Multilayer packages are extensively used and designed in high-speed and wireless applications. An approach to achieve the controlled S-parameters with 15% less degradation than the original multilayer package design at 5 GHz was presented. The substrate dimension budget was determined to meet the manufacturing capability using 3-D full wave simulator. Controlling the return loss is the domination of the overall controlled S-parameters.
Volume Subject Area:
Electrical Design, Simulation, and Test
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by ASME
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