This paper describes the two key aspects of via transition optimization methodology: impedance matching and power plane resonance suppression. Ground vias are used to improve the impedance mismatch caused by the via transition and the optimal location of the ground vias at the same time helps to suppress the resonance caused by the cavity effect of the power plane pair. Full-wave electromagnetic simulations were carried out to demonstrate that via transition optimization is able achieve resonance-free high bandwidth operation. Optimal use of ground vias will not only enhance impedance matching but also significantly suppress suppression due to power plane resonance. Test vehicle characterizations were also carried out to demonstrate the impact of ground vias and power plane resonance characteristics on signal integrity.
- Electronic and Photonic Packaging Division
Design Optimization of Via Transitions for Broadband Applications
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Lu, ACW, Fan, W, Wai, LL, Jin, L, & Low, LA. "Design Optimization of Via Transitions for Broadband Applications." Proceedings of the ASME 2003 International Electronic Packaging Technical Conference and Exhibition. 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1. Maui, Hawaii, USA. July 6–11, 2003. pp. 17-23. ASME. https://doi.org/10.1115/IPACK2003-35154
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