Multilayer packages are extensively used and designed in high-speed and wireless applications. An approach to achieve the controlled S-parameters with 15% less degradation than the original multilayer package design at 5 GHz was presented. The substrate dimension budget was determined to meet the manufacturing capability using 3-D full wave simulator. Controlling the return loss is the domination of the overall controlled S-parameters.
- Electronic and Photonic Packaging Division
Controlled S-Parameters on Multi-Layer Package
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Chen, N, Chiang, K, Wang, YP, & Hsiao, CS. "Controlled S-Parameters on Multi-Layer Package." Proceedings of the ASME 2003 International Electronic Packaging Technical Conference and Exhibition. 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1. Maui, Hawaii, USA. July 6–11, 2003. pp. 11-15. ASME. https://doi.org/10.1115/IPACK2003-35125
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