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Proceedings Papers

Effect of Property Evolution of Doped and Undoped SnAgCu Solder Alloys Under Shock and Vibration

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, October 25–27, 2022
Paper No: IPACK2022-97452
DOI: https://doi.org/10.1115/IPACK2022-97452
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Topics: Alloys, Shock (Mechanics), Solders, Vibration, Reliability, Aerospace industry, Climate, Defense industry, Elastic moduli, Electronics
Proceedings Papers

High Strain Rate Properties and Evolution of Plastic-Work for Doped Solder SAC-Q for Isothermal Aging Up to 240-Days at 100°C

Pradeep Lall, Vishal Mehta, Jeff Suhling, Ken Blecker
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A010, October 25–27, 2022
Paper No: IPACK2022-97438
DOI: https://doi.org/10.1115/IPACK2022-97438
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Topics: Shock (Mechanics), Solders, Temperature, Operating temperature, Alloys, High temperature, Stress, Stress-strain curves, Testing, Aerospace industry
Proceedings Papers

Drop Durability of Printed Hybrid Electronic (PHE) Assemblies Under Extreme Acceleration Level

Hisham Abusalma, Abhijit Dasgupta, Andres Bujanda, Jian Yu, Harvey Tsang
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A003, October 25–27, 2022
Paper No: IPACK2022-97382
DOI: https://doi.org/10.1115/IPACK2022-97382
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Topics: Durability, Failure, Domes (Structural elements), Cantilever beams, Disks, Silver, Additive manufacturing, Bending (Stress), Clamps (Tools), Damage
Proceedings Papers

Thermal Optimization of a Silicon Carbide, Half-Bridge Power Module

Gilberto Moreno, Joshua Major, Douglas DeVoto, Faisal Khan, Sreekant Narumanchi, Xuhui Feng, Paul Paret
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A003, October 25–27, 2022
Paper No: IPACK2022-97283
DOI: https://doi.org/10.1115/IPACK2022-97283
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Topics: Bridges (Structures), Electronics, Energy gap, Optimization, Silicon, Design, Thermal resistance, Computational fluid dynamics, Heat exchangers, Fluids
Proceedings Papers

Effect of Aging on High Strain Rate Mechanical Properties of SAC+Bi Solders After Exposure to Isothermal Aging of 50°C Up To 120 Days

Pradeep Lall, Mrinmoy Saha, Jeff Suhling, Ken Blecker
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A013, October 25–27, 2022
Paper No: IPACK2022-97449
DOI: https://doi.org/10.1115/IPACK2022-97449
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Topics: Mechanical properties, Solders, Temperature, Alloys, Storage, Aerospace industry, Automotive industry, Constitutive equations, Finite element analysis, Low temperature materials
Proceedings Papers

Multiphysics Co-Optimization Design and Analysis of a Double-Side-Cooled Silicon Carbide-Based Power Module

Xuhui Feng, Gilberto Moreno, Sreekant Narumanchi, Paul Paret
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A004, October 25–27, 2022
Paper No: IPACK2022-97355
DOI: https://doi.org/10.1115/IPACK2022-97355
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Topics: Cooling, Design, Electronics, Finite element analysis, Optimization, Silicon
Proceedings Papers

Transient Performance and Melt Front Characterization of Phase Change Materials

Tyler Stamps, David Huitink
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A005, October 26–28, 2021
Paper No: IPACK2021-73252
DOI: https://doi.org/10.1115/IPACK2021-73252
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Topics: Phase change materials, Transients (Dynamics), Matlab, Temperature, Computation, Computer simulation, Convection, Finite element analysis, Heat, Heat flux
Proceedings Papers

Numerical Modeling of Continuous Dynamic Recrystallization in Sn-Based Solder Connection Under Cyclic Loading

Marta Kuczynska, Ulrich Becker, Youssef Maniar, Steffen Weihe
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A004, October 26–28, 2021
Paper No: IPACK2021-73319
DOI: https://doi.org/10.1115/IPACK2021-73319
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Topics: Computer simulation, Finite element analysis, Recrystallization, Simulation, Solders, Stress, Tin
Proceedings Papers

Design for Reliability of Automotive Chip Scale Packages by Calibrated Virtual Prototyping

Ralf Döring, R. Dudek, S. Rzepka, L. Scheiter, E. Noack, B. Seiler
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A015, October 26–28, 2021
Paper No: IPACK2021-73970
DOI: https://doi.org/10.1115/IPACK2021-73970
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Topics: Design, Finite element analysis, Reliability, Simulation, Thermomechanics
Proceedings Papers

Nonlocal Damage Modeling of Solder Joint Failure Under Thermomechanical Cyclic Loading

Youssef Maniar, Alexander Kabakchiev, Marta Kuczynska, Masoomeh Bazrafshan, Peter Binkele, Siegfried Schmauder
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A003, October 26–28, 2021
Paper No: IPACK2021-73100
DOI: https://doi.org/10.1115/IPACK2021-73100
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Topics: Damage, Failure, Modeling, Solder joints, Thermomechanics, Finite element analysis, Simulation, Stress, Deformation, Solders
Proceedings Papers

Comparison of Thermal Management Approaches for Integrated Traction Drives in Electric Vehicles

Bidzina Kekelia, J. Emily Cousineau, Kevin Bennion, Sreekant Narumanchi, Shajjad Chowdhury
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A001, October 27–29, 2020
Paper No: IPACK2020-2524
DOI: https://doi.org/10.1115/IPACK2020-2524
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Topics: Electric vehicles, Thermal management, Traction, Electronics, Machinery, Cooling, Cooling systems, Engines, Finite element analysis, Fluids
Proceedings Papers

Validation and Parametric Investigations Using a Lumped Thermal Parameter Model of an Internal Permanent Magnet Motor

Sebastien Sequeira, Kevin Bennion, J. Emily Cousineau, Sreekant Narumanchi, Gilbert Moreno, Satish Kumar, Yogendra Joshi
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A002, October 27–29, 2020
Paper No: IPACK2020-2550
DOI: https://doi.org/10.1115/IPACK2020-2550
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Topics: Electric motors, Engines, Finite element analysis, Motors, Permanent magnets, Sensitivity analysis, Thermal management
Proceedings Papers

PHM Features for Large Circuit Boards to Be Implemented Into Electric Drivetrain Applications

A. Otto, E. Kaulfersch, P. Singh, C. Romano, M. Hildebrandt, S. Rzepka
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A005, October 27–29, 2020
Paper No: IPACK2020-2614
DOI: https://doi.org/10.1115/IPACK2020-2614
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Topics: Printed circuit boards, Thermomechanics, Stress, Ceramics, Control panels, Deformation, Electronic components, Experimental methods, Finite element analysis, Reliability
Proceedings Papers

Automated Method Using Finite Element Analysis to Identify Plated Through Holes and Microvia Stacks at Failure Risk in Complex PCB Designs

Kourosh M. Kalayeh, Natalie Hernandez, Nathan Blattau, Craig Hillman
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A001, October 7–9, 2019
Paper No: IPACK2019-6347
DOI: https://doi.org/10.1115/IPACK2019-6347
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Topics: Failure, Finite element analysis, Risk, Reliability, Engineering simulation, Finite element methods, Finite element model, Simulation, Algorithms, Circuits
Proceedings Papers

Evolution of Anand Parameters With Elevated Temperature Aging for SAC Leadfree Alloys

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A027, October 7–9, 2019
Paper No: IPACK2019-6577
DOI: https://doi.org/10.1115/IPACK2019-6577
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Topics: Alloys, Temperature, Lead-free solders, Solders, Finite element analysis, Avionics, Constitutive equations, Density, Electronic components, Electronics
Proceedings Papers

Thermomechanical Stress and Warpage Augmentation Using Auxetic Features in Electronic Design

Mahsa Montazeri, John Harris, David R. Huitink, Adithya Venkatanarayanan, Simon S. Ang
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A011, October 7–9, 2019
Paper No: IPACK2019-6424
DOI: https://doi.org/10.1115/IPACK2019-6424
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Topics: Design, Stress, Thermomechanics, Warping, Deformation, Finite element analysis, Manufacturing, Electronic packages, Reliability, Temperature
Proceedings Papers

Multi-Scale Thermal Analysis for Design of SiC-Based Medium Voltage Motor Drive

J. Emily Cousineau, Kevin Bennion, Karun Potty, He Li, Risha Na, Longya Xu, Jin Wang
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A030, October 7–9, 2019
Paper No: IPACK2019-6631
DOI: https://doi.org/10.1115/IPACK2019-6631
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Topics: Design, Modeling, Motor drives, Porous materials, Thermal analysis, Computational fluid dynamics, Simulation, Boundary-value problems, Convection, Electronics
Proceedings Papers

Evaluation of Low Order Stress Models for Use in Co-Design Analysis of Electronics Packaging

L. M. Boteler, S. M. Miner
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A003, October 7–9, 2019
Paper No: IPACK2019-6381
DOI: https://doi.org/10.1115/IPACK2019-6381
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Topics: Design, Electronic packaging, Stress, Temperature, Finite element analysis, Army, Design engineering, Flat heat pipes, Heat sinks, Manufacturing
Proceedings Papers

Design, Analysis and Comparison of Insulated Metal Substrates for High Power Wide-Bandgap Power Modules

Emre Gurpinar, Burak Ozpineci, Shajjad Chowdhury
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A013, October 7–9, 2019
Paper No: IPACK2019-6436
DOI: https://doi.org/10.1115/IPACK2019-6436
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Topics: Design, Energy gap, Metals, Transients (Dynamics), Ceramics, Copper, Finite element analysis, Materials properties, MOSFET transistors, Semiconductors (Materials)
Proceedings Papers

Modeling of Underfilled PBGA Assemblies Using Both Viscoelastic and Elastic Material Properties

Promod R. Chowdhury, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A007, October 7–9, 2019
Paper No: IPACK2019-6561
DOI: https://doi.org/10.1115/IPACK2019-6561
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Topics: Fatigue life, Finite element analysis, Materials properties, Modeling, Stress, Viscoelasticity, Temperature, Polymers, Simulation, Relaxation (Physics)