer cooling, Computer simulation, Design, Diffusion (Physics), Electric fields
Proceedings Papers

Rack-Level Study of Hybrid Cooled Servers Using Warm Water Cooling With Variable Pumping for Centralized Coolant System

Manasa Sahini, Chinmay Kshirsagar, Patrick McGinn, Dereje Agonafer
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A003, August 27–30, 2018
Paper No: IPACK2018-8255
DOI: https://doi.org/10.1115/IPACK2018-8255
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Topics: Coolants, Cooling, Water, Data centers, Pumps, Stress, Temperature, Energy consumption, Heat exchangers, Exhaust systems
Proceedings Papers

Feasibility of PCB-Integrated Vibration Sensors for Condition Monitoring of Electronic Systems

Klas Brinkfeldt, Göran Wetter, Andreas Lövberg, Per-Erik Tegehall, Dag Andersson, Jan Strandberg, Johnny Goncalves, Jonas Söderlund, Mikael Kwarnmark
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A009, August 27–30, 2018
Paper No: IPACK2018-8386
DOI: https://doi.org/10.1115/IPACK2018-8386
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Topics: Condition monitoring, Electronic systems, Sensors, Vibration, Failure, Delamination, Electronics, Manufacturing, Physics, Reflow soldering
Proceedings Papers

Optimization of Filling Mass Fraction for Composite PCMs Based Thermal Management System

Bofeng Shang, Jinyan Hu, Xingjian Yu, Bin Xie, Ruikang Wu, Xiaobing Luo
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A027, August 29–September 1, 2017
Paper No: IPACK2017-74196
DOI: https://doi.org/10.1115/IPACK2017-74196
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Topics: Composite materials, Optimization, Phase change materials, Thermal management, Thermal conductivity, Latent heat, Temperature, Heat flux, Cooling, Graphite
Proceedings Papers

Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips

D. Gonzalez Cuadrado, A. Marconnet, G. Paniagua
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A028, August 29–September 1, 2017
Paper No: IPACK2017-74224
DOI: https://doi.org/10.1115/IPACK2017-74224
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Topics: Heat conduction, Heat transfer, Integrated circuits, Interpolation, Temperature sensors, Temperature, Optimization, Sensors, Finite element analysis, Genetic algorithms
Proceedings Papers

Role of a Liquid Accumulator in a Passive Two-Phase Liquid Cooling System for Electronics: Experimental Analysis

Nicolas Lamaison, Raffaele L. Amalfi, Jackson B. Marcinichen, John R. Thome, Todd Salamon
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A001, August 29–September 1, 2017
Paper No: IPACK2017-74020
DOI: https://doi.org/10.1115/IPACK2017-74020
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Topics: Cooling systems, Electronics, Experimental analysis, Secondary cells, Boiling, Computer cooling, Condensers (steam plant), Cooling, Cylinders, Electronic components
Proceedings Papers

CFD Optimization of the Cooling of Yosemite Open Compute Server

Aditya Gupta, Ananthavijayan Sridhar, Dereje Agonafer
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A011, August 29–September 1, 2017
Paper No: IPACK2017-74254
DOI: https://doi.org/10.1115/IPACK2017-74254
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Topics: Computational fluid dynamics, Cooling, Optimization, Air flow, Data centers, Design, Energy consumption, Flow (Dynamics), Fans, Modeling