Alpha emission from packaging materials is one of the major contributors for soft errors. Because of these materials’ immediate contact or close proximity to active areas of the silicon, even small increase in alpha emissivity may have significant impact on the performance of the device. In this work, we present the analytical steps to identify materials and manufacturing steps that caused high soft error rates for flip chip devices. We will also present some experimental results to highlight the impact of assembly process control. The results from these studies suggest that to minimize the impact of alpha emission from packaging materials, material set selection and assembly process control must be addressed simultaneously to ensure robust device performance.

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