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Proceedings Papers

Temperature Cycling Study of Aerosol-Jet Printed Conductive Silver Traces in Printed Electronics

Beihan Zhao, Christopher Riso, David Leslie, Abhijit Dasgupta, Siddhartha Das, Jason Fleischer, Daniel Hines
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A008, October 26–28, 2021
Paper No: IPACK2021-73197
DOI: https://doi.org/10.1115/IPACK2021-73197
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Topics: Aerosols, Electronics, Finite element methods, Finite element model, Modeling, Printing, Silver, Temperature
Proceedings Papers

Automated Method Using Finite Element Analysis to Identify Plated Through Holes and Microvia Stacks at Failure Risk in Complex PCB Designs

Kourosh M. Kalayeh, Natalie Hernandez, Nathan Blattau, Craig Hillman
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A001, October 7–9, 2019
Paper No: IPACK2019-6347
DOI: https://doi.org/10.1115/IPACK2019-6347
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Topics: Failure, Finite element analysis, Risk, Reliability, Engineering simulation, Finite element methods, Finite element model, Simulation, Algorithms, Circuits
Proceedings Papers

Thermal Interface Materials Enhanced by Micro and Nanostructures

Mei-Chien Lu
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A009, August 27–30, 2018
Paper No: IPACK2018-8307
DOI: https://doi.org/10.1115/IPACK2018-8307
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Topics: Architecture, Corners (Structural elements), Design, Electronic packages, Electronics, Energy gap, Failure, Finite element methods, High temperature, Nanostructures
Proceedings Papers

The Effects of Temperature, Strain Rate, and Aging on the Poisson’s Ratio of SAC Lead Free Solders

K. M. Rafidh Hassan, Mohammad S. Alam, Munshi Basit, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A006, August 27–30, 2018
Paper No: IPACK2018-8410
DOI: https://doi.org/10.1115/IPACK2018-8410
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Topics: Lead-free solders, Poisson ratio, Temperature effects, Solders, Temperature, Cooling, Finite element analysis, Finite element methods, Finite element model, Reliability
Proceedings Papers

Stress-Based Design Standard for 3216 Type of Multilayer Ceramic Capacitor

Takahiro Kinoshita, Takashi Kawakami, Tadaharu Adachi, Masahiro Funaki
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A014, August 29–September 1, 2017
Paper No: IPACK2017-74099
DOI: https://doi.org/10.1115/IPACK2017-74099
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Topics: Capacitors, Ceramics, Design, Stress, Finite element methods, Computer simulation, Pressure
Proceedings Papers

Experimental and Analytical Study of Micro-Serrations on Surgical Blades

Marco Giovannini, Newell Moser, Kornel Ehmann
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T03A004, July 6–9, 2015
Paper No: IPACK2015-48046
DOI: https://doi.org/10.1115/IPACK2015-48046
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Topics: Blades, Surgery, Cutting, Biological tissues, Finite element methods, Friction, Biomedicine, Laser ablation, Machining, Skin
Proceedings Papers

ALE-FEM for Two-Phase Flows With Heat and Mass Transfer in Microchannels

Gustavo R. Anjos, Norberto Mangiavacchi, Jose Pontes, John Thome
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A026, July 6–9, 2015
Paper No: IPACK2015-48441
DOI: https://doi.org/10.1115/IPACK2015-48441
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Topics: Finite element methods, Heat, Mass transfer, Microchannels, Two-phase flow, Bubbles, Computer programming, Cooling, Design, Electronics
Proceedings Papers

Thermal Solution of High Flux Phased Radar Antenna for Military Application

Murat Parlak, Murat Yaban
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A008, July 6–9, 2015
Paper No: IPACK2015-48055
DOI: https://doi.org/10.1115/IPACK2015-48055
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Topics: Defense industry, Radar, Design, Cooling, Heat flux, Manifolds, Computational fluid dynamics, Computer software, Finite element methods, Flow (Dynamics)
Proceedings Papers

Evaluation of Intensity of Singularity at 3D Piezoelectric Bonded Joints Using a Conservative Integral

Chonlada Luangarpa, Hideo Koguchi
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A023, July 6–9, 2015
Paper No: IPACK2015-48275
DOI: https://doi.org/10.1115/IPACK2015-48275
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Topics: Electric potential, Finite element methods, Stress, Stress singularity
Proceedings Papers

Mechanism and Model of Bond Formation in Ultrasonic Wire Bonding

T. Calvin Tszeng
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A026, July 6–9, 2015
Paper No: IPACK2015-48613
DOI: https://doi.org/10.1115/IPACK2015-48613
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Topics: Wire bonding, Micromechanics (Engineering), Bonding, Boundary-value problems, Critical phenomena (Physics), Cycles, Engineering simulation, Finite element methods, Finite element model, Flip-chip
Proceedings Papers

Thermal Stress Simulation for 3D SiP With TSV Structure Under Unsteady Thermal Loads

Takahiro Kinoshita, Takashi Kawakami, Tomoya Sugiura, Keiji Matsumoto, Sayuri Kohara, Yasumitsu Orii
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A020, July 6–9, 2015
Paper No: IPACK2015-48142
DOI: https://doi.org/10.1115/IPACK2015-48142
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Topics: Simulation, Stress, Thermal stresses, Finite element methods, Heat, Temperature, Cooling, Damage, Packaging, Reliability
Proceedings Papers

Effect of Temperature Cycling and High Temperature Aging on the Elastic Properties and Failure Modes of Thermal Interface Materials

Taryn J. Davis, Tuhin Sinha, Ken Marston, Sushumna Iruvanti
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A014, July 6–9, 2015
Paper No: IPACK2015-48712
DOI: https://doi.org/10.1115/IPACK2015-48712
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Topics: Adhesion, Aluminum, Elasticity, Failure mechanisms, Finite element analysis, Finite element methods, Finite element model, Flip-chip, High temperature, Mechanical testing
Proceedings Papers

Effects of Thermal Cycle Conditions on Thermal Fatigue Life of Substrate With Cu Through-Hole

Yu Yamayose, Tetsuya Kugimiya, Kenji Hirohata, Akihiko Happoya, Nobutada Ohno, Masao Sakane
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A022, July 6–9, 2015
Paper No: IPACK2015-48247
DOI: https://doi.org/10.1115/IPACK2015-48247
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Topics: Cycles, Fatigue life, Temperature, Finite element methods, Thin films, Glass, Textiles, Constitutive equations, Creep, Epoxy resins
Proceedings Papers

Thermal Behavior of Rectangular Flux Channels With Discretely Specified Contact Flux and Temperature

Masood Razavi, Yuri S. Muzychka, Serpil Kocabiyik
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A050, July 6–9, 2015
Paper No: IPACK2015-48051
DOI: https://doi.org/10.1115/IPACK2015-48051
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Topics: Temperature, Boundary-value problems, Finite element methods, Computer software, Cooling, Flux (Metallurgy), Fourier series, Heat, Heat flux, Laplace equations
Proceedings Papers

Electrical-Thermal-Reliability Co-Design for TSV-Based 3D-ICs

Tiantao Lu, Ankur Srivastava
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A037, July 6–9, 2015
Paper No: IPACK2015-48386
DOI: https://doi.org/10.1115/IPACK2015-48386
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Topics: Design, Reliability, Finite element methods, Stress, Circuits, Design methodology, Electrodiffusion, Flow (Dynamics), Heat conduction, Optimization
Proceedings Papers

Inelastic Thermal Stress Simulation for Si Chip and Insulator Around TSV in 3D SiP

Takahiro Kinoshita, Takashi Kawakami, Takeshi Wakamatsu, Shunpei Shima, Keiji Matsumoto, Sayuri Kohara, Fumiaki Yamada, Yasumitsu Orii
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A009, July 16–18, 2013
Paper No: IPACK2013-73151
DOI: https://doi.org/10.1115/IPACK2013-73151
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Topics: Silicon chips, Simulation, Thermal stresses, Stress, Bending strength, Copper, Finite element methods, Yield stress, Brittleness, Elevations (Drawings)
Proceedings Papers

A Minimal Order Model From Zero to High Frequencies for Finite-Element Based Analysis of General 3-D Electromagnetic Problems

Feng Sheng, Dan Jiao
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T01A003, July 16–18, 2013
Paper No: IPACK2013-73177
DOI: https://doi.org/10.1115/IPACK2013-73177
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Topics: Finite element analysis, Design, Finite element methods, Algorithms, Approximation, Errors, Frequency-domain analysis, Integrated circuits, Linear systems, Modeling
Proceedings Papers

Reliability Evaluation of a 3D SIC Package by the Combination of the SEM-DIC and the FEM

Toru Ikeda, Masatoshi Oka, Noriyuki Miyazaki
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A003, July 16–18, 2013
Paper No: IPACK2013-73126
DOI: https://doi.org/10.1115/IPACK2013-73126
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Topics: Finite element methods, Reliability, Temperature, Finite element analysis, Resins, Electronic packages, Hardening (Curing), Heat, Integrated circuits, Materials properties
Proceedings Papers

A Fracture Mechanics Based Parametric Study of the Copper-to-Copper Direct Thermo-Compression Bonded Interface Using Finite Element Method

Ah-Young Park, Satish Chaparala, Seungbae Park
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T01A006, July 16–18, 2013
Paper No: IPACK2013-73280
DOI: https://doi.org/10.1115/IPACK2013-73280
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Topics: Compression, Copper, Finite element methods, Fracture mechanics, Bonding, Fracture (Materials), Solders, Density, Joining, Temperature
Proceedings Papers

Strain Transfer Analysis of Integrated Surface Acoustic Wave Sensors

Jochen Hempel, Elena Zukowski, Michael Berndt, Sohaib Anees, Jürgen Wilde, Leonhard M. Reindl
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T06A004, July 16–18, 2013
Paper No: IPACK2013-73258
DOI: https://doi.org/10.1115/IPACK2013-73258
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Topics: Sensors, Surface acoustic waves, Strain sensors, Stress, Cycles, Temperature, Fatigue, Finite element methods, Finite element model, Signals