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Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A008, October 26–28, 2021
Paper No: IPACK2021-72621
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A002, October 27–29, 2020
Paper No: IPACK2020-2528
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A006, October 27–29, 2020
Paper No: IPACK2020-2591
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A010, October 7–9, 2019
Paper No: IPACK2019-6530
Proceedings Papers

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A011, August 27–30, 2018
Paper No: IPACK2018-8436
Proceedings Papers

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A003, August 27–30, 2018
Paper No: IPACK2018-8398
Proceedings Papers

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A026, August 29–September 1, 2017
Paper No: IPACK2017-74179
Proceedings Papers

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A006, August 29–September 1, 2017
Paper No: IPACK2017-74108
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A018, July 6–9, 2015
Paper No: IPACK2015-48274
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A026, July 6–9, 2015
Paper No: IPACK2015-48430
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A010, July 6–9, 2015
Paper No: IPACK2015-48015
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A028, July 6–9, 2015
Paper No: IPACK2015-48439
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A030, July 6–9, 2015
Paper No: IPACK2015-48466
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A031, July 6–9, 2015
Paper No: IPACK2015-48470
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A023, July 6–9, 2015
Paper No: IPACK2015-48787
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A002, July 6–9, 2015
Paper No: IPACK2015-48154
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A001, July 16–18, 2013
Paper No: IPACK2013-73028
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A014, July 16–18, 2013
Paper No: IPACK2013-73183
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A015, July 16–18, 2013
Paper No: IPACK2013-73196
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A054, July 16–18, 2013
Paper No: IPACK2013-73302