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Proceedings Papers

Damage Progression in Fuze Assemblies Subjected to High-G Mechanical Shock Using X-Ray Digital Volume Correlation

Pradeep Lall, Nakul Kothari, John Deep
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A008, August 29–September 1, 2017
Paper No: IPACK2017-74269
DOI: https://doi.org/10.1115/IPACK2017-74269
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Topics: Damage, Shock (Mechanics), X-rays, Reliability, Deformation, Failure, Imaging, Manufacturing, Nondestructive evaluation, Service life (Equipment)
Proceedings Papers

In-Situ Monitoring via Synchrotron Radiation Laminography of Thermal Fatigue Cracks at Die-Attached Joints Under Cyclic Energization Loading

Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Masato Hoshino, Kentaro Uesugi, Junya Ooi, Takao Mori
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A015, August 29–September 1, 2017
Paper No: IPACK2017-74177
DOI: https://doi.org/10.1115/IPACK2017-74177
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Topics: Fatigue cracks, Synchrotron radiation, X-rays, Solders, Fracture (Materials), Nondestructive evaluation, Ceramics, Crack propagation, Cycles, Delamination
Proceedings Papers

Nondestructive Observation of Thermal Fatigue Crack Propagation in FBGA and Die Attached Solder Joints by Synchrotron Radiation X-Ray Laminography

Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Masato Hoshino, Kentaro Uesugi, Takuya Hanamura, Takao Mori
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A024, July 6–9, 2015
Paper No: IPACK2015-48553
DOI: https://doi.org/10.1115/IPACK2015-48553
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Topics: Fatigue cracks, Solder joints, Synchrotron radiation, X-rays, Solders, Crack propagation, Fracture (Materials), Microcracks, Ball-Grid-Array packaging, Ceramics
Proceedings Papers

Thermal Diffusion Tomography for Quantitative Non-Destructive Characterization of Electronic Packages

Bahar Öner, Hakan Ertürk
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A055, July 6–9, 2015
Paper No: IPACK2015-48333
DOI: https://doi.org/10.1115/IPACK2015-48333
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Topics: Electronic packages, Nondestructive evaluation, Thermal diffusion, Heat, Acoustics, Algorithms, Contact resistance, Density, Energy dissipation, Flat heat pipes
Proceedings Papers

Survivability of MEMS Accelerometer Under Sequential Thermal and High-G Mechanical Shock Environments

Pradeep Lall, Amrit Abrol, Lee Simpson, Jessica Glover
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A013, July 6–9, 2015
Paper No: IPACK2015-48790
DOI: https://doi.org/10.1115/IPACK2015-48790
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Topics: Accelerometers, Microelectromechanical systems, Shock (Mechanics), Reliability, Automotive industry, Complementary metal oxide semiconductors, Design, Failure mechanisms, Low temperature, Lumber
Proceedings Papers

Application of Synchrotron Radiation X-Ray Laminography to Nondestructive Evaluation of the Fatigue Crack Propagation Process in Flip Chip Solder Joints

Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Kentaro Uesugi, Masato Hoshino, Takao Mori
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A001, July 16–18, 2013
Paper No: IPACK2013-73091
DOI: https://doi.org/10.1115/IPACK2013-73091
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Topics: Fatigue cracks, Flip-chip, Flip-chip devices, Nondestructive evaluation, Solder joints, Synchrotron radiation, X-rays, Fracture (Materials), Microcracks, Solders
Proceedings Papers

Three Dimensional and Nondestructive Evaluation of Thermal Fatigue Crack Propagation Process in Complex-Shaped Solder Joints by Synchrotron Radiation X-Ray Micro-Tomography

Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Kentaro Uesugi, Takao Mori
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 443-451, July 6–8, 2011
Paper No: IPACK2011-52047
DOI: https://doi.org/10.1115/IPACK2011-52047
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Topics: Fatigue cracks, Nondestructive evaluation, Solder joints, Synchrotron radiation, X-rays, Crack propagation, Fatigue, Fracture (Materials), Microcracks, Computerized tomography
Proceedings Papers

Nondestructive Evaluation of Thermal Fatigue Crack Propagation in Sn-Ag-Cu Solder Joints by Synchrotron Radiation X-Ray Micro-Tomography

Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Kentaro Uesugi, Takao Mori
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 761-769, July 19–23, 2009
Paper No: InterPACK2009-89155
DOI: https://doi.org/10.1115/InterPACK2009-89155
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Topics: Fatigue cracks, Nondestructive evaluation, Solder joints, Synchrotron radiation, Tin, X-rays, Solders, Crack propagation, Cycles, Computerized tomography
Proceedings Papers

Application of Synchrotron Radiation X-Ray Micro-Tomography to Nondestructive Evaluation of Thermal Fatigue Damage in Flip Chip Interconnects

Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Kentaro Uesugi, Takso Mori
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 523-529, July 8–12, 2007
Paper No: IPACK2007-33170
DOI: https://doi.org/10.1115/IPACK2007-33170
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Topics: Fatigue damage, Flip-chip, Flip-chip devices, Nondestructive evaluation, Synchrotron radiation, X-rays, Solders, Cycles, Fatigue cracks, Computerized tomography
Proceedings Papers

Development of a Nondestructive Inspection Method for Detecting Open Failures of Micro Bump Interconnections in Three Dimensionally Stacked LSI Chips

Yuki Sato, Hideo Miura
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 473-479, July 8–12, 2007
Paper No: IPACK2007-33257
DOI: https://doi.org/10.1115/IPACK2007-33257
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Topics: Failure, Nondestructive evaluation, Deformation, Delamination, Finite element analysis, Surface deformation, Diluents, Epoxy resins, Lasers, Microscopes
Proceedings Papers

Evaluation of and Inspection Metrology for Lid Attach for Advanced Thermal Packaging Materials

Margaret Stern, Bob Melanson, Vadim Gektin, Paul Hundt, Carlos Arroyo, Vikas Gupta, Kazumi Nakayoshi, Lyndon Larson, Jesus Marin, David McDougall, Dorab Bhagwagar
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 309-317, July 8–12, 2007
Paper No: IPACK2007-33629
DOI: https://doi.org/10.1115/IPACK2007-33629
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Topics: Delamination, Inspection, Metrology, Nondestructive evaluation, Packaging, X-rays, Silicones, Acoustics, Finishes, Adhesion
Proceedings Papers

Non-Destructive Inspection Method for Detecting Open Failures in Flip Chip Structures

Yuhki Sato, Hideo Miura
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1587-1592, July 17–22, 2005
Paper No: IPACK2005-73109
DOI: https://doi.org/10.1115/IPACK2005-73109
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Topics: Failure, Flip-chip, Flip-chip devices, Nondestructive evaluation, Deformation, Silicon chips, Adhesion, Bonding, Delamination, Diluents
Proceedings Papers

Nondestructive Evaluation of Thermal Phase Growth in Solder Ball Micro-Joints by Synchrotron Radiation X-Ray Micro-Tomography

Toshihiko Sayama, Hiroyuki Tsuritani, Kentaro Uesugi, Akira Tsuchiyama, Tsukasa Nakano, Hideyuki Yasuda, Takeshi Takayanagi, Takao Mori
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1115-1121, July 17–22, 2005
Paper No: IPACK2005-73083
DOI: https://doi.org/10.1115/IPACK2005-73083
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Topics: Nondestructive evaluation, Solders, Synchrotron radiation, X-rays, Joining, Reliability, Tin, Cycles, Density, Flip-chip
Proceedings Papers

Nondestructive Inspection of Chip Size Package by Millimeter Waves

Yang Ju, Hiroshi Yamamoto, Masumi Saka
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 765-768, July 6–11, 2003
Paper No: IPACK2003-35118
DOI: https://doi.org/10.1115/IPACK2003-35118
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Topics: Millimeter waves, Nondestructive evaluation, Delamination, Reflectance, Resolution (Optics), Sensors, Silicon chips, Solders