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Proceedings Papers

Thermomechanical Stress and Warpage Augmentation Using Auxetic Features in Electronic Design

Mahsa Montazeri, John Harris, David R. Huitink, Adithya Venkatanarayanan, Simon S. Ang

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A011, October 7–9, 2019

Paper No: IPACK2019-6424

DOI: https://doi.org/10.1115/IPACK2019-6424

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Topics: Design, Stress, Thermomechanics, Warping, Deformation, Finite element analysis, Manufacturing, Electronic packages, Reliability, Temperature

Proceedings Papers

The Dependence of Moisture Induced Die Stresses Upon Moisture Properties of Polymer Materials in Electronic Packages

Quang Nguyen, Jeffrey C. Suhling, Richard C. Jaeger, Pradeep Lall

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A003, August 29–September 1, 2017

Paper No: IPACK2017-74273

DOI: https://doi.org/10.1115/IPACK2017-74273

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Topics: Electronic packages, Polymers, Stress, Reliability, Simulation, Weight (Mass), Absorption, Ball-Grid-Array packaging, Corrosion, Cracking (Materials)

Proceedings Papers

Thermal and Optical Performance of Eco-Friendly Silk Fibroin Proteins as a Cavity Encapsulation Over LED Systems

Sevket Umut Yuruker, Mehmet Arik, Enes Tamdogan, Rustamjon Melikov, Sedat Nizamoglu, Daniel Aaron Press, Ilkem Durak

Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A015, July 6–9, 2015

Paper No: IPACK2015-48326

DOI: https://doi.org/10.1115/IPACK2015-48326

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Topics: Cavities, Proteins, Silicones, Biomaterials, Computational fluid dynamics, Light-emitting diodes, Phosphors, Polymers, Thermal conductivity, Absorption

Proceedings Papers

Measurement and Simulation of Moisture Induced Die Stresses in Flip Chip on Laminate Assemblies

Quang Nguyen, Jordan C. Roberts, Jeffrey C. Suhling, Richard C. Jaeger, Pradeep Lall

Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A040, July 6–9, 2015

Paper No: IPACK2015-48626

DOI: https://doi.org/10.1115/IPACK2015-48626

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Topics: Flip-chip, Flip-chip devices, Laminates, Simulation, Stress, Flip-chip assemblies, Diffusion (Physics), Storage, Temperature, Absorption

Proceedings Papers

Computational Study of Behavior of Gas Absorption in Data Center Equipment and its Effects on the Rate of Corrosion/Contamination

Tejeshkumar Bagul, Kanan Pujara, Jimil Shah, Oluwaseun Awe, Dereje Agonafer

Paper No: IPACK2015-48049

DOI: https://doi.org/10.1115/IPACK2015-48049

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Topics: Absorption, Contamination, Corrosion, Data centers, Air conditioning, Gases, Reliability, Wheels, China, Circuits

Proceedings Papers

Modeling of Flow and Heat Transfer in a Molten Glass Mini-Film for High Temperature Heat Collection in a Falling-Film Solar Central Receiver

Ruth H. Reed, Justin Raade, Benjamin Elkin, Van P. Carey

Paper No: IPACK2015-48532

DOI: https://doi.org/10.1115/IPACK2015-48532

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Topics: Flow (Dynamics), Glass, Heat, Heat transfer, High temperature, Modeling, Solar energy, Temperature, Viscosity, Fluids

Proceedings Papers

Modeling and Parametric Study of Light Scattering, Absorption and Emission of Phosphor in a White Light-Emitting Diode

Jiaqi Wang, Jeffery C. C. Lo, S. W. Ricky Lee, Feng Yun, Mian Tao

Paper No: IPACK2015-48664

DOI: https://doi.org/10.1115/IPACK2015-48664

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Topics: Absorption, Emissions, Light scattering, Light-emitting diodes, Modeling, Phosphors, Wavelength, Excitation, Emission spectra, Plates (structures)

Proceedings Papers

A Hybrid Absorption Cycle for Water Heating, Dehumidification, and Evaporative Cooling

Devesh Chugh, Rasool Nasr Isfahani, Kyle Gluesenkamp, Omar Abdelaziz, Saeed Moghaddam

Paper No: IPACK2015-48816

DOI: https://doi.org/10.1115/IPACK2015-48816

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Topics: Absorption, Cycles, Dehumidification, Evaporative cooling, Hot water heating, Water, Heat, Heating, Hot water, Water vapor

Proceedings Papers

Heat Transfer in Nanoelectronics by Quantum Mechanics

Thomas Prevenslik

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A011, July 16–18, 2013

Paper No: IPACK2013-73173

DOI: https://doi.org/10.1115/IPACK2013-73173

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Topics: Heat transfer, Nanoelectronics, Quantum mechanics, Heat, Joules, Quantum electrodynamics, Circuits, Phonons, Radiation (Physics), Temperature

Proceedings Papers

Assessment of the Energy Performance of Cogeneration Systems for Powering and Cooling Data Centers

Dale C. Ringham, Dan J. Rice, Brian S. Granetz, Hamza Salih Erden, H. Ezzat Khalifa, Roger R. Schmidt

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A022, July 16–18, 2013

Paper No: IPACK2013-73268

DOI: https://doi.org/10.1115/IPACK2013-73268

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Topics: Cogeneration systems, Cooling, Data centers, Electricity (Physics), Exhaust systems, Turbines, Absorption, Combined heat and power, Heat, Heat exchangers

Proceedings Papers

High Performance Micro-Grooved Evaporative Heat Transfer Surface for Low Grade Waste Heat Recovery Applications

Vibhash Jha, Serguei Dessiatoun, Michael Ohadi, Amir Shooshtari, Ebrahim Al-Hajri

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 277-283, July 6–8, 2011

Paper No: IPACK2011-52179

DOI: https://doi.org/10.1115/IPACK2011-52179

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Topics: Heat recovery, Heat transfer, Flow (Dynamics), Heat transfer coefficients, Pressure drop, Refrigerants, Thermal management, Absorption, Cooling, Electronic products

Proceedings Papers

Fluidic Laser Beam Shaper by Using Thermal Lens Effect

Hong Duc Doan, Yoshihiko Akamine, Kazuyoshi Fushinobu

Paper No: IPACK2011-52214

DOI: https://doi.org/10.1115/IPACK2011-52214

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Topics: Laser beams, Lenses (Optics), Lasers, Pumps, Absorption, Probes, Refractive index, Optics, Temperature distribution

Proceedings Papers

Application of a Thermal Network Method to Thermal Analysis of Electronic Devices Using Phase Change Materials

Sadakazu Takakuwa, Masaru Ishizuka, Shinji Nakagawa, Kanji Takagi

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 471-477, July 19–23, 2009

Paper No: InterPACK2009-89218

DOI: https://doi.org/10.1115/InterPACK2009-89218

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Topics: Phase change materials, Thermal analysis, Fins, Temperature, Transients (Dynamics), Absorption, Cooling, Design, Electronic equipment, Energy dissipation

Proceedings Papers

Thermal Imaging of Two-Phase Coooled Microgap Channel Wall

Jessica Sheehan, Dae Whan Kim, Avram Bar-Cohen

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 491-499, July 19–23, 2009

Paper No: InterPACK2009-89238

DOI: https://doi.org/10.1115/InterPACK2009-89238

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Topics: Absorption, Coolers, Cooling, Dielectric liquids, Electronic components, Flow (Dynamics), Flux (Metallurgy), Heat, Heat flux, Imaging

Proceedings Papers

Large-Scale Stress Analyses for Fatigue Reliability at Die-Mount Solder of Plastic IC Packages

Tetsuya Kugimiya, Kenji Hirohata, Minoru Mukai, Eitaro Miyake, Hiroshi Akiba, Nobutada Ohno, Takashi Kawakami

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 185-190, July 19–23, 2009

Paper No: InterPACK2009-89384

DOI: https://doi.org/10.1115/InterPACK2009-89384

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Topics: Fatigue, Reliability, Solders, Stress analysis (Engineering), Finite element analysis, Deformation, Metals, Molding materials, Absorption, Constitutive equations

Proceedings Papers

Coupled Electro-Thermal Simulation of MOSFETs

Chunjian Ni, Zlatan Aksamija, Jayathi Y. Murthy, Umberto Ravaioli

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 161-173, July 19–23, 2009

Paper No: InterPACK2009-89182

DOI: https://doi.org/10.1115/InterPACK2009-89182

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Topics: Simulation, Phonons, Electrons, Heat, Electromagnetic scattering, Radiation scattering, Scattering (Physics), Acoustics, Anisotropy, Heat conduction

Proceedings Papers

Miniaturized Refrigeration System With Absorption: Application to Microelectronics Cooling

Victor Chiriac, Florea Chiriac

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 87-92, July 8–12, 2007

Paper No: IPACK2007-33726

DOI: https://doi.org/10.1115/IPACK2007-33726

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Topics: Absorption, Compressors, Cooling, Heat exchangers, Microelectronic devices, Refrigeration

Proceedings Papers

Thermal Degradation and Mass Transport of Underfill Material

Wen-Hao Lee, D. S. Liang, W. P. Wang, C. S. Hsiao

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 719-723, July 8–12, 2007

Paper No: IPACK2007-33057

DOI: https://doi.org/10.1115/IPACK2007-33057

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Topics: Absorption, Adhesion, Bond strength, Bonding, Chain, Cracking (Materials), Diffusion (Physics), Epoxy adhesives, Epoxy resins, Failure

Proceedings Papers

Packaging of an Iron-Gallium Nanowire Acoustic Sensor for Under-Water Applications

Rupal Jain, F. Patrick McCluskey, Alison B. Flatau

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 825-829, July 8–12, 2007

Paper No: IPACK2007-33455

DOI: https://doi.org/10.1115/IPACK2007-33455

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Topics: Acoustics, Gallium, Iron, Nanowires, Packaging, Sensors, Water, Waves, Absorption, Ear

Proceedings Papers

Design of an Absorption Based Miniature Heat Pump System for Cooling of High Power Microprocessors

Yoon Jo Kim, Yogendra K. Joshi, Andrei G. Fedorov

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 69-77, July 8–12, 2007

Paper No: IPACK2007-33245

DOI: https://doi.org/10.1115/IPACK2007-33245

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Topics: Absorption, Cooling, Design, Heat pumps, Condensers (steam plant), Microchannels, Fluids, Temperature, Water vapor, Compression

NARROW

Thermomechanical Stress and Warpage Augmentation Using Auxetic Features in Electronic Design

The Dependence of Moisture Induced Die Stresses Upon Moisture Properties of Polymer Materials in Electronic Packages

Thermal and Optical Performance of Eco-Friendly Silk Fibroin Proteins as a Cavity Encapsulation Over LED Systems

Measurement and Simulation of Moisture Induced Die Stresses in Flip Chip on Laminate Assemblies

Computational Study of Behavior of Gas Absorption in Data Center Equipment and its Effects on the Rate of Corrosion/Contamination

Modeling of Flow and Heat Transfer in a Molten Glass Mini-Film for High Temperature Heat Collection in a Falling-Film Solar Central Receiver

Modeling and Parametric Study of Light Scattering, Absorption and Emission of Phosphor in a White Light-Emitting Diode

A Hybrid Absorption Cycle for Water Heating, Dehumidification, and Evaporative Cooling

Heat Transfer in Nanoelectronics by Quantum Mechanics

Assessment of the Energy Performance of Cogeneration Systems for Powering and Cooling Data Centers

High Performance Micro-Grooved Evaporative Heat Transfer Surface for Low Grade Waste Heat Recovery Applications

Fluidic Laser Beam Shaper by Using Thermal Lens Effect

Application of a Thermal Network Method to Thermal Analysis of Electronic Devices Using Phase Change Materials

Thermal Imaging of Two-Phase Coooled Microgap Channel Wall

Large-Scale Stress Analyses for Fatigue Reliability at Die-Mount Solder of Plastic IC Packages

Coupled Electro-Thermal Simulation of MOSFETs

Miniaturized Refrigeration System With Absorption: Application to Microelectronics Cooling

Thermal Degradation and Mass Transport of Underfill Material

Packaging of an Iron-Gallium Nanowire Acoustic Sensor for Under-Water Applications

Design of an Absorption Based Miniature Heat Pump System for Cooling of High Power Microprocessors

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