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Proceedings Papers

The Effects of Temperature, Strain Rate, and Aging on the Poisson’s Ratio of SAC Lead Free Solders

K. M. Rafidh Hassan, Mohammad S. Alam, Munshi Basit, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A006, August 27–30, 2018
Paper No: IPACK2018-8410
DOI: https://doi.org/10.1115/IPACK2018-8410
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Topics: Lead-free solders, Poisson ratio, Temperature effects, Solders, Temperature, Cooling, Finite element analysis, Finite element methods, Finite element model, Reliability
Proceedings Papers

Robust Data Acquisition for Building Lighting Systems

Zak Pearson, Tanya L. Crenshaw, Heather Dillon, Erik Paulson, Nick Warlen
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A016, July 6–9, 2015
Paper No: IPACK2015-48445
DOI: https://doi.org/10.1115/IPACK2015-48445
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Topics: Data acquisition, Heat sinks, Cables, Data acquisition systems, Energy efficiency, Temperature, Thermal management
Proceedings Papers

Drop Test for Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) Surface Treatment Application That is Suitable to a Low-Cost, Fine Pitch and Easy Fabrication

Junehyeon Ahn, Hongkwon Kim, Kangho Byun, Youngmin Lee, Donghoon Jang, Byungsung Kim
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 929-935, July 19–23, 2009
Paper No: InterPACK2009-89339
DOI: https://doi.org/10.1115/InterPACK2009-89339
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Topics: Manufacturing, Nickel, Palladium, Surface finishing, Ball-Grid-Array packaging, Solder joints, Chain, Data acquisition, Data acquisition systems, Failure
Proceedings Papers

Characterization of Die Stress Distributions in Area Array Flip Chip Packaging

Jordan Roberts, M. Kaysar Rahim, Jeffrey C. Suhling, Richard C. Jaeger, Pradeep Lall, Ron Zhang
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 977-988, July 19–23, 2009
Paper No: InterPACK2009-89383
DOI: https://doi.org/10.1115/InterPACK2009-89383
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Topics: Flip-chip, Flip-chip devices, Packaging, Stress, Sensors, Ceramics, Adhesives, Cycles, Manufacturing, Silicon
Proceedings Papers

Thermal Characterization of Pulse-Activated Microelectronic Devices by Thermoreflectance-Based Surface Temperature Scanning

Pavel L. Komarov, Mihai G. Burzo, Peter E. Raad
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1413-1420, July 17–22, 2005
Paper No: IPACK2005-73196
DOI: https://doi.org/10.1115/IPACK2005-73196
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Topics: Microelectronic devices, Temperature, Thermal characterization, Thermoreflectance, Reflectance, Silicon, Transients (Dynamics), MOSFET transistors, Resolution (Optics), Calibration