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Proceedings Papers

ASME 2007 InterPACK Conference, Volume 2

Underfill and Encapsulant Effects on Package Reliability

InterPACK 2007; 9-12doi:https://doi.org/10.1115/IPACK2007-33562
InterPACK 2007; 13-19doi:https://doi.org/10.1115/IPACK2007-33591

Liquid Cooling of Electronic Systems

InterPACK 2007; 21-28doi:https://doi.org/10.1115/IPACK2007-33051
InterPACK 2007; 29-43doi:https://doi.org/10.1115/IPACK2007-33329
InterPACK 2007; 45-57doi:https://doi.org/10.1115/IPACK2007-33416

Low Temperature Refrigeration Cooling Techniques

InterPACK 2007; 59-68doi:https://doi.org/10.1115/IPACK2007-33235
InterPACK 2007; 69-77doi:https://doi.org/10.1115/IPACK2007-33245
InterPACK 2007; 79-86doi:https://doi.org/10.1115/IPACK2007-33684
InterPACK 2007; 87-92doi:https://doi.org/10.1115/IPACK2007-33726

Solder Materials and Reliability

InterPACK 2007; 93-98doi:https://doi.org/10.1115/IPACK2007-33457
InterPACK 2007; 99-105doi:https://doi.org/10.1115/IPACK2007-33603
InterPACK 2007; 107-113doi:https://doi.org/10.1115/IPACK2007-33663
InterPACK 2007; 115-120doi:https://doi.org/10.1115/IPACK2007-33703
InterPACK 2007; 121-127doi:https://doi.org/10.1115/IPACK2007-33891

Device Level Thermal Models

InterPACK 2007; 129-134doi:https://doi.org/10.1115/IPACK2007-33086
InterPACK 2007; 143-149doi:https://doi.org/10.1115/IPACK2007-33585

Drop Testing of Electronic Devices

InterPACK 2007; 151-155doi:https://doi.org/10.1115/IPACK2007-33074
InterPACK 2007; 157-165doi:https://doi.org/10.1115/IPACK2007-33251
InterPACK 2007; 167-172doi:https://doi.org/10.1115/IPACK2007-33345
InterPACK 2007; 173-178doi:https://doi.org/10.1115/IPACK2007-33738
InterPACK 2007; 179-197doi:https://doi.org/10.1115/IPACK2007-33872

Solid State Power Generation and Cooling for Electronic Packaging and Systems

InterPACK 2007; 199-203doi:https://doi.org/10.1115/IPACK2007-33154
InterPACK 2007; 205-212doi:https://doi.org/10.1115/IPACK2007-33281
InterPACK 2007; 213-220doi:https://doi.org/10.1115/IPACK2007-33285
InterPACK 2007; 221-228doi:https://doi.org/10.1115/IPACK2007-33367
InterPACK 2007; 229-233doi:https://doi.org/10.1115/IPACK2007-33369
InterPACK 2007; 235-240doi:https://doi.org/10.1115/IPACK2007-33688
InterPACK 2007; 241-247doi:https://doi.org/10.1115/IPACK2007-33763
InterPACK 2007; 249-258doi:https://doi.org/10.1115/IPACK2007-33798
InterPACK 2007; 259-263doi:https://doi.org/10.1115/IPACK2007-33875
InterPACK 2007; 265-275doi:https://doi.org/10.1115/IPACK2007-33878
InterPACK 2007; 277-281doi:https://doi.org/10.1115/IPACK2007-33880
InterPACK 2007; 283-290doi:https://doi.org/10.1115/IPACK2007-33940

Two-Phase Heat Transfer in Electronics Cooling

InterPACK 2007; 291-299doi:https://doi.org/10.1115/IPACK2007-33075
InterPACK 2007; 301-306doi:https://doi.org/10.1115/IPACK2007-33260
InterPACK 2007; 307-319doi:https://doi.org/10.1115/IPACK2007-33331
InterPACK 2007; 321-328doi:https://doi.org/10.1115/IPACK2007-33423
InterPACK 2007; 329-334doi:https://doi.org/10.1115/IPACK2007-33471
InterPACK 2007; 335-346doi:https://doi.org/10.1115/IPACK2007-33517
InterPACK 2007; 347-358doi:https://doi.org/10.1115/IPACK2007-33602
InterPACK 2007; 359-373doi:https://doi.org/10.1115/IPACK2007-33620
InterPACK 2007; 375-380doi:https://doi.org/10.1115/IPACK2007-33833
InterPACK 2007; 381-388doi:https://doi.org/10.1115/IPACK2007-33846
InterPACK 2007; 389-398doi:https://doi.org/10.1115/IPACK2007-33927

Solder Material Processing

InterPACK 2007; 399-405doi:https://doi.org/10.1115/IPACK2007-33420
InterPACK 2007; 407-413doi:https://doi.org/10.1115/IPACK2007-33701
InterPACK 2007; 415-421doi:https://doi.org/10.1115/IPACK2007-33988

Package Level Thermal Models

InterPACK 2007; 423-428doi:https://doi.org/10.1115/IPACK2007-33103
InterPACK 2007; 429-435doi:https://doi.org/10.1115/IPACK2007-33280
InterPACK 2007; 437-444doi:https://doi.org/10.1115/IPACK2007-33336
InterPACK 2007; 445-449doi:https://doi.org/10.1115/IPACK2007-33796

Packaging Stress Test Methods

InterPACK 2007; 451-464doi:https://doi.org/10.1115/IPACK2007-33053
InterPACK 2007; 465-472doi:https://doi.org/10.1115/IPACK2007-33212
InterPACK 2007; 473-479doi:https://doi.org/10.1115/IPACK2007-33402
InterPACK 2007; 481-492doi:https://doi.org/10.1115/IPACK2007-33548

Technologies for High Heat Flux Applications

InterPACK 2007; 493-500doi:https://doi.org/10.1115/IPACK2007-33156
InterPACK 2007; 501-507doi:https://doi.org/10.1115/IPACK2007-33637
InterPACK 2007; 509-515doi:https://doi.org/10.1115/IPACK2007-33870

Polymers for Advanced Packaging

InterPACK 2007; 517-524doi:https://doi.org/10.1115/IPACK2007-33419
InterPACK 2007; 525-531doi:https://doi.org/10.1115/IPACK2007-33440
InterPACK 2007; 533-540doi:https://doi.org/10.1115/IPACK2007-33939

Heat Sinks, Fans, Plates and Fins

InterPACK 2007; 541-546doi:https://doi.org/10.1115/IPACK2007-33036
InterPACK 2007; 547-554doi:https://doi.org/10.1115/IPACK2007-33054
InterPACK 2007; 555-564doi:https://doi.org/10.1115/IPACK2007-33306
InterPACK 2007; 565-570doi:https://doi.org/10.1115/IPACK2007-33553

Nano and Micro Flow

InterPACK 2007; 571-580doi:https://doi.org/10.1115/IPACK2007-33410
InterPACK 2007; 581-587doi:https://doi.org/10.1115/IPACK2007-33698
InterPACK 2007; 589-594doi:https://doi.org/10.1115/IPACK2007-33768
InterPACK 2007; 595-601doi:https://doi.org/10.1115/IPACK2007-33838

Assessments of Interconnect Reliability

InterPACK 2007; 603-610doi:https://doi.org/10.1115/IPACK2007-33077
InterPACK 2007; 611-615doi:https://doi.org/10.1115/IPACK2007-33264

Thermal Analysis of Electronic Packages and Substrates

InterPACK 2007; 617-623doi:https://doi.org/10.1115/IPACK2007-33045
InterPACK 2007; 625-630doi:https://doi.org/10.1115/IPACK2007-33263
InterPACK 2007; 631-636doi:https://doi.org/10.1115/IPACK2007-33372
InterPACK 2007; 637-643doi:https://doi.org/10.1115/IPACK2007-33425
InterPACK 2007; 645-652doi:https://doi.org/10.1115/IPACK2007-33605
InterPACK 2007; 653-661doi:https://doi.org/10.1115/IPACK2007-33606
InterPACK 2007; 663-670doi:https://doi.org/10.1115/IPACK2007-33626
InterPACK 2007; 671-677doi:https://doi.org/10.1115/IPACK2007-33844
InterPACK 2007; 679-685doi:https://doi.org/10.1115/IPACK2007-33982

Modeling and Analysis for Advanced Packaging

InterPACK 2007; 687-692doi:https://doi.org/10.1115/IPACK2007-33262
InterPACK 2007; 693-701doi:https://doi.org/10.1115/IPACK2007-33368
InterPACK 2007; 703-709doi:https://doi.org/10.1115/IPACK2007-33900
InterPACK 2007; 711-717doi:https://doi.org/10.1115/IPACK2007-33967

Packaging Material Processing

InterPACK 2007; 719-723doi:https://doi.org/10.1115/IPACK2007-33057
InterPACK 2007; 725-728doi:https://doi.org/10.1115/IPACK2007-33148
InterPACK 2007; 729-734doi:https://doi.org/10.1115/IPACK2007-33197
InterPACK 2007; 735-741doi:https://doi.org/10.1115/IPACK2007-33261
InterPACK 2007; 743-748doi:https://doi.org/10.1115/IPACK2007-33906

Investigation of Heat Transfer Mechanisms

InterPACK 2007; 749-755doi:https://doi.org/10.1115/IPACK2007-33142
InterPACK 2007; 757-766doi:https://doi.org/10.1115/IPACK2007-33221
InterPACK 2007; 767-772doi:https://doi.org/10.1115/IPACK2007-33252
InterPACK 2007; 773-781doi:https://doi.org/10.1115/IPACK2007-33296
InterPACK 2007; 783-790doi:https://doi.org/10.1115/IPACK2007-33335
InterPACK 2007; 791-799doi:https://doi.org/10.1115/IPACK2007-33576
InterPACK 2007; 801-809doi:https://doi.org/10.1115/IPACK2007-33641
InterPACK 2007; 811-818doi:https://doi.org/10.1115/IPACK2007-33708
InterPACK 2007; 819-824doi:https://doi.org/10.1115/IPACK2007-33765

Evaluation of Nano and Micro Structures

InterPACK 2007; 825-829doi:https://doi.org/10.1115/IPACK2007-33455
InterPACK 2007; 831-838doi:https://doi.org/10.1115/IPACK2007-33717
InterPACK 2007; 839-842doi:https://doi.org/10.1115/IPACK2007-33827

Package Reliability

InterPACK 2007; 843-848doi:https://doi.org/10.1115/IPACK2007-33217
InterPACK 2007; 849-854doi:https://doi.org/10.1115/IPACK2007-33237
InterPACK 2007; 855-861doi:https://doi.org/10.1115/IPACK2007-33242
InterPACK 2007; 863-872doi:https://doi.org/10.1115/IPACK2007-33592
InterPACK 2007; 873-882doi:https://doi.org/10.1115/IPACK2007-33687
InterPACK 2007; 883-888doi:https://doi.org/10.1115/IPACK2007-33817
InterPACK 2007; 889-894doi:https://doi.org/10.1115/IPACK2007-33933

Convection Cooling in Electronic Equipment

InterPACK 2007; 895-907doi:https://doi.org/10.1115/IPACK2007-33248
InterPACK 2007; 909-916doi:https://doi.org/10.1115/IPACK2007-33277
InterPACK 2007; 917-924doi:https://doi.org/10.1115/IPACK2007-33278
InterPACK 2007; 925-931doi:https://doi.org/10.1115/IPACK2007-33356

Bio/Organic Devices and Packaging

InterPACK 2007; 933-938doi:https://doi.org/10.1115/IPACK2007-33332
InterPACK 2007; 939-946doi:https://doi.org/10.1115/IPACK2007-33404
InterPACK 2007; 947-953doi:https://doi.org/10.1115/IPACK2007-33448
InterPACK 2007; 955-959doi:https://doi.org/10.1115/IPACK2007-33482

Nano and Bio Materials and Sensors

InterPACK 2007; 961-964doi:https://doi.org/10.1115/IPACK2007-33259
InterPACK 2007; 965-969doi:https://doi.org/10.1115/IPACK2007-33312
InterPACK 2007; 971-977doi:https://doi.org/10.1115/IPACK2007-33501
InterPACK 2007; 979-984doi:https://doi.org/10.1115/IPACK2007-33505

Nanoscale Heat Tranfer

InterPACK 2007; 985-991doi:https://doi.org/10.1115/IPACK2007-33069
InterPACK 2007; 993-998doi:https://doi.org/10.1115/IPACK2007-33293
InterPACK 2007; 999-1005doi:https://doi.org/10.1115/IPACK2007-33422
InterPACK 2007; 1007-1017doi:https://doi.org/10.1115/IPACK2007-33431

Thermal Challenges for the Next Generation of PC Equipment

InterPACK 2007; 1019-1027doi:https://doi.org/10.1115/IPACK2007-33407
InterPACK 2007; 1029-1032doi:https://doi.org/10.1115/IPACK2007-33506
InterPACK 2007; 1033-1040doi:https://doi.org/10.1115/IPACK2007-33793
InterPACK 2007; 1041-1047doi:https://doi.org/10.1115/IPACK2007-33873
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