... Abstract Respiratory gas analyzers to measure functions such as ventilation volume respiratory rate are expensive, and patients with severe motor and intellectual disabilities (SMID) often remove the devices, increasing contact risk and making them difficult to use in institutions. We propose...

... displacement data from tracked phototarget data. For the scaling method, the expanded uncertainty of measuring the phototarget size ranged from ±2.6 to ±3.7 pixels at a 95% confidence level. For the seat origin translation method, the average difference between calculated and actual seat origins was 6.6±5.0 cm...

... Abstract This paper describes a new electromagnetic contact sensing technique called the “Fine Touch” method which enables the cutting tool itself to be used as a probe during on-machine measurement of parts. The simple sensor design of the probe (the cutting tool) has resulted in a low cost...

...Abstract Abstract When the geometry of a non-rigid part or pre-assembly is measured fully clamped (over-constrained) in a measurement fixture, the spring-back information and influence from gravity forces are usually lost in the collected data. From the 3D-measurement data, it is hard...

... that can measure its self-acceleration, angular velocity, and quaternions to collect human movement data continuously for long-term. Additionally, we collected the arm movement data of 30 participants using the developed device. The participants of this study carried on with their normal lives...

...BEAUTIFUL MUSIC IN THE CLASSROOM: MARIMBA AS A LAB EXPERIMENT FOR TEACHING VIBRATION MEASUREMENT Mathew Schaefer1 Milwaukee School of Engineering Milwaukee, WI ABSTRACT A marimba bar makes a rich and vibrant sound when played by a skilled musician. When that same marimba bar is played...

... 07 07 2010 In the present work, a prototype machine was developed for film thickness measurement for tribological tests. The configuration of the machine was based Block on Ring (BOR) technique. In the current machine, frictional forces and film thickness were measured using load cell...

... pad is one of the critical factors in planarizing wafer surfaces and its properties play critical roles in polishing. However, pad properties change during the process. This paper reviews the measurement methods for thickness, hardness, and Young’s modulus of polishing pads. Chemical mechanical...

... during the compression process to calculate the air pressure in the vane segments. The air pressure was used with Newton’s law to calculate loads acting on bearings and vanes. A compressor and experimental setup were also built to measure the radial load acting on the bearings. The measured load acting...

... 13 05 2008 This paper presents a new technique for measuring the non-uniformity of circumferential distribution of fuel by means of laser transmission beam for fuel nozzle. Using this technique, the physical and mathematical relationships have been developed and validated...

... inserted into the cover plate of the ressor to measure air pressures in the vane segments. paring the signals of the encoder with pressure transducers, ir pressures in completions of suction and compression s could be determined in stable or unstable rotational s. The air pressures when the compressor...

... and heat dissipation. Solder balls underneath die area, usually called thermal balls, is a key design that can affect the thermal performance of BGA type packages. QFN package November 5-11, 2005, rlando, Florida USA IMECE2005-82247 thermal test conditions of both simulation and measurement follow JEDEC 51...

..., by using the measurement and analysis system, we measured the sound pressures levels and their curves the noise of a military diesel engine, then made spectral analysis and coherence analysis. The results provide bases for low noise design of this diesel engine. diesel engine noise characteristics...

.... thermoelectrics nanowires measurement Li D. , Huxtable S. , Abramson A. , Majumdar A. , 2005 , “ Thermal Transport in Nanostructured Solid-State Cooling Devices ,” Journal of Heat Transfer , 127 , pp. 108 – 114 . Shakouri A. , Zhang Y. , 2005 , “ On-Chip Solid-State...